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1. 发明授权

US08453314B2 Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle 有权
标题翻译：在柔性电路基板中使用细长楔形物和通道形状的容器形成通道的方法
公开(公告)号：US08453314B2
公开(公告)日：2013-06-04
申请号：US13368248
申请日：2012-02-07
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

2. 发明申请

US20120137505A1 PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE 有权
标题翻译：制造ORIGAMI形成的天线放射结构的方法
公开(公告)号：US20120137505A1
公开(公告)日：2012-06-07
申请号：US13368248
申请日：2012-02-07
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

3. 发明授权

US08127432B2 Process for fabricating an origami formed antenna radiating structure 有权
标题翻译：用于制作折纸形天线辐射结构的工艺
公开(公告)号：US08127432B2
公开(公告)日：2012-03-06
申请号：US12620544
申请日：2009-11-17
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

4. 发明申请

US20110113618A1 PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE 有权
标题翻译：制造ORIGAMI形成的天线放射结构的方法
公开(公告)号：US20110113618A1
公开(公告)日：2011-05-19
申请号：US12620544
申请日：2009-11-17
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

5. 发明授权

US09072164B2 Process for fabricating a three dimensional molded feed structure 有权
标题翻译：用于制造三维模制进料结构的方法
公开(公告)号：US09072164B2
公开(公告)日：2015-06-30
申请号：US12620562
申请日：2009-11-17
申请人： Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
发明人： Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
IPC分类号： H01R43/00 , H05K3/00 , H01Q21/00 , H05K1/03 , H05K3/06 , H05K3/38
CPC分类号： H01P11/00 , H01Q21/0087 , H05K1/0393 , H05K3/0014 , H05K3/06 , H05K3/388 , H05K2201/0129 , H05K2201/0141 , H05K2203/0113 , H05K2203/1105 , H05K2203/302 , Y10T29/49016 , Y10T29/49156
摘要： A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.
摘要翻译：提供了一种用于制造三维模制进给结构的方法。在一个实施例中，本发明涉及一种用于制造三维射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在柔性电路基板中形成第一预选的通道图案，将导电层沉积在形成的柔性基板，以及去除导电层的部分以形成多个导电迹线。

6. 发明申请

US20110113619A1 PROCESS FOR FABRICATING A THREE DIMENSIONAL MOLDED FEED STRUCTURE 有权
标题翻译：制作三维成型进料结构的方法
公开(公告)号：US20110113619A1
公开(公告)日：2011-05-19
申请号：US12620562
申请日：2009-11-17
申请人： Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
发明人： Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
IPC分类号： H01P11/00 , H05K3/06
CPC分类号： H01P11/00 , H01Q21/0087 , H05K1/0393 , H05K3/0014 , H05K3/06 , H05K3/388 , H05K2201/0129 , H05K2201/0141 , H05K2203/0113 , H05K2203/1105 , H05K2203/302 , Y10T29/49016 , Y10T29/49156
摘要： A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.
摘要翻译：提供了一种用于制造三维模制进给结构的方法。在一个实施例中，本发明涉及一种用于制造三维射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在柔性电路基板中形成第一预选的通道图案，将导电层沉积在形成的柔性基板，以及去除导电层的部分以形成多个导电迹线。

7. 发明授权

US08354595B2 Adhesive reinforced open hole interconnect 有权
标题翻译：粘合剂增强开孔互连
公开(公告)号：US08354595B2
公开(公告)日：2013-01-15
申请号：US12764854
申请日：2010-04-21
申请人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
发明人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
IPC分类号： H05K1/00
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译：一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。

8. 发明申请

US20110261539A1 ADHESIVE REINFORCED OPEN HOLE INTERCONNECT 有权
标题翻译：粘合加强开孔连接
公开(公告)号：US20110261539A1
公开(公告)日：2011-10-27
申请号：US12764854
申请日：2010-04-21
申请人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
发明人： Kevin C. Rolston , Alberto F. Viscarra , Derek Pruden , Cindy W. Ma
IPC分类号： H05K1/00 , B29C65/52
CPC分类号： H05K3/361 , H05K1/118 , H05K3/321 , H05K3/4635 , H05K2201/10666 , H05K2203/0455
摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
摘要翻译：一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。

