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    • 4. 发明申请
    • Copper replenishment for copper plating with insoluble anode
    • 用不溶性阳极镀铜的铜补充
    • US20050082172A1
    • 2005-04-21
    • US10690408
    • 2003-10-21
    • Nicolay KovarskyDmitry LubomirskyAlexander HoermannSaravjeet Singh
    • Nicolay KovarskyDmitry LubomirskyAlexander HoermannSaravjeet Singh
    • C25D21/14C25D21/18
    • C25D21/14C25D21/18
    • In one embodiment, the present invention generally provides an apparatus and method for dispersing a chemical reagent into a plating solution. The apparatus generally includes a tank for containing the plating solution and a horizontal vessel in fluid communication with the tank, wherein the horizontal vessel has an input and an output. The apparatus further includes at least one shelf contained inside the horizontal vessel, wherein the at least one shelf extends between the input and the output and the chemical reagent rests on the at least one shelf. In another embodiment, the present invention generally provides an apparatus for dispersing a chemical reagent to a plating solution comprising a tank for containing the plating solution and a vertical vessel in fluid communication with the tank. A lower portion of the vertical vessel includes an inlet and an injector port and an upper portion of the vertical vessel includes an outlet and a manifold. The chemical reagent is positioned between the inlet and the outlet.
    • 在一个实施方案中,本发明通常提供了将化学试剂分散到电镀溶液中的装置和方法。 该装置通常包括用于容纳电镀溶液的罐和与罐流体连通的水平容器,其中水平容器具有输入和输出。 该装置还包括容纳在水平容器内的至少一个搁架,其中至少一个货架在输入和输出之间延伸,化学试剂搁置在至少一个货架上。 在另一个实施方案中,本发明通常提供一种用于将化学试剂分散到包含用于容纳电镀溶液的罐和与罐流体连通的垂直容器的电镀溶液的装置。 垂直容器的下部包括入口和注射器端口,并且垂直容器的上部包括出口和歧管。 化学试剂位于入口和出口之间。