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    • 1. 发明授权
    • Plasma etching
    • 等离子体蚀刻
    • US06933242B1
    • 2005-08-23
    • US10018809
    • 2000-06-21
    • Anand SrinivasanCarl-Fredrik CarlstromGunnar Landgren
    • Anand SrinivasanCarl-Fredrik CarlstromGunnar Landgren
    • H05H1/46H01L21/302H01L21/306H01L21/3065
    • H01L21/30621
    • A substrate whose elemental constituents are selected from Groups III and V of the Periodic Table, is provided with pre-defined masked regions. Etching of the substrate comprising the steps of: a) forming a gas containing molecules having at least one methyl group (CH3) linked to nitrogen into a plasma; and b) etching the unmasked regions of the substrate by means of the plasma. For a substrate whose elemental constituents are selected from Groups II and VI of the Periodic Table, the plasma etching gas used is trimethylamine. Since the methyl compound of nitrogen has a lower bond energy than for hydrocarbon mixtures, free methyl radicals are easier to obtain and the gas is more efficient as a methyl source. In addition, compared with hydrocarbon mixtures, reduced polymer formation can be expected due to preferential formation of methyl radicals over polymer-generating hydrocarbon radicals because of the lower bond energy for the former.
    • 其元素组分选自元素周期表的III和Ⅴ族的衬底,其具有预定义的掩模区域。 底物的蚀刻包括以下步骤:a)形成含有与氮连接的至少一个甲基(CH 3 3 N)的分子的气体至等离子体中; 和b)通过等离子体蚀刻衬底的未掩模区域。 对于其元素成分选自元素周期表II和VI族的基底,所用的等离子体蚀刻气体是三甲胺。 由于氮的甲基化合物具有比对于烃混合物更低的键能,所以游离甲基自由基更容易获得,并且气体作为甲基源更有效。 此外,与烃混合物相比,由于优先生成甲基自由基而产生聚合物的烃基,因为可以预期降低聚合物的形成,因为前者具有较低的键能。