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    • 3. 发明授权
    • Method for regulating temperature
    • 调节温度的方法
    • US08217706B2
    • 2012-07-10
    • US12397444
    • 2009-03-04
    • Alan R. BallStephen P. Robb
    • Alan R. BallStephen P. Robb
    • H01L35/00
    • H01L23/34H01L2924/0002H01L2924/3011H03K17/122H03K17/145H01L2924/00
    • A method and circuit for managing thermal performance of an integrated circuit. Temperature sensing circuits and a plurality of power FETs that are coupled together in parallel are manufactured from a semiconductor substrate. Each temperature sensing circuit monitors the temperature of the portion of the semiconductor substrate near or including a corresponding power FET. When the temperature of the semiconductor substrate near one or more of the power FETs reaches a predetermined value, the corresponding temperature sensing circuit reduces a voltage appearing on the gate of the power FET. The reduced voltage increases the on-resistance of the power FET and channels a portion of its current to others of the plurality of power FETs. The power FET continues operating but with a reduced current flow. When the temperature of the semiconductor substrate falls below the predetermined value, the gate voltage of the power FET is increased to its nominal value.
    • 一种用于管理集成电路的热性能的方法和电路。 并联的温度感测电路和多个功率FET由半导体衬底制造。 每个温度感测电路监测半导体衬底的部分或附近的相应功率FET的温度。 当一个或多个功率FET附近的半导体衬底的温度达到预定值时,相应的温度感测电路降低了功率FET的栅极上出现的电压。 降低的电压增加功率FET的导通电阻,并将其电流的一部分引导到多个功率FET中的其他功率FET。 功率FET继续工作,但电流减小。 当半导体衬底的温度低于预定值时,功率FET的栅极电压增加到其标称值。
    • 9. 发明申请
    • METHOD FOR REGULATING TEMPERATURE
    • 调节温度的方法
    • US20090160528A1
    • 2009-06-25
    • US12397444
    • 2009-03-04
    • Alan R. BallStephen P. Robb
    • Alan R. BallStephen P. Robb
    • H01L23/34
    • H01L23/34H01L2924/0002H01L2924/3011H03K17/122H03K17/145H01L2924/00
    • A method and circuit for managing thermal performance of an integrated circuit. Temperature sensing circuits and a plurality of power FETs that are coupled together in parallel are manufactured from a semiconductor substrate. Each temperature sensing circuit monitors the temperature of the portion of the semiconductor substrate near or including a corresponding power FET. When the temperature of the semiconductor substrate near one or more of the power FETs reaches a predetermined value, the corresponding temperature sensing circuit reduces a voltage appearing on the gate of the power FET. The reduced voltage increases the on-resistance of the power FET and channels a portion of its current to others of the plurality of power FETs. The power FET continues operating but with a reduced current flow. When the temperature of the semiconductor substrate falls below the predetermined value, the gate voltage of the power FET is increased to its nominal value.
    • 一种用于管理集成电路的热性能的方法和电路。 并联的温度感测电路和多个功率FET由半导体衬底制造。 每个温度感测电路监测半导体衬底的部分或附近的相应功率FET的温度。 当一个或多个功率FET附近的半导体衬底的温度达到预定值时,相应的温度感测电路降低了功率FET的栅极上出现的电压。 降低的电压增加功率FET的导通电阻,并将其电流的一部分引导到多个功率FET中的其他功率FET。 功率FET继续工作,但电流减小。 当半导体衬底的温度低于预定值时,功率FET的栅极电压增加到其标称值。
    • 10. 发明授权
    • Method for regulating temperature and circuit therefor
    • 用于调节温度和电路的方法
    • US07521985B2
    • 2009-04-21
    • US11171018
    • 2005-07-01
    • Alan R. BallStephen P. Robb
    • Alan R. BallStephen P. Robb
    • H03K17/14
    • H01L23/34H01L2924/0002H01L2924/3011H03K17/122H03K17/145H01L2924/00
    • A method and circuit for managing thermal performance of an integrated circuit. Temperature sensing circuits and a plurality of power FETs that are coupled together in parallel are manufactured from a semiconductor substrate. Each temperature sensing circuit monitors the temperature of the portion of the semiconductor substrate near or including a corresponding power FET. When the temperature of the semiconductor substrate near one or more of the power FETs reaches a predetermined value, the corresponding temperature sensing circuit reduces a voltage appearing on the gate of the power FET. The reduced voltage increases the on-resistance of the power FET and channels a portion of its current to others of the plurality of power FETs. The power FET continues operating but with a reduced current flow. When the temperature of the semiconductor substrate falls below the predetermined value, the gate voltage of the power FET is increased to its nominal value.
    • 一种用于管理集成电路的热性能的方法和电路。 并联的温度感测电路和多个功率FET由半导体衬底制造。 每个温度感测电路监测半导体衬底的部分或附近的相应功率FET的温度。 当一个或多个功率FET附近的半导体衬底的温度达到预定值时,相应的温度感测电路降低了功率FET的栅极上出现的电压。 降低的电压增加功率FET的导通电阻,并将其电流的一部分引导到多个功率FET中的其他功率FET。 功率FET继续工作,但电流减小。 当半导体衬底的温度低于预定值时,功率FET的栅极电压增加到其标称值。