9. 发明申请

US20090269162A1 Fastener with Bilateral seal for liquid immersion cooling applications 有权
标题翻译：用于液浸冷却应用的双边密封件紧固件
公开(公告)号：US20090269162A1
公开(公告)日：2009-10-29
申请号：US12150568
申请日：2008-04-29
申请人： Ethan S. Heinrich , Alberto F. Viscarra , Jennifer G. Wensel , Stephen E. Sox
发明人： Ethan S. Heinrich , Alberto F. Viscarra , Jennifer G. Wensel , Stephen E. Sox
IPC分类号： F16B33/00 , F16B43/00
CPC分类号： F16B5/0275 , F16B33/006 , F16B43/001 , H05K7/20236
摘要： A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket. The invention also provides a method for securing a fluid filled chamber to a surface comprising the steps of: placing an insert onto the surface such that a first end of the insert abuts the surface; placing the chamber onto the surface whereby the insert extends through an opening therethrough; threading a first end of a threaded fastener through the insert into the surface thereby closing a first lower seal arrangement; and securing the chamber to the surface by sealing the chamber with a nut thereby closing a second seal arrangement with respect to the chamber.
摘要翻译：一种紧固件组件，包括适于延伸通过具有纵向轴线的腔室的细长紧固件，第一端部和第二端部; 至少部分地设置在紧固件的第一端处的第一密封件，以防止流体从腔室泄漏; 以及至少部分地设置在紧固件的第二端处的第二密封件，以防止流体从腔室泄漏。在具体实施例中，第一和第二密封件是圆锥形密封件，第三密封件由垫圈提供。本发明还提供了一种用于将流体填充室固定到表面的方法，包括以下步骤：将插入件放置在表面上，使得插入件的第一端抵靠表面; 将所述腔室放置在所述表面上，由此所述插入件延伸穿过其中的开口; 将螺纹紧固件的第一端穿过插入件穿过表面，从而封闭第一下密封装置; 并且通过用一个螺母密封所述腔室来将所述腔室固定到所述表面上，从而关闭相对于所述腔室的第二密封装置。

10. 发明授权

US08920091B2 Fastener with bilateral seal for liquid immersion cooling applications 有权
标题翻译：用于液浸冷却应用的双边密封件紧固件
公开(公告)号：US08920091B2
公开(公告)日：2014-12-30
申请号：US12150568
申请日：2008-04-29
申请人： Ethan S. Heinrich , Alberto F. Viscarra , Jennifer G. Wensel , Stephen E. Sox
发明人： Ethan S. Heinrich , Alberto F. Viscarra , Jennifer G. Wensel , Stephen E. Sox
IPC分类号： F16B5/00 , F16B5/02 , F16B43/00 , F16B33/00 , H05K7/20
CPC分类号： F16B5/0275 , F16B33/006 , F16B43/001 , H05K7/20236
摘要： A fastener assembly including an elongate fastener adapted to extend through a chamber having a longitudinal axis, a first end and a second end; a first seal disposed at least partially at the first end of the fastener to prevent leakage of fluid from the chamber; and a second seal disposed at least partially at the second end of the fastener to prevent leakage of fluid from the chamber. In a specific embodiment, the first and second seals are conical seals and a third seal is provided by a gasket. The invention also provides a method for securing a fluid filled chamber to a surface by using embodiments of the fastener assembly.
摘要翻译：一种紧固件组件，包括适于延伸通过具有纵向轴线的腔室的细长紧固件，第一端部和第二端部; 至少部分地设置在紧固件的第一端处的第一密封件，以防止流体从腔室泄漏; 以及至少部分地设置在紧固件的第二端处的第二密封件，以防止流体从腔室泄漏。在具体实施例中，第一和第二密封件是圆锥形密封件，第三密封件由垫圈提供。本发明还提供了一种通过使用紧固件组件的实施例来将流体填充腔固定到表面的方法。

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