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1. 发明授权

US5408739A Two-step dieing process to form an ink jet face 失效
标题翻译：两步冲压工艺形成喷墨面
公开(公告)号：US5408739A
公开(公告)日：1995-04-25
申请号：US55896
申请日：1993-05-04
申请人： Robert P. Altavela , Lawrence H. Herko , Almon P. Fisher
发明人： Robert P. Altavela , Lawrence H. Herko , Almon P. Fisher
IPC分类号： B23P15/00 , B26D7/01 , B41J2/01 , B41J2/05 , B41J2/16 , B26D1/00 , H05B3/00
CPC分类号： B41J2/1604 , B26D7/01 , B41J2/1623 , B41J2/1626 , B41J2/1635 , Y10T29/49083 , Y10T29/49401 , Y10T83/0495
摘要： A method of dicing a printhead wafer containing a plurality of individual print elements into discreet elements. A back side relief feature is formed on the bottom front edge of a thermal ink jet print element from a heater side during a first dicing cut, followed by a second dicing cut from a channel side of the wafer to form a front face nozzle. The back cut feature enables front face maintenance by a wiper blade or other maintenance operation, provides a pocket for excess die bonding adhesive during manufacture, and reduces front face chipping during dicing caused by the saw blade contacting the die wafer mounting media and becoming contaminated. The relief feature may be a square step feature or a beveled back cut feature and may additionally be located on a top front edge of the print element.
摘要翻译：将包含多个单独打印元件的打印头晶片切割成离散元件的方法。在第一切割切割期间，从加热器侧在热喷墨印刷元件的底部前边缘上形成背面浮雕特征，随后从晶片的通道侧进行第二切割切割，以形成正面喷嘴。背部切割功能可以通过刮水片或其他维护操作进行正面维护，在制造过程中提供了多余的芯片粘合粘合剂的口袋，并且减少了由锯片接触模具晶片安装介质而导致的切割过程中的正面切屑，并被污染。浮雕特征可以是方形台阶特征或斜面后切割特征，并且还可以位于打印元件的顶部前边缘上。

2. 发明授权

US4851371A Fabricating process for large array semiconductive devices 失效
标题翻译：大阵列半导体器件的制造工艺
公开(公告)号：US4851371A
公开(公告)日：1989-07-25
申请号：US280104
申请日：1988-12-05
申请人： Almon P. Fisher , Donald J. Drake
发明人： Almon P. Fisher , Donald J. Drake
IPC分类号： B41J2/05 , B41J2/16 , B41J2/335 , B41J2/34 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/146
CPC分类号： B41J2/1629 , B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1635 , H01L21/3043 , H01L21/30608 , Y10S148/028
摘要： A cost effective method of fabricating a large array or pagewidth silicon device having high resolution is disclosed. The pagewidth device is assembled by abutting silicon device sub-units such as image sensors or thermal ink jet printheads. For printheads, the sub-units are fully operational small printheads comprising an ink flow directing channel plate and a heating element plate which are bonded together. A plurality of individual printhead sub-units are obtained by dicing aligned and bonded channel wafers and heating element wafers. The abutting edges of the printhead sub-units are diced in such a manner that the resulting kerfs have vertical to inwardly directed sides which enable high tolerance linear abutment of adjacent sub-units. Alternatively, the wafer surface containing the heating elements is first anisotropically etched to form small V-grooves, one wall of which protects against microcracking during the dicing operation. The other wall of the V-groove is obliterated by the slanted dicing blade.
摘要翻译：公开了一种制造具有高分辨率的大阵列或页宽硅器件的成本有效的方法。页面宽度设备通过邻接硅器件子单元（如图像传感器或热喷墨打印头）进行组装。对于打印头，子单元是完全可操作的小打印头，包括粘合在一起的油墨流动导向通道板和加热元件板。通过切割对准和结合的通道晶片和加热元件晶片来获得多个单独的打印头子单元。打印头子单元的邻接边缘以这样的方式切割，使得所得到的切口具有垂直于向内指向的侧面，这使得相邻子单元能够进行高公差线性邻接。或者，包含加热元件的晶片表面首先被各向异性蚀刻以形成小的V形槽，其一个壁在切割操作期间防止微裂纹。 V形槽的另一个壁被倾斜的切割刀片消除。

