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1. 发明申请

US20140335735A1 HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR 有权
标题翻译：高速，高密度电气连接器
公开(公告)号：US20140335735A1
公开(公告)日：2014-11-13
申请号：US14445957
申请日：2014-07-29
申请人： Amphenol Corporation
发明人： Thomas S. Cohen , Huilin Ren , Marc B. Carter, JR. , Trent K. Do , Mark W. Gailus
IPC分类号： H01R13/04
CPC分类号： H01R13/04 , H01R13/6461 , H01R13/6473 , H01R13/6587
摘要： A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
摘要翻译：宽侧耦合连接器组件具有两组导体，每个独立的平面。通过提供相同的路径长度，差分对的导体之间不存在偏斜，并且那些导体的阻抗相同。导体组是通过将第一组导体嵌入绝缘壳体而形成的，绝缘壳体具有带通道的顶表面。第二组导体放置在通道内，使得两组导体之间不会形成气隙。第二绝缘壳体填充在第二组导体上并进入通道以形成完整的晶片。导体的端部容纳在刀片壳体中。差分和地面对的叶片具有延伸穿过壳体的底部的一端具有小的占地面积。成对的叶片的另一端发散以与晶片连接。第一组和第二组导体和叶片的端部在x和y坐标上均匀点动以减少串扰并提高电气性能。

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