会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Electrostatic discharge failure avoidance through interaction between floorplanning and power routing
    • 通过布局规划和电源布线之间的相互作用来避免静电放电故障
    • US07496877B2
    • 2009-02-24
    • US11202275
    • 2005-08-11
    • Andrew D. HuberCiaran J. BrennanPaul E. DunnScott W. GouldLin LinErich C. Schanzenbach
    • Andrew D. HuberCiaran J. BrennanPaul E. DunnScott W. GouldLin LinErich C. Schanzenbach
    • G06F17/50
    • G06F17/5068
    • An integrated system and method to achieve ESD robustness on an integrated circuit (IC) in a fully automated ASIC design environment is described. Electrical characteristics and electrical limits on the power network are translated to power route region constraints for each chip input/output (I/O) cell. Electrical limits on the signal network are translated into signal route region constraints for each chip I/O cell. These constraints are passed on to an I/O floorplanner (automatic placer of I/O cells) that analyzes trade-offs between these constraints. For I/O cells that can not be placed to satisfy both power and signal region constraints, the I/O floorplanner utilizes the knowledge of alternative power distribution structures to group I/Os and create local power grid structures that have the effect of relaxing the power region constraints. Instructions for creating these local power grid structures are passed on to the automatic power routing tool.
    • 描述了在完全自动化ASIC设计环境中实现集成电路(IC)上ESD稳定性的集成系统和方法。 电力网络上的电气特性和电气限制被转换为每个芯片输入/输出(I / O)单元的功率路由区域约束。 信号网络上的电气限制被转换为每个芯片I / O单元的信号路由区域约束。 这些约束被传递到分析这些限制之间的权衡的I / O平面布局(I / O单元的自动放置器)。 对于不能放置以满足功率和信号区域约束的I / O单元,I / O平面布置器利用替代功率分配结构的知识来分组I / O,并创建具有放松效果的局部电网结构 功率区域约束。 创建这些局部电网结构的说明将传递给自动电力布线工具。
    • 10. 发明授权
    • Method and apparatus for manufacturing diamond shaped chips
    • 用于制造菱形芯片的方法和装置
    • US07961932B2
    • 2011-06-14
    • US11865728
    • 2007-10-01
    • Robert J. AllenJohn M. CohnScott W. GouldPeter A. HabitzJuergen KoehlGustavo E. TellezIvan L. WemplePaul S. Zuchowski
    • Robert J. AllenJohn M. CohnScott W. GouldPeter A. HabitzJuergen KoehlGustavo E. TellezIvan L. WemplePaul S. Zuchowski
    • G06K9/00
    • H01L27/0207
    • In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.
    • 在第一方面中,用于对晶片上的芯片进行成像的本发明的装置包括具有多个倾斜侧面的组合金刚石芯片图像和切口图像。 组合的金刚石芯片图像和切口图像包括金刚石芯片图像,其包括与金刚石芯片图像的至少一个对角线平行的多个芯片图像行,并且包括与金刚石芯片图像相邻的切痕图像。 切口图像包括平行于金刚石切片图像的至少一个对角线的至少一个切痕图像行。 该装置还包括从组合的金刚石片图像和切痕图像延伸到步进器的曝光场的至少周边的阻挡材料。 在第二方面,成像装置包括n侧多边形组合芯片图像和切口图像。 还提供了制造芯片的创造性方法和根据本发明方法制造的晶片。