3. 发明授权

US5900892A Nozzle plates for ink jet cartridges 失效
标题翻译：喷墨墨盒喷嘴板
公开(公告)号：US5900892A
公开(公告)日：1999-05-04
申请号：US811624
申请日：1997-03-05
申请人： David A. Mantell , Lisa A. DeLouise , Cathie J. Burke , Mildred Calistri-Yeh , Almon P. Fisher , Narayan V. Deshpande
发明人： David A. Mantell , Lisa A. DeLouise , Cathie J. Burke , Mildred Calistri-Yeh , Almon P. Fisher , Narayan V. Deshpande
IPC分类号： B41J2/05 , B41J2/135 , B41J2/16
CPC分类号： B41J2/1631 , B41J2/162 , B41J2/1623 , B41J2/1626 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B41J2/1645 , B41J2202/03 , Y10T29/49401
摘要： A nozzle plate for ink jet cartridges which are manufactured from a relatively thin film of material, such as, for example, polyimide, polyarylene ether, or composite of a number of materials deposited on a rigid substrate, such as a silicon wafer, and photolithographically processed from the rigid substrate to produce a large quantity of interconnected nozzle plates which may be removed as a sheet of interconnected nozzle plates for ease of handling. The nozzle plates are aligned and bonded to the nozzle bearing front faces of the cartridges.
摘要翻译：用于喷墨盒的喷嘴板，其由相对薄的材料薄膜制成，例如聚酰亚胺，聚亚芳基醚或沉积在诸如硅晶片的刚性基板上的多种材料的复合材料，并且光刻从刚性基板处理以产生大量互连的喷嘴板，其可以作为易于处理的互连喷嘴板的片材去除。喷嘴板对准并结合到墨盒的喷嘴轴承前表面。

4. 发明授权

US5057853A Thermal ink jet printhead with stepped nozzle face and method of fabrication therefor 失效
标题翻译：具有阶梯喷嘴面的热喷墨打印头及其制造方法
公开(公告)号：US5057853A
公开(公告)日：1991-10-15
申请号：US577244
申请日：1990-09-04
申请人： Almon P. Fisher
发明人： Almon P. Fisher
IPC分类号： B26D5/00 , B41J2/16
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , Y10T29/49401
摘要： A thermal ink jet printhead and method of batch production thereof is disclosed. Each printhead has a plurality of nozzles in a stepped nozzle face that are obtained by a two step dicing operation. The printheads being formed by aligning and bonding an anisotropically etched silicon wafer containing a plurality of sets of channel grooves to a silicon wafer containing a plurality of linear arrays of heating elements and addressing electrodes over which a thick film layer is deposited and photopatterned to expose the heating elements and electrode terminals and to remove the areas parallel to and a predetermined distanace from the heating element arrays, thus photodelineating the portion of the thick film layer between the heating elements and the nozzles. The mated wafer sandwiches the thick film layer, and first dicing cutting severs the etch wafer and notches the wafer with the heating elements, forming a nozzle face containing the nozzle. The first dicing cut is made at a location where the thick film layer has been etch removed, thus eliminating the need to dice it, thereby preventing the formation of burrs which affect droplet directionality.
摘要翻译：公开了一种热喷墨打印头及其批量生产方法。每个打印头具有通过两步切割操作获得的阶梯式喷嘴面中的多个喷嘴。打印头通过将包含多组通道槽的各向异性蚀刻的硅晶片对准和结合到包含加热元件和寻址电极的多个线性阵列的硅晶片上而形成，在该晶片上沉积厚膜层并曝光加热元件和电极端子，并且去除与加热元件阵列平行的预定距离和预定距离的区域，从而对加热元件和喷嘴之间的厚膜层的部分进行光线测量。配合的晶片夹着厚膜层，第一切割切割切割蚀刻晶片并用加热元件切割晶片，形成包含喷嘴的喷嘴面。第一切割切口是在去除了厚膜层的位置处进行的，因此不需要将其切割，从而防止形成影响液滴方向性的毛刺。

