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    • 4. 发明授权
    • Grinding tool
    • 研磨工具
    • US5011511A
    • 1991-04-30
    • US385735
    • 1989-07-26
    • Alexander Beck
    • Alexander Beck
    • B24D3/08B24D18/00
    • B24D3/08B24D18/0018
    • A material removing tool wherein a wheel-shaped, rod-like, tubular or otherwise configurated carrier supports pulverulent and/or granular particles of abrasive material which are joined to each other and/or to the carrier by active solder, such as an alloy or an eutectic of copper, silver, titanium and/or zirconium. The particles can be individually joined to the carrier or they can form a compact wherein the particles are held together by active solder. The compact can be joined to the carrier by active solder or by a standard solder, such as common solder or eutectic solder. That surface of the carrier which is joined with particles of abrasive material can be provided with recesses for portions of abrasive particles which are joined to the carrier by active solder.
    • 一种材料去除工具,其中轮形,棒状,管状或其它构造的载体支撑研磨材料的粉末和/或颗粒颗粒,其通过有源焊料例如合金或/ 铜,银,钛和/或锆的共晶。 颗粒可以单独地接合到载体上,或者它们可以形成压块,其中颗粒通过有源焊料保持在一起。 该压块可以通过有源焊料或标准焊料(例如普通焊料或共晶焊料)与载体接合。 与研磨材料颗粒结合的载体的表面可以设置有用于通过有源焊料接合到载体的磨料颗粒的部分的凹部。