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1. 发明授权

US08197124B2 Heat flow measurement tool for a rack mounted assembly of electronic equipment 有权
标题翻译：用于电子设备机架安装组件的热流测量工具
公开(公告)号：US08197124B2
公开(公告)日：2012-06-12
申请号：US12365990
申请日：2009-02-05
申请人： Alan Claassen , Dennis John Hansen , Cary Michael Huettner , Madhusudan K Iyengar , Roger R Schmidt , Kenneth Robert Schneebeli , Gerard Vincent Weber, Jr.
发明人： Alan Claassen , Dennis John Hansen , Cary Michael Huettner , Madhusudan K Iyengar , Roger R Schmidt , Kenneth Robert Schneebeli , Gerard Vincent Weber, Jr.
IPC分类号： G01K17/08 , G01K13/02
CPC分类号： G01K17/10 , G06F1/20
摘要： A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values.
摘要翻译：用于确定物理值（包括空气流量和热负荷）的机架安装组件测量工具包括前部组件和后部管道组件，其非侵入地且可释放地安装在这种机架安装外壳的前部和后部。在多个垂直位置处感测物理值，以确定外壳内的整体和局部热负荷。前传感器值被收集并从前组件无线地传输到支持在后导管上的接收器/处理器，该接收器/处理器生成除了感测值之外显示的计算值。

2. 发明授权

US08164897B2 Airflow recirculation and cooling apparatus and method for an electronics rack 有权
标题翻译：用于电子机架的气流再循环和冷却装置及方法
公开(公告)号：US08164897B2
公开(公告)日：2012-04-24
申请号：US12708792
申请日：2010-02-19
申请人： David P. Graybill , Madhusudan K Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt
发明人： David P. Graybill , Madhusudan K Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20745 , H05K7/20836
摘要： An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.
摘要翻译：提供了一种便于冷却数据中心的电子机架的装置。该装置包括：气流导向器，其安装到电子机架，以将从电子机架排出的气流重新定向到机架的空气入口侧的气流返回路径; 设置在所述气流返回路径内的空气对液体热交换器，用于在退出到所述齿条的空气入口侧附近的数据中心之前冷却重新导向的气流; 用于监测重定向气流的空气温度的空气温度传感器; 以及与气流导向器相关联的自动隔离门，用于根据重定向气流的温度自动阻止从电子机架的空气出口侧排出的气流通过气流返回通道返回到机架的进气侧，温度阈值。

3. 发明授权

US07086247B2 Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack 有权
标题翻译：使用辅助热电容器单元的冷却系统和方法便于电子机架的连续运行
公开(公告)号：US07086247B2
公开(公告)日：2006-08-08
申请号：US10930079
申请日：2004-08-31
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25D23/12
CPC分类号： H01L23/4275 , F28D20/021 , H01L2924/0002 , H05K7/20654 , Y02E60/145 , H01L2924/00
摘要： A cooling approach is provided for cooling an electronics subsystem, such as an electronics rack. The cooling approach includes a coolant conditioning unit and a thermal capacitor unit. The coolant conditioning unit has a heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop receives facility coolant from a facility coolant source and passes at least a portion thereof to the heat exchanger. The second cooling loop provides system coolant to the electronics subsystem, and expels heat in the heat exchanger from the electronics subsystem to the facility coolant in the first cooling loop. The thermal capacitor unit is in fluid communication with the second cooling loop to maintain temperature of the system coolant within a defined range for a period of time upon shutdown or failure of the facility coolant in the first cooling loop, thereby allowing continued operation of the electronics subsystem.
摘要翻译：提供冷却方法来冷却诸如电子机架的电子子系统。冷却方式包括冷却剂调节单元和热电容器单元。冷却剂调节单元具有热交换器，第一冷却回路和第二冷却回路。第一冷却回路从设备冷却剂源接收设备冷却剂，并将其至少一部分通到热交换器。第二冷却回路将系统冷却剂提供给电子子系统，并将热交换器中的热量从电子系统排出到第一冷却回路中的设备冷却剂。热电容器单元与第二冷却回路流体连通，以在第一冷却回路中的设备冷却剂关闭或故障时将系统冷却剂的温度维持在限定范围内一段时间，从而允许电子装置的继续运行子系统。

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