5. 发明授权

US4556890A Cleaning apparatus for a magnetographic recording head 失效
标题翻译：用于磁记录头的清洁装置
公开(公告)号：US4556890A
公开(公告)日：1985-12-03
申请号：US559548
申请日：1983-12-08
申请人： Herman A. Hermanson , Almon P. Fisher
发明人： Herman A. Hermanson , Almon P. Fisher
IPC分类号： B41J29/17 , G03G19/00 , G01D15/12
CPC分类号： B41J29/17 , G03G19/00
摘要： A cleaning apparatus for a recording head in a magnetographic printing device of the type having a movable magnetic imaging tape in endless belt form is disclosed. The apparatus is especially effective for cleaning thermal printheads for thermoremanent magnetic imaging systems, and comprises a cleaning member adapted for reciprocal movement into and out of a nip formed by the magnetic tape and the printhead. In one embodiment, the cleaning member is a flexible substrate attached at one end to a rotatably mounted spool. The substrate is wound on the spool with the loose end resting on a guide plate and confronting the nip. The spool is periodically rotated to drive the substrate through the nip while the tape is moving and then is rotated in the opposite direction to rewind the substrate and withdraw it from the nip. In another embodiment, the cleaning member is a flexible substrate which is maintained in a planar configuration by parallel guide plates. A tractor wheel drive reciprocally moves the cleaning member into and out of the nip. The cleaning member may be a non-conductive, woven material having open spaces therein or a two layered composite having a non-conductive screen on one side to contact the tape and a carpet of short bristles on the other side to clean the printhead. Optionally, lateral movement of the cleaning member is provided after it enters the nip and the heating elements of the printhead may be momentarily energized to heat and soften the toner accumulated on the printhead to enhance the cleaning efficiency of the apparatus.
摘要翻译：公开了一种用于具有环形带形式的可移动磁性成像带的类型的磁光印刷装置中的记录头清洁装置。该装置特别有效地用于清洁热敏磁性成像系统的热打印头，并且包括适于往复运动进入和离开由磁带和打印头形成的辊隙的清洁部件。在一个实施例中，清洁构件是在一端附接到可旋转地安装的卷轴的柔性基板。衬底缠绕在线轴上，松动端搁置在导向板上并面对辊隙。周期性地旋转卷轴以在带移动的同时通过辊隙驱动衬底，然后沿相反方向旋转以重新卷绕衬底并将其从辊隙中取出。在另一个实施例中，清洁构件是通过平行导向板保持在平面构造中的柔性基板。拖拉机轮驱动器将清洁构件往复移动进入和离开辊隙。清洁构件可以是其中具有开放空间的非导电编织材料或在一侧具有非导电屏幕的两层复合材料，以在另一侧上接触带子和短刷毛毯，以清洁打印头。可选地，清洁构件在其进入辊隙之后提供横向运动，并且打印头的加热元件可以瞬间通电以加热和软化累积在打印头上的调色剂，以提高设备的清洁效率。

6. 发明授权

US06436793B1 Methods of forming semiconductor structure 失效
标题翻译：形成半导体结构的方法
公开(公告)号：US06436793B1
公开(公告)日：2002-08-20
申请号：US09749692
申请日：2000-12-28
申请人： Gary A. Kneezel , Daniel E. Kuhman , Brian T. Ormond , Ackerman C. John , Almon P. Fisher , Allan F. Camp , Lawrence H. Herko
发明人： Gary A. Kneezel , Daniel E. Kuhman , Brian T. Ormond , Ackerman C. John , Almon P. Fisher , Allan F. Camp , Lawrence H. Herko
IPC分类号： H01L2130
CPC分类号： B41J2/1635 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1631 , H01L21/78
摘要： A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.
摘要翻译：一种从第一晶片和第二晶片形成半导体结构的方法。在第一晶片的下表面形成凹坑或凹槽。第一晶片的下表面结合到第二晶片的上表面。然后在第一晶片的上表面上形成凹槽，使得在第一晶片中形成开口，该第一晶片在第二晶片的上表面上露出至少一个对准基准对象。然后使用暴露的至少一个对准参考目标切割接合的第一晶片和第二晶片以形成半导体结构。

