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1. 发明授权

US10802166B2 Detector array for a radiation system, and related system 有权
公开(公告)号：US10802166B2
公开(公告)日：2020-10-13
申请号：US16378168
申请日：2019-04-08
申请人： Analogic Corporation
发明人： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher David Tibbetts
IPC分类号： G01T1/20 , G01T7/00 , H05K1/02 , H01L27/146
摘要： A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

2. 发明授权

US10254421B2 Detector array for radiation system 有权
公开(公告)号：US10254421B2
公开(公告)日：2019-04-09
申请号：US15566252
申请日：2015-09-18
申请人： ANALOGIC CORPORATION
发明人： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher Tibbetts
IPC分类号： G01T1/20 , G01T7/00 , H01L27/146
摘要： A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

3. 发明授权

US10007008B2 Detector unit for detector array of radiation imaging modality 有权
公开(公告)号：US10007008B2
公开(公告)日：2018-06-26
申请号：US14907611
申请日：2013-07-26
申请人： ANALOGIC CORPORATION
发明人： Randy Luhta , Daniel Abenaim , Martin Choquette , Ruvin Deych , Chris Vrettos
IPC分类号： G01T1/24 , H01L27/146 , G01T1/20
CPC分类号： G01T1/244 , G01T1/2018 , H01L27/14618 , H01L27/14661 , H01L2224/16225
摘要： Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

4. 发明申请

US20190235099A1 DETECTOR ARRAY FOR A RADIATION SYSTEM, AND RELATED SYSTEM 审中-公开
公开(公告)号：US20190235099A1
公开(公告)日：2019-08-01
申请号：US16378168
申请日：2019-04-08
申请人： Analogic Corporation
发明人： Randy Luhta , Lane Marsden , Ruvin Deych , Jeffrey Greenwald , Martin Choquette , Christopher David Tibbetts
IPC分类号： G01T7/00 , G01T1/20
摘要： A detector array for a radiation system includes a radiation detection sub-assembly, a routing sub-assembly, and an electronics sub-assembly. The routing sub-assembly is disposed between the radiation detection sub-assembly and the electronics sub-assembly and includes one or more layers of shielding material. For example, the routing sub-assembly may include a printed circuit board having embedded therein a shielding material configured to shield the electronics sub-assembly from at least some radiation. In some embodiments, the shielding material defines at least one opening through which a conductive element(s) passes to deliver signals between the radiation detection sub-assembly and the electronics sub-assembly.

5. 发明授权

US10090072B2 Three-dimensional metal printing 有权
公开(公告)号：US10090072B2
公开(公告)日：2018-10-02
申请号：US14588641
申请日：2015-01-02
申请人： Analogic Corporation
发明人： Ruvin Deych , Daniel Abenaim
IPC分类号： B22F3/11 , G21K1/00 , G21K1/02 , B22F3/00 , B29C70/58 , B29C64/141 , B41M3/00 , B33Y10/00 , B29K103/06 , B29K505/08 , B29L11/00 , B29L31/34 , B29L31/00
摘要： One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.

6. 发明申请

US20170248705A1 INDIRECT CONVERSION DETECTOR ARRAY 审中-公开
公开(公告)号：US20170248705A1
公开(公告)日：2017-08-31
申请号：US15519569
申请日：2014-10-16
申请人： Analogic Corporation
发明人： Ruvin Deych , Andrew Litvin , Vladan Ristanovic
IPC分类号： G01T1/20 , A61B6/03 , A61B6/00 , G01N23/04
CPC分类号： G01T1/2018 , A61B6/032 , A61B6/4208 , G01N23/046 , G01N2223/501 , G01N2223/505
摘要： Among other things, a detector array (300) for a radiation imaging system is provided. The detector array comprises a plurality of detector elements. Respective detector elements comprise, among other things, a scintillator (304) and a photodetector (306). In some embodiments, a scintillator is shared amongst two or more of the detector elements. In some embodiments, little to no reflective material, configured to mitigate cross-talk between detector elements, is situated between two or more detector elements.

