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1. 发明授权

US06295724B1 Apparatus for printed circuit board repair 失效
标题翻译：印刷电路板维修装置
公开(公告)号：US06295724B1
公开(公告)日：2001-10-02
申请号：US09428750
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： B23P1900
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译：一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

2. 发明授权

US6018866A Apparatus and method for printed circuit board repair 失效
公开(公告)号：US6018866A
公开(公告)日：2000-02-01
申请号：US23552
申请日：1998-02-13
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01L23/12 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/46 , B23P19/00
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

3. 发明授权

US5809641A Method for printed circuit board repair 失效
标题翻译：印刷电路板修理方法
公开(公告)号：US5809641A
公开(公告)日：1998-09-22
申请号：US637947
申请日：1996-04-25
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01L23/12 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/46
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译：一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

4. 发明授权

US06437254B1 Apparatus and method for printed circuit board repair 失效
标题翻译：印刷电路板修理的装置和方法
公开(公告)号：US06437254B1
公开(公告)日：2002-08-20
申请号：US09938402
申请日：2001-08-24
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01R909
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译：一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

5. 发明授权

US6115912A Apparatus and method for printed circuit board repair 有权
公开(公告)号：US6115912A
公开(公告)日：2000-09-12
申请号：US428751
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01L23/12 , H05K3/00 , H05K3/22 , H05K3/34 , H05K3/42 , H05K3/46
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

6. 发明授权

US6141866A Universal tool for uniformly applying a force to a plurality of components on a circuit board 失效
标题翻译：用于对电路板上的多个部件均匀施加力的通用工具
公开(公告)号：US6141866A
公开(公告)日：2000-11-07
申请号：US30447
申请日：1998-02-25
申请人： James Westcott Heater , Allen Thomas Mays , John Gillette Davis
发明人： James Westcott Heater , Allen Thomas Mays , John Gillette Davis
IPC分类号： H01L21/48 , H05K13/04 , B23P19/04
CPC分类号： H05K13/046 , H01L21/4882 , Y10S269/903 , Y10T29/4913 , Y10T29/53057 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A multiple force tool for applying pressure to circuit components during a manufacturing operation. A plurality of compressed air pressure cylinders are supported on a plurality of horizontal arms over a circuit board. A pressure foot of each compressed air pressure cylinder is extendable when an air controller foot switch is depressed. Positioning of each of the cylinders is afforded along two axes, so that the cylinders may be positioned over components which are to be pressed against the circuit board. Heat sinks may be pressed against components located on the circuit board to bond the heat sinks to the components.
摘要翻译：用于在制造操作期间向电路部件施加压力的多重力工具。多个压缩空气压力缸被支撑在电路板上的多个水平臂上。当压缩空气控制器脚踏开关时，每个压缩空气压力缸的压脚可以延伸。沿着两个轴提供每个气缸的定位，使得气缸可以定位在要抵靠电路板的部件上。散热器可以压在位于电路板上的部件上，以将散热片粘接到部件上。

7. 发明授权

US06471117B1 Transfer fluxing method and apparatus for component placement on substrate 失效
标题翻译：用于组件放置在衬底上的转移助熔方法和装置
公开(公告)号：US06471117B1
公开(公告)日：2002-10-29
申请号：US09434576
申请日：1999-11-04
申请人： John Gillette Davis , Allen Thomas Mays , Kris Allen Slesinger
发明人： John Gillette Davis , Allen Thomas Mays , Kris Allen Slesinger
IPC分类号： B23K120
CPC分类号： B23K3/082
摘要： A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.
摘要翻译：提供了一种转移助熔设备。该装置是用于保持焊剂的助焊剂储存器，附接到助熔剂储存器中的开口的顺应性垫，以及用于控制助熔剂在顺应性垫上沉积的装置。该装置可以附接到自动化部件放置机器上。在本发明的优选实施例中，控制装置是位于通量储存器内的阀。通过向穿过柔性垫的柱塞施加压力来打开阀。当柱塞被按压时，阀打开，并且助焊剂落到柔性垫上。然后，焊剂通过焊盘到组件放置位置。还提供了一种用于自动熔化和部件放置的方法。