7. 发明授权

US06260956B1 Thermal ink jet printhead and process for the preparation thereof 失效
标题翻译：热喷墨打印头及其制备方法
公开(公告)号：US06260956B1
公开(公告)日：2001-07-17
申请号：US09120746
申请日：1998-07-23
申请人： Ram S. Narang , Gary A. Kneezel , Bidan Zhang , Almon P. Fisher , Timothy J. Fuller
发明人： Ram S. Narang , Gary A. Kneezel , Bidan Zhang , Almon P. Fisher , Timothy J. Fuller
IPC分类号： B41J204
CPC分类号： B41J2/1635 , B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1645 , B41J2002/14362
摘要： Disclosed is an ink jet printhead which comprises (i) an upper substrate with a set of parallel grooves for subsequent use as ink channels and a recess for subsequent use as a manifold, the grooves being open at one end for serving as droplet emitting nozzles, and (ii) a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes formed thereon, said lower substrate having an insulative layer deposited on the surface thereof and over the heating elements and addressing electrodes and patterned to form recesses therethrough to expose the heating elements and terminal ends of the addressing electrodes, the upper and lower substrates being aligned, mated, and bonded together to form the printhead with the grooves in the upper substrate being aligned with the heating elements in the lower substrate to form droplet emitting nozzles, said upper substrate comprising a material formed by crosslinking or chain extending a polymer of formula I or II.
摘要翻译：公开了一种喷墨打印头，其包括（i）具有一组平行凹槽以用于随后用作油墨通道的上基板和用于随后用作歧管的凹槽，所述凹槽在一端开口以用作液滴发射喷嘴，和（ii）下基板，其中一个表面具有形成在其上的加热元件和寻址电极的阵列，所述下基板具有沉积在其表面上的绝热层，并且在加热元件和寻址电极之上并且被图案化以形成通过其中的凹槽为了露出寻址电极的加热元件和末端，上基板和下基板对准，配合和结合在一起以形成打印头，上基板中的凹槽与下基板中的加热元件对准以形成液滴所述上基板包括通过交联或链延长式I或II的聚合物形成的材料。

8. 发明授权

US5665249A Micro-electromechanical die module with planarized thick film layer 失效
标题翻译：具有平面化厚膜层的微机电模具模块
公开(公告)号：US5665249A
公开(公告)日：1997-09-09
申请号：US330146
申请日：1994-10-17
申请人： Cathie J. Burke , William G. Hawkins , Herman A. Hermanson , Michael C. Ferringer , Almon P. Fisher , Diane Atkinson
发明人： Cathie J. Burke , William G. Hawkins , Herman A. Hermanson , Michael C. Ferringer , Almon P. Fisher , Diane Atkinson
IPC分类号： B41J2/05 , B24B37/04 , B41J2/16 , B24B1/00 , B41J2/04
CPC分类号： B41J2/1623 , B24B37/04 , B41J2/1604 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2/1645 , B41J2202/03 , Y10T29/49401
摘要： An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.
摘要翻译：通过由诸如聚酰亚胺的图案化聚合物材料的中间厚膜层粘合在一起的两个平面基板的对准来形成改进的微电子机械装置，例如热喷墨模头或打印头。改进的装置具有完全固化的图案化的厚膜层，其通过化学机械抛光进行平面化，以提高基板之间的结合强度。平坦化消除了在沉积厚膜层期间和/或在其中凹陷图案化期间产生的形貌结构。

