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    • 5. 发明授权
    • Loop heat pipe for mobile computers
    • 循环热管用于移动电脑
    • US06381135B1
    • 2002-04-30
    • US09814078
    • 2001-03-20
    • Ravi PrasherDave Payne
    • Ravi PrasherDave Payne
    • H05K720
    • F28D15/043
    • A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The separation of the vapor space, and the wick structure of the liquid space, ensures that the vapor space will not be distorted or clogged by the wick structure. The heat transfer device can be bent to meet design criteria without distorting the width or radius of the vapor space. In one embodiment of the present invention the evaporator, condenser, and liquid space have different types of wick structure. Another embodiment of the present invention, the vapor space of the loop heat pipe has uniform thickness. The loop heat pipe device of the present invention provides reduced evaporator and condenser resistance and increased burn out flux, thereby increasing the power handling capacity of the device.
    • 一种用于移动计算机系统的传热装置,其使用回路热管,所述回路热管的蒸发器耦合到所述处理器管芯。 蒸汽空间和液体空间被分离。 蒸汽空间的分离和液体空间的芯体结构确保了蒸汽空间不会被灯芯结构扭曲或堵塞。 传热装置可以弯曲以满足设计准则,而不会使蒸气空间的宽度或半径变形。 在本发明的一个实施例中,蒸发器,冷凝器和液体空间具有不同类型的芯结构。 本发明的另一个实施例,环形热管的蒸气空间具有均匀的厚度。 本发明的回路热管装置提供降低的蒸发器和冷凝器电阻以及增加的烧坏通量,从而增加装置的功率处理能力。