8. 发明授权

US5924622A Method and apparatus for soldering ball grid array modules to substrates 失效
标题翻译：将球栅阵列模块焊接到基板的方法和装置
公开(公告)号：US5924622A
公开(公告)日：1999-07-20
申请号：US683767
申请日：1996-07-17
申请人： John Gillette Davis , Joseph Michael Kielbasa
发明人： John Gillette Davis , Joseph Michael Kielbasa
IPC分类号： H01L21/60 , B23K3/06 , B23K35/02 , B23K35/14 , H05K3/32 , H05K3/34 , H05K3/36 , B23K1/00 , B23K3/00
CPC分类号： H05K3/321 , B23K3/0623 , B23K3/0638 , H05K3/3436 , H05K3/3484 , B23K2201/42 , B23K35/025 , H05K2201/10378 , H05K2201/10424 , H05K2203/0485 , H05K3/3478 , Y02P70/613 , Y10T156/10
摘要： A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.
摘要翻译：提供了一种用于将具有焊接材料的球栅阵列或列格栅阵列的模块附接到以给定图案或覆盖区布置的模块的方法和装置，其具有以相同图案排列的连接器焊盘阵列的基板。预成型的对准装置具有与模块上的球栅阵列或列图案相同的图案或覆盖区中的通孔阵列，以及衬底上的接触焊盘图案。预制件中的通孔填充有可以是焊膏或固体焊料或可固化导电粘合剂的焊料材料。焊料优选是铅锡共晶体，但是在任何情况下都具有小于约240℃的熔点，并且在导电粘合剂的情况下，将在低于约240℃下固化。在固体焊料的情况下，焊剂材料的薄膜可以施加到预成型件的相对面上，以防止焊料从其中移出，并且当焊料回流时用作焊剂。

9. 发明授权

US06196444B1 Method and apparatus for soldering ball grid array modules to substrates 失效
公开(公告)号：US06196444B1
公开(公告)日：2001-03-06
申请号：US09280467
申请日：1999-03-30
申请人： John Gillette Davis , Joseph Michael Kielbasa
发明人： John Gillette Davis , Joseph Michael Kielbasa
IPC分类号： B23K3102
CPC分类号： H05K3/321 , B23K3/0623 , B23K3/0638 , B23K35/025 , B23K2101/42 , H05K3/3436 , H05K3/3478 , H05K3/3484 , H05K2201/10378 , H05K2201/10424 , H05K2203/0485 , Y02P70/613 , Y10T156/10
摘要： A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads. Heat is applied to reflow the solder or cure the adhesive in the holes to join the module to the substrate. Depending upon the composition of the solder of the balls or columns, they might or might not melt. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

10. 发明授权

US07150096B1 Universal tool for uniformly applying a force to a plurality of components on a circuit board 失效
标题翻译：用于对电路板上的多个部件均匀施加力的通用工具
公开(公告)号：US07150096B1
公开(公告)日：2006-12-19
申请号：US09619701
申请日：2000-07-19
申请人： James Westcott Heater , Allen Thomas Mays , John Gillette Davis
发明人： James Westcott Heater , Allen Thomas Mays , John Gillette Davis
IPC分类号： H05K3/30 , B23P19/00
CPC分类号： H05K13/046 , H01L21/4882 , Y10S269/903 , Y10T29/4913 , Y10T29/53057 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of horizontal arms along different axes over a circuit board. Compressed air is supplied simultaneously to each of the cylinders, and the cylinders force the component onto a bonding position on the circuit board. The method permits heat sinks to be pressed against components located on the circuit board to bond the heat sinks to the components.
摘要翻译：一种在制造操作期间向电路部件施加压力的方法。该方法利用多个压缩空气压力缸，其在电路板上沿着不同的轴被支撑在多个水平臂上。压缩空气同时供给到每个气缸，并且气缸将部件压在电路板上的接合位置。该方法允许将散热器压在位于电路板上的部件上，以将散热片连接到部件上。

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