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    • 7. 发明授权
    • Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility
    • 具有集成滑块的BGA IC器件的老化插座,具有完全的球栅兼容性
    • US07318736B1
    • 2008-01-15
    • US11463114
    • 2006-08-08
    • Prasanth Ambady
    • Prasanth Ambady
    • H01R13/62
    • G01R31/2863G01R1/0483H01R13/193
    • A slider 24 that integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Slider 24 has a top wall surface 14b formed with a plurality of apertures in a grid array defined by intersecting ribs 14e, 14f. A plurality of wall extension portions 14h are formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC device 2 adapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals 2a. Anti-stick fingers 24c extend in the x-direction from wall extension portions 24b along a y-direction rib defining the outer limit of the first column 14s of apertures of the main grid. A concave surface 24d is formed in each finger facing wall portions 24b and the height of wall portions 24b is limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical support ball positioned in the first column of apertures next to wall extension portion 24b outside the main grid field to provide full grid array capability.
    • 显示了集成适配器对准和防粘特性的滑块24用于安装用于老化测试的BGA型IC器件的插座。 滑块24具有形成有由相交肋14e,14f限定的网格阵列中的多个孔的顶壁表面14b。 多个壁延伸部分14h形成为从用作微细对准特征的x方向肋的部分向上延伸,IC器件2适于放置在IC器件的行之间的壁延伸部分的平坦顶端表面上 焊球端子2 a。 防粘指状物24c沿着限定主栅格的第一列14的外部极限的y方向的肋沿壁向延伸部分24b沿x方向延伸。 在每个面向指尖的壁部分24b中形成凹面24d,并且壁部分24b的高度被限制在安装在插座中的IC装置的焊球的位置下方的位置,以提供机械支撑球的间隙 位于主栅格外部的壁延伸部分24b的第一列孔中,以提供完整的栅格阵列能力。