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1. 发明授权

US07163438B2 Zone polishing using variable slurry solid content 有权
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US07163438B2
公开(公告)日：2007-01-16
申请号：US11208829
申请日：2005-08-22
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
IPC分类号： B24B49/00 , B24B7/00 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。

2. 发明申请

US20050134857A1 Method to monitor silicide formation on product wafers 审中-公开
标题翻译：监测产品晶圆上硅化物形成的方法
公开(公告)号：US20050134857A1
公开(公告)日：2005-06-23
申请号：US10742986
申请日：2003-12-22
申请人： Alvaro Maury , Nace Layadi , Jovin Lim
发明人： Alvaro Maury , Nace Layadi , Jovin Lim
IPC分类号： G01N21/17 , G01R31/28 , H01L21/66 , G01N21/00 , G01R31/26
CPC分类号： G01R31/2831 , G01N21/1717
摘要： A new method to monitor sheet resistance of a metal silicide layer in the manufacture of an integrated circuit device is achieved. The method comprises providing a metal silicide layer overlying an exposed silicon layer on a substrate. A thermal wave intensity signal is generated for the metal silicide layer by an optical measurement system. The optical measurement system comprises a first laser beam that is intensity modulated and a second laser beam. The first and second laser beams comprise different wavelengths. A dichroic mirror is used to combine the first and second laser beams and to project the first and second laser beams onto the metal silicide layer. A detector is used to gather the second laser beam reflected from the metal silicide layer and to generate a thermal wave intensity signal based on the reflected second laser beam. Sheet resistance of the metal silicide layer is calculated by a linear equation based on the thermal wave intensity signal.
摘要翻译：实现了在制造集成电路器件时监测金属硅化物层的薄层电阻的新方法。该方法包括提供覆盖衬底上暴露的硅层的金属硅化物层。通过光学测量系统为金属硅化物层产生热波强度信号。光学测量系统包括强度调制的第一激光束和第二激光束。第一和第二激光束包括不同的波长。分色镜用于组合第一和第二激光束并将第一和第二激光束投影到金属硅化物层上。检测器用于收集从金属硅化物层反射的第二激光束，并产生基于反射的第二激光束的热波强度信号。通过基于热波强度信号的线性方程来计算金属硅化物层的薄层电阻。

3. 发明授权

US06984166B2 Zone polishing using variable slurry solid content 失效
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US06984166B2
公开(公告)日：2006-01-10
申请号：US10633131
申请日：2003-08-01
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区域区域中的抛光速率。

4. 发明申请

US20050277372A1 Zone polishing using variable slurry solid content 有权
公开(公告)号：US20050277372A1
公开(公告)日：2005-12-15
申请号：US11208829
申请日：2005-08-22
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
IPC分类号： B24B37/04 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.

5. 发明申请

US20050026549A1 Zone polishing using variable slurry solid content 失效
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US20050026549A1
公开(公告)日：2005-02-03
申请号：US10633131
申请日：2003-08-01
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
IPC分类号： B24B37/04 , B24B57/02 , B24B49/00 , B24B51/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。

6. 发明授权

US06821886B1 IMP TiN barrier metal process 失效
标题翻译： IMP TiN阻挡金属工艺
公开(公告)号：US06821886B1
公开(公告)日：2004-11-23
申请号：US10655690
申请日：2003-09-05
申请人： Nace Layadi , Alvaro Maury , Jovin Lim
发明人： Nace Layadi , Alvaro Maury , Jovin Lim
IPC分类号： H01L2144
CPC分类号： H01L21/76846 , H01L21/76805 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： A new method is provided for the creation of an adhesion/barrier layer over which a tungsten interconnect is created. The invention reduces metal extrusion and effects of pin-holes by dividing the process of barrier material of TiN deposition into phases, whereby after about half the thickness of the required layer of TiN has been deposited, an intermediate and very thin layer of Ti is deposited. After the thin layer of Ti has been deposited, the deposition of the barrier layer of TiN is continued to the point where the required thickness for the layer of TiN has been reached.
摘要翻译：提供了一种新的方法来创建粘附/阻挡层，在其上形成钨互连。本发明通过将TiN沉积的阻挡材料的工艺分成相来减少金属挤出和针孔的影响，由此在所需的TiN层的厚度的大约一半已经沉积之后，沉积中间层和非常薄的Ti层。在沉积薄层的Ti之后，TiN阻挡层的沉积继续到达到TiN层所需厚度的程度。

7. 发明申请

US20080029853A1 INTEGRATED CIRCUIT SYSTEM WITH CONTACT FILM 有权
标题翻译：具有接触膜的集成电路系统
公开(公告)号：US20080029853A1
公开(公告)日：2008-02-07
申请号：US11462036
申请日：2006-08-02
申请人： Chih Ping Yong , Peter Chew , Chuin Boon Yeap , Hoon Lian Yap , Ranbir Singh , Nace Rossi , Jovin Lim
发明人： Chih Ping Yong , Peter Chew , Chuin Boon Yeap , Hoon Lian Yap , Ranbir Singh , Nace Rossi , Jovin Lim
IPC分类号： H01L23/58
CPC分类号： H01L21/76801 , H01L21/76804 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a contact in the undoped insulating layer, thin insulating layer and the doped insulating layer.
摘要翻译：一种集成电路系统，包括提供集成电路器件，在所述集成电路器件上形成未掺杂绝缘层，在所述未掺杂绝缘层上形成薄绝缘层，在所述薄绝缘层上形成掺杂绝缘层，以及在所述绝缘层上形成接触未掺杂的绝缘层，薄绝缘层和掺杂绝缘层。

8. 发明授权

US08685861B2 Integrated circuit system with contact distribution film 有权
标题翻译：具有接触分布膜的集成电路系统
公开(公告)号：US08685861B2
公开(公告)日：2014-04-01
申请号：US11462036
申请日：2006-08-02
申请人： Chih Ping Yong , Peter Chew , Chuin Boon Yeap , Hoon Lian Yap , Ranbir Singh , Nace Rossi , Jovin Lim
发明人： Chih Ping Yong , Peter Chew , Chuin Boon Yeap , Hoon Lian Yap , Ranbir Singh , Nace Rossi , Jovin Lim
IPC分类号： H01L21/311
CPC分类号： H01L21/76801 , H01L21/76804 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A integrated circuit system including providing an integrated circuit device, forming an undoped insulating layer over the integrated circuit device, forming a thin insulating layer over the undoped insulating layer, forming a doped insulating layer over the thin insulating layer, and forming a contact in the undoped insulating layer, thin insulating layer and the doped insulating layer.
摘要翻译：一种集成电路系统，包括提供集成电路器件，在所述集成电路器件上形成未掺杂绝缘层，在所述未掺杂绝缘层上形成薄绝缘层，在所述薄绝缘层上形成掺杂绝缘层，以及在所述绝缘层上形成接触未掺杂的绝缘层，薄绝缘层和掺杂绝缘层。

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