专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060013722A1 Lead-free solder pastes with increased reliability 审中-公开
标题翻译：无铅焊膏具有更高的可靠性
公开(公告)号：US20060013722A1
公开(公告)日：2006-01-19
申请号：US11178551
申请日：2005-07-11
申请人： Alexander Brand , Steffen Grebner , Wolfgang Schmitt , Jorg Trodler
发明人： Alexander Brand , Steffen Grebner , Wolfgang Schmitt , Jorg Trodler
IPC分类号： C22C13/00
CPC分类号： B23K35/025 , B23K35/262 , H05K3/3463 , H05K3/3484 , H05K2201/0272
摘要： The introduction of undesired intermetallic phases (IMP) is reduced in lead-free solder joints. For this purpose, solder pastes are prepared, which have a metal powder mixture that generates a melting range of at least about 5° Kelvin and preferably less than about 30° Kelvin. Suitable for this purpose are metal powder mixtures, in which the melting points of the metal powder components lie apart from each other more than about 5° Kelvin, particularly more than about 10° Kelvin, preferably more than about 15° K, and optionally less than about 30° Kelvin, particularly up to about 25° Kelvin. However, metal powder mixtures are also possible, in which the melting point spread can equal about 100° Kelvin and more, if the higher melting component dissolves in the melt below the melting point of this component, so that the melting range can be held under about 30° Kelvin. With these solder pastes undesired intermetallic phases can be held nearly arbitrarily low.
摘要翻译：在无铅焊点中引入不期望的金属间相（IMP）。为此，制备焊膏，其具有产生至少约5开氏度，优选小于约30开氏度的熔融范围的金属粉末混合物。适合于此目的的是金属粉末混合物，其中金属粉末组分的熔点彼此分开超过约5°开尔文，特别是大于约10°开尔文，优选大于约15°K，并且任选地较少高于约30°开尔文，特别高达约25°开氏度。然而，金属粉末混合物也是可能的，其中熔点扩散可以等于约100开氏度和更高，如果较高熔点的组分溶解在低于该组分的熔点的熔体中，使得熔融范围可以保持在约30°开尔文对于这些焊膏，不期望的金属间相可以几乎任意低。

IPRDB

热门服务

关于我们

友情链接

联系方式