7. 发明申请

US20150115494A1 THREE-DIMENSIONAL METAL PRINTING 审中-公开
标题翻译：三维金属印刷
公开(公告)号：US20150115494A1
公开(公告)日：2015-04-30
申请号：US14588641
申请日：2015-01-02
申请人： Analogic Corporation
发明人： Ruvin Deych , Daniel Abenaim
IPC分类号： B29C67/00 , B29C70/58
CPC分类号： G21K1/00 , B22F3/008 , B29C64/141 , B29C70/58 , B29K2103/06 , B29K2505/08 , B29L2011/00 , B29L2031/34 , B29L2031/737 , B33Y10/00 , B41M3/00 , G21K1/025
摘要： One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.
摘要翻译：描述了一种或多种金属印刷技术，用于产生三维金属结构，例如一维或二维防散射网格。这些技术包括将粉末状金属薄层施加到打印区域上并使用粘结剂（根据指定图案印刷在印刷区域上）将粉末状金属颗粒结合在一起。施加粉末金属和粘合剂的动作可以重复多次，直到产生具有特定高度的三维金属结构。此外，在一个实施方案中，一旦层叠完成，将另一粘合剂施加到一个或多个层以提供强度和/或支撑。虽然在一些实施方案中可以使用热来活化一种或多种所施加的粘合剂，但是三维金属结构通常不被加热到粉末状金属的熔点。

8. 发明授权

US10761219B2 Detector array for radiation imaging modality 有权
公开(公告)号：US10761219B2
公开(公告)日：2020-09-01
申请号：US15781252
申请日：2015-12-28
申请人： ANALOGIC CORPORATION
发明人： Ruvin Deych , Martin Choquette , Christopher David Tibbetts
IPC分类号： G01T1/20 , G01T1/24 , A61B6/00
摘要： A dual-energy detector array for a radiation system is provided. The dual-energy detector array includes a circuit board assembly having a first side and a second side. A first conversion package is coupled to the first side of the circuit board assembly and has a first effective photon energy. A second conversion package is coupled to the second side of the circuit board assembly and has a second effective photon energy different than the first effective photon energy. A radiation filtering material is disposed within the circuit board assembly between the first conversion package and the second conversion package. The radiation filtering material attenuates at least some of the radiation photons impinging thereon.

9. 发明授权

US10539687B2 Indirect conversion detector array 有权
公开(公告)号：US10539687B2
公开(公告)日：2020-01-21
申请号：US15519569
申请日：2014-10-16
申请人： Analogic Corporation
发明人： Ruvin Deych , Andrew Litvin , Vladan Ristanovic
IPC分类号： A61B6/03 , A61B6/00 , G01T1/20 , G01N23/046
摘要： Among other things, a detector array (300) for a radiation imaging system is provided. The detector array comprises a plurality of detector elements. Respective detector elements comprise, among other things, a scintillator (304) and a photodetector (306). In some embodiments, a scintillator is shared amongst two or more of the detector elements. In some embodiments, little to no reflective material, configured to mitigate cross-talk between detector elements, is situated between two or more detector elements.

10. 发明授权

US10181493B2 Radiation detector system of radiation imaging modality 有权
公开(公告)号：US10181493B2
公开(公告)日：2019-01-15
申请号：US15549249
申请日：2015-02-06
申请人： ANALOGIC CORPORATION
发明人： Daniel Abenaim , Randy Luhta , Ruvin Deych , Andrew Litvin
IPC分类号： G01T1/20 , H01L27/146
摘要： Among other things, a detection assembly of a radiation detector system is provided. In some embodiments, the detection assembly comprises a plurality of detector elements. Respective detector elements include a scintillator array, a photodetector array supporting the scintillator array on a first side of the photodetector array, and an electrical contact disposed on a second side of the photodetector array. In some embodiments, the detection assembly includes a printed circuit board. The electrical contact of respective detector elements is bonded to the printed circuit board to physically and electrically couple respective detector elements to the printed circuit board. A method of fabricating a detection assembly of a radiation detector system is also provided.

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