9. 发明授权

US5333007A Moisture leakage resistant capping surface for ink jet printhead 失效
标题翻译：用于喷墨打印头的防潮漏水顶盖表面
公开(公告)号：US5333007A
公开(公告)日：1994-07-26
申请号：US116816
申请日：1993-08-11
申请人： Gary A. Kneezel , Peter J. John , Bobbie A. Rice , Herman A. Hermanson , Almon P. Fisher
发明人： Gary A. Kneezel , Peter J. John , Bobbie A. Rice , Herman A. Hermanson , Almon P. Fisher
IPC分类号： B41J2/05 , B41J2/165 , G01D15/16
CPC分类号： B41J2/16508 , Y10T29/49401
摘要： A printhead with a printhead die, an ink manifold and heat sink substrate has a continuous sealing surface surrounding the printhead die which is formed by the ink manifold, heat sink substrate and filler material disposed therebetween. The filler material acts as caulking to eliminate gaps around the printhead die, particularly between the ink manifold and heat sink substrate, and to provide a smooth surface for abutment with a capping member. A fluid-tight seal is obtained between the capping member and the continuous sealing surface on the printhead, thus preventing the drying out of ink in the nozzles through evaporation of volatile ink components. In some priming nozzle configurations, the leaktight seal also facilitates priming of the printhead.
摘要翻译：具有打印头芯片，墨水歧管和散热器基板的打印头具有围绕打印头芯片的连续密封表面，该密封表面由墨水歧管，散热基板和设置在其间的填充材料形成。填充材料用作填缝以消除打印头芯片周围的间隙，特别是在墨水歧管和散热器基板之间，并且提供用于与封盖构件邻接的光滑表面。在封盖构件和打印头上的连续密封表面之间获得流体密封，从而通过挥发性油墨组分的蒸发来防止喷嘴中的油墨干燥。在一些起动喷嘴构造中，密封密封件还有助于打印头的启动。

10. 发明授权

US5160403A Precision diced aligning surfaces for devices such as ink jet printheads 失效
标题翻译：用于诸如喷墨打印头的设备的精密切割对准表面
公开(公告)号：US5160403A
公开(公告)日：1992-11-03
申请号：US742802
申请日：1991-08-09
申请人： Almon P. Fisher , Donald J. Drake
发明人： Almon P. Fisher , Donald J. Drake
IPC分类号： B41J2/16 , H01L21/301
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1635 , B41J2202/21 , Y10S438/975 , Y10T156/1064 , Y10T156/1066 , Y10T156/1075
摘要： A method of fabricating a semiconductor device having a buttable edge from a first wafer having first and second opposite planar surfaces and a second wafer having first and second opposite planar surfaces is disclosed. A first component is formed on the first planar surface of the first wafer. A precision dice cut is placed in the first planar surface of the first wafer closely adjacent to the first component. The precision dice cut extends partially through the first surface of the first wafer and defines the buttable edge. The first surface of the first wafer is bonded to the first surface of the second wafer, the first surface of the second wafer containing a second component and being aligned with and bonded to the first wafer so that the first and second components cooperate to form the semiconductor device. Portions of the first and second wafers surrounding the first and second components, respectively, are then removed to define the semiconductor device. The step of removing can include placing a second dice cut entirely through the first and second wafers parallel to and slightly offset from the precision dice cut. The second dice cut being located slightly further away from the first component than the precision dice cut and intersects a portion of the precision dice cut so that a side of the semiconductor device which includes the buttable edge is defined by the precision dice cut and the second dice cut.
摘要翻译：公开了一种制造半导体器件的方法，该半导体器件具有具有第一和第二相对平坦表面的第一晶片的具有可平行边缘的半导体器件，以及具有第一和第二相对平面的第二晶片。第一部件形成在第一晶片的第一平面上。将精密切割切割放置在与第一部件紧密相邻的第一晶片的第一平面表面中。精密骰子切割部分延伸穿过第一晶片的第一表面并且限定了可展开的边缘。第一晶片的第一表面被结合到第二晶片的第一表面，第二晶片的第一表面包含第二元件并且与第一晶片对准并且结合到第一晶片，使得第一和第二元件协作形成半导体器件。然后分别围绕第一和第二部件的第一和第二晶片的部分被移除以限定半导体器件。去除步骤可以包括将第一和第二晶片完全切割的第二骰子平行于并且稍微偏离精密骰子切割。所述第二骰子切割位置比所述第一部件稍微远离所述精密骰子切割并与所述精密骰子切割的一部分相交，使得包括所述可裁剪边缘的所述半导体器件的一侧由所述精密骰子切割限定，并且所述第二骰子切割骰子切。

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