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    • 9. 发明授权
    • Interposable heat sink for adjacent memory modules
    • 相邻内存模块的可插入散热片
    • US07339793B2
    • 2008-03-04
    • US11748020
    • 2007-05-14
    • Jimmy G. Foster, Sr.Michael S. JuneAlbert V. MakleyJason A. Matteson
    • Jimmy G. Foster, Sr.Michael S. JuneAlbert V. MakleyJason A. Matteson
    • H05K7/20
    • H01L23/367G06F1/184G06F1/185G06F1/186G06F1/20H01L2924/0002H01L2924/00
    • A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
    • 用于常规存储器模块(例如DIMM)的散热装置,其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离,使得当放置在相邻的存储器模块之间时,弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物,用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时,单个散热器件便于从两个相邻的存储器模块散热。