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1. 发明申请

US20110249437A1 HIGHLY EFFICIENT LED ARRAY MODULE WITH PRE-CALCULATED NON-CIRCULAR ASYMMETRICAL LIGHT DISTRIBUTION 有权
标题翻译：具有预先计算的非圆形不对称光分布的高效LED阵列模块
公开(公告)号：US20110249437A1
公开(公告)日：2011-10-13
申请号：US13083417
申请日：2011-04-08
申请人： Alexander Rizkin , Robert Tudhope , Vahid Moshtagh , Hannu Tapani Hukkanen , Tomi Mikael Kuntze
发明人： Alexander Rizkin , Robert Tudhope , Vahid Moshtagh , Hannu Tapani Hukkanen , Tomi Mikael Kuntze
IPC分类号： F21V7/00 , F21V29/00
CPC分类号： F21V29/70 , F21K9/60 , F21V7/00 , F21V7/0025 , F21V7/0083 , F21V7/09 , F21V7/22 , F21W2131/103 , F21Y2105/10 , F21Y2115/10
摘要： A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array.
摘要翻译：光模块包括发光二极管（LED）阵列和耦合到LED阵列的双反射组件。双反射组件包括具有框架的下部构件。框架具有对应于LED阵列的开口。框架和LED阵列位于同一平面。光模块还包括左下反射器和右底反射器。光模块还包括一个上部件，它包括一个左上反射器; 和右顶部反射器，其中左上反射器附接到左底反射器，右上反射器附接到右底反射器，每个反射器形成任意的左右双反射组件。每个双反射组件的形状几何形状和轮廓提供预先计算的组合的非圆形不对称强度分布图案。强度分布图案是从底部反射器反射的光的叠加，从顶部反射器反射的光，从顶部和底部反射器双重反射的光以及直接从LED阵列引导到强度分布图案中的光。

2. 发明授权

US08496362B2 Highly efficient LED array module with pre-calculated non-circular asymmetrical light distribution 有权
标题翻译：高效LED阵列模块，具有预先计算的非圆形不对称光分布
公开(公告)号：US08496362B2
公开(公告)日：2013-07-30
申请号：US13083417
申请日：2011-04-08
申请人： Alexander Rizkin , Robert Tudhope , Vahid Moshtagh , Hannu Tapani Hukkanen , Tomi Mikael Kuntze
发明人： Alexander Rizkin , Robert Tudhope , Vahid Moshtagh , Hannu Tapani Hukkanen , Tomi Mikael Kuntze
IPC分类号： F21V7/00
CPC分类号： F21V29/70 , F21K9/60 , F21V7/00 , F21V7/0025 , F21V7/0083 , F21V7/09 , F21V7/22 , F21W2131/103 , F21Y2105/10 , F21Y2115/10
摘要： A light module includes a light emitting diode (LED) array and a double-reflective assembly coupled to the LED array. The double-reflective assembly includes a lower member having a frame. The frame has an opening corresponding to the LED array. The frame and LED array are located in the same plane. The light module further includes a left bottom reflector and a right bottom reflector. The light module further includes an upper member which includes a left top reflector; and a right top reflector, wherein the left top reflector is attached to the left bottom reflector, and right top reflector is attached to the right bottom reflector, each forming an arbitrary left and right double-reflective assembly. A shape geometry and profile of each double-reflective assembly provides a pre-calculated combined non-circular asymmetrical intensity distribution pattern. The intensity distribution pattern is a superposition of light reflected from the bottom reflectors, light reflected from the top reflectors, light doubly reflected from both the top and bottom reflectors, and light directed into the intensity distribution pattern directly from the LED array.
摘要翻译：光模块包括发光二极管（LED）阵列和耦合到LED阵列的双反射组件。双反射组件包括具有框架的下部构件。框架具有对应于LED阵列的开口。框架和LED阵列位于同一平面。光模块还包括左下反射器和右底反射器。光模块还包括一个上部件，它包括一个左上反射器; 和右顶部反射器，其中左上反射器附接到左底反射器，右上反射器附接到右底反射器，每个反射器形成任意的左右双反射组件。每个双反射组件的形状几何形状和轮廓提供预先计算的组合的非圆形不对称强度分布图案。强度分布图案是从底部反射器反射的光的叠加，从顶部反射器反射的光，从顶部和底部反射器双重反射的光以及直接从LED阵列引导到强度分布图案中的光。

3. 发明申请

US20120126281A1 SYSTEM FOR FLASH-FREE OVERMOLDING OF LED ARRAY SUBSTRATES 有权
标题翻译： LED阵列基板的无闪存过载系统
公开(公告)号：US20120126281A1
公开(公告)日：2012-05-24
申请号：US12977596
申请日：2010-12-23
申请人： Alexander Shaikevitch , Vahid Moshtagh
发明人： Alexander Shaikevitch , Vahid Moshtagh
IPC分类号： H01L33/52 , B32B37/12 , B32B37/10 , B29C43/18 , B29D11/00
CPC分类号： B29C65/50 , B29D11/00298 , B29D11/00807 , H01L21/566 , H01L21/568 , H01L33/52 , H01L2924/0002 , H01L2933/005 , Y10T156/10 , Y10T156/17 , H01L2924/00
摘要： System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.
摘要翻译： LED阵列基板的无闪光包覆成型系统。在一方面，提供了一种用于将封装成型到LED阵列基板上的方法。该方法包括将保护带附着到基底的基底表面上，使得保护带中的开口与基底的LED器件对准，并将成型材料施加到模制工具的模制表面上，并且通过开口露出的部分基底在保护胶带中。该方法还包括以选定的压力和选定的温度将成型表面和基底表面压在一起，从而在基片上露出的保护带中的开口的部分上形成封装，将模制表面与基片表面分开，并且去除保护带，使得模塑材料从衬底上除去，留下干净的模制衬底。

4. 发明授权

US08597988B2 System for flash-free overmolding of led array substrates 有权
标题翻译： LED阵列基板的无闪光包覆成型系统
公开(公告)号：US08597988B2
公开(公告)日：2013-12-03
申请号：US12977596
申请日：2010-12-23
申请人： Alexander Shaikevitch , Vahid Moshtagh
发明人： Alexander Shaikevitch , Vahid Moshtagh
IPC分类号： H01L23/28
CPC分类号： B29C65/50 , B29D11/00298 , B29D11/00807 , H01L21/566 , H01L21/568 , H01L33/52 , H01L2924/0002 , H01L2933/005 , Y10T156/10 , Y10T156/17 , H01L2924/00
摘要： System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.
摘要翻译： LED阵列基板的无闪光包覆成型系统。在一方面，提供了一种用于将封装成型到LED阵列基板上的方法。该方法包括将保护带附着到基底的基底表面上，使得保护带中的开口与基底的LED器件对准，并将成型材料施加到模制工具的模制表面上，并且通过开口露出的部分基底在保护胶带中。该方法还包括以选定的压力和选定的温度将成型表面和基底表面压在一起，从而在基片上露出的保护带中的开口的部分上形成封装，将模制表面与基片表面分开，并且去除保护带，使得模塑材料从衬底上除去，留下干净的模制衬底。

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