专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20160066469A1 COOLING ARRANGEMENT FOR A CIRCUIT PACK 审中-公开
标题翻译：电路组的冷却装置
公开(公告)号：US20160066469A1
公开(公告)日：2016-03-03
申请号：US14472684
申请日：2014-08-29
申请人： Alcatel-Lucent USA Inc.
发明人： Todd Richard Salamon , Chaonong Yoh
IPC分类号： H05K7/20
CPC分类号： G02B6/4269 , H04Q1/035
摘要： A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device.
摘要翻译：电路结构包括电路板。在电路板上提供了一系列光电器件。至少一些散热器被提供与相应的光电器件热接触。电路结构的面板包括开口阵列，其被配置为允许空气沿着与光电装置相邻的路径移动并且通过相应的散热器。空气移动装置位于散热器附近，并且可操作地驱动空气通过面板上的相应开口。提供管道结构来引导由相应的空气移动装置驱动的空气。

IPRDB

热门服务

关于我们

友情链接

联系方式