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1. 发明授权

US08268940B2 Flame-retardant adhesive resin composition and adhesive film using the same 有权
标题翻译：阻燃粘合剂树脂组合物和使用其的粘合膜
公开(公告)号：US08268940B2
公开(公告)日：2012-09-18
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
IPC分类号： C08L63/00 , C08L79/08 , C08L83/10 , B32B27/28 , B32B27/38
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译：公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。还公开了由所述组合物制备的粘合膜。阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

2. 发明申请

US20100063217A1 FLAME-RETARDANT ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM USING THE SAME 有权
标题翻译：阻燃粘合剂树脂组合物和粘合膜使用相同
公开(公告)号：US20100063217A1
公开(公告)日：2010-03-11
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
IPC分类号： C09J139/00
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译：公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。还公开了由所述组合物制备的粘合膜。阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

3. 发明授权

US08546510B2 Crystalline resin cured product, crystalline resin composite material, and method for producing the same 失效
标题翻译：结晶性树脂固化物，结晶性树脂复合材料及其制造方法
公开(公告)号：US08546510B2
公开(公告)日：2013-10-01
申请号：US12312369
申请日：2007-11-08
申请人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara , Tomomi Fukunaga
发明人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara , Tomomi Fukunaga
IPC分类号： C08G59/00 , C08G65/38 , C08G59/50 , C08L63/00
CPC分类号： C08G59/245 , C08G59/5033 , C08G59/621 , C08G63/42
摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
摘要翻译：提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。

4. 发明申请

US20100016473A1 CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME 失效
标题翻译：结晶树脂固化产品，结晶树脂复合材料及其制造方法
公开(公告)号：US20100016473A1
公开(公告)日：2010-01-21
申请号：US12312369
申请日：2007-11-08
申请人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara , Tomomi Fukunaga
发明人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara , Tomomi Fukunaga
IPC分类号： C08L63/00 , C08G59/06
CPC分类号： C08G59/245 , C08G59/5033 , C08G59/621 , C08G63/42
摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.
摘要翻译：提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。

5. 发明申请

US20100016498A1 Epoxy resin composition and cured article thereof 审中-公开
标题翻译：环氧树脂组合物及其固化制品
公开(公告)号：US20100016498A1
公开(公告)日：2010-01-21
申请号：US11919587
申请日：2006-05-08
申请人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara
发明人： Masashi Kaji , Koichiro Ogami , Kazuhiko Nakahara
IPC分类号： C08L63/00
CPC分类号： C08G59/245 , C08G59/621 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ≧0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ≧0 and m is an integer of 1-3).
摘要翻译：公开了一种环氧树脂组合物，其具有高导热性和低热膨胀性，并且当应用于半导体器件或印刷线路板的封装时，能够有效地散热并显示良好的尺寸稳定性。环氧树脂组合物由50重量％以上的环氧树脂配制，其为由以下通式（1）表示的二苯醚型环氧树脂（其中n为≥0的数，m为1- 3）和20重量％以上的固化剂，其为由以下通式（2）表示的二苯醚型酚醛树脂（其中n为≥0的数，m为1-3的整数）。

6. 发明授权

US5834570A Epoxy resin composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US5834570A
公开(公告)日：1998-11-10
申请号：US917745
申请日：1997-08-27
申请人： Masashi Kaji , Takanori Aramaki , Kazuhiko Nakahara , Hisayuki Nagino
发明人： Masashi Kaji , Takanori Aramaki , Kazuhiko Nakahara , Hisayuki Nagino
IPC分类号： C08G59/24 , C08F283/00
CPC分类号： C08G59/245
摘要： An epoxy resin composition of this invention is obtained by solidifying epoxy resins represented by the following general formula (1) (wherein G is glycidyl group and R.sup.1 to R.sup.8 are hydrogen atoms, halogen atoms or hydrocarbon groups with 1 to 6 carbon atoms, and n is an integer of 0 to 10) by crystallization and adding epoxy resin curing agents to the resulting solid. It shows good flow and low moisture absorption, cures with excellent heat resistance at soldering temperature and is useful for a variety of applications, in particular, for encapsulating semiconductor devices. ##STR1##
摘要翻译：本发明的环氧树脂组合物是将下述通式（1）表示的环氧树脂（其中，G为缩水甘油基，R1〜R8为氢原子，卤素原子或碳原子数为1〜6的烃基）和n 为0〜10的整数），并向所得固体添加环氧树脂固化剂。它表现出良好的流动性和低吸湿性，在焊接温度下具有优异的耐热性，并且可用于各种应用，特别是用于封装半导体器件。（1）

7. 发明申请

US20130129264A1 LUBRICANT COMPOSITION FOR LOW-FRICTION SLIDING MATERIAL AND SLIDING MECHANISM USING SAME 审中-公开
标题翻译：用于低摩擦滑动材料和滑动机构的润滑剂组合物
公开(公告)号：US20130129264A1
公开(公告)日：2013-05-23
申请号：US13700814
申请日：2011-06-01
申请人： Nobuaki Watanabe , Masashi Kaji , Masanori Tsujioka , Koji Miyake
发明人： Nobuaki Watanabe , Masashi Kaji , Masanori Tsujioka , Koji Miyake
IPC分类号： C10M135/02 , C10M133/44 , C10M133/02
CPC分类号： C10M135/02 , C10M133/02 , C10M133/44 , C10M159/18 , C10M163/00 , C10M2203/1006 , C10M2207/262 , C10M2207/289 , C10M2209/084 , C10M2215/064 , C10M2215/28 , C10M2219/044 , C10M2219/068 , C10M2223/045 , C10M2227/066 , C10N2210/06 , C10N2220/021 , C10N2220/022 , C10N2230/06 , C10N2230/42 , C10N2230/43 , C10N2230/74 , C10N2240/10 , C10N2280/00 , C23C16/27 , F16C33/043 , F16C33/109 , C10N2210/02 , C10N2260/14
摘要： A lubricant oil composition containing an organic molybdenum compound which contains at least either one of a nitrogen (N) atom and an oxygen (O) atom in the molecule thereof and which may optionally contain a sulfur (S) atom, wherein a sulfur content of the organic molybdenum compound is 0.5% by mass or less based on the organic molybdenum compound. The lubricant oil composition, when used as a lubricant oil for a low-friction sliding material, exhibits an extremely low friction coefficient. A sliding mechanism having excellent low-friction property and wear resistance can be provided by combining the lubricant oil composition and a sliding member having a DLC film on its sliding face.
摘要翻译：一种含有有机钼化合物的润滑油组合物，其在分子中含有氮（N）原子和氧（O）原子中的至少一个），并且可任选地含有硫（S）原子，其中硫含量有机钼化合物相对于有机钼化合物为0.5质量％以下。当用作低摩擦滑动材料的润滑油时，润滑油组合物表现出极低的摩擦系数。通过在其滑动面上组合润滑油组合物和具有DLC膜的滑动构件，可以提供具有优异的低摩擦性能和耐磨性的滑动机构。

8. 发明申请

US20130005624A1 LUBRICANT COMPOSITION 有权
标题翻译：润滑剂组合物
公开(公告)号：US20130005624A1
公开(公告)日：2013-01-03
申请号：US13583738
申请日：2011-03-10
申请人： Hideki Kamano , Masashi Kaji
发明人： Hideki Kamano , Masashi Kaji
IPC分类号： C10M133/44 , C10M135/26 , C10M135/10 , C10M133/42 , C10M133/22 , C10M135/16 , C10M135/36 , C10M135/22 , C10M133/28
CPC分类号： C10M141/08 , C10M2203/1025 , C10M2215/086 , C10M2215/222 , C10M2215/223 , C10M2215/28 , C10M2219/022 , C10M2219/024 , C10M2219/066 , C10M2219/082 , C10M2219/085 , C10M2219/09 , C10M2219/106 , C10M2223/045 , C10N2230/04 , C10N2230/06 , C10N2230/12 , C10N2230/42 , C10N2230/43 , C10N2230/45 , C10N2240/10 , C10N2240/102 , C10N2240/104
摘要： A lubricant oil composition which is excellent in deposition resistance, corrosion resistance and wear resistance, despite its low phosphorus content and low sulfuric acid ash content, is provided by using a succinimide compound in combination with at least one selected from specific sulfur-containing compounds, specific heterocyclic compounds and reaction products thereof.
摘要翻译：通过使用琥珀酰亚胺化合物与至少一种选自特定的含硫化合物的组合，提供耐沉积性，耐腐蚀性和耐磨性优异的润滑油组合物，尽管其含量低，硫酸灰分低，特定杂环化合物及其反应产物。

9. 发明授权

US5223602A Naphthol aralkyl resins and cured products thereof 失效
标题翻译：萘酚芳烷基树脂及其固化产物
公开(公告)号：US5223602A
公开(公告)日：1993-06-29
申请号：US823957
申请日：1992-01-24
申请人： Masashi Kaji , Takanori Aramaki , Norito Nakahara , Yasuharu Yamada
发明人： Masashi Kaji , Takanori Aramaki , Norito Nakahara , Yasuharu Yamada
IPC分类号： C08G18/64 , C08G61/02 , C08L63/00
CPC分类号： C08G61/02 , C08G18/64 , C08L63/00
摘要： This invention relates to naphthol aralkyl resins of the general formula (I) ##STR1## in which A is a naphthalene nucleus, R is hydrogen or methyl, and n is an integer from 0 to 15 and cured products thereof, which are highly heat- and moisture-resistant, possess excellent impact strength and other mechanical properties, and are useful for such applications as lamination, molding, casting, and adhesion.
摘要翻译：本发明涉及通式（I）的化合物（I）的萘酚芳烷基树脂，其中A为萘核，R为氢或甲基，n为0至15的整数，其固化产物为具有高耐热和耐湿性，具有优异的冲击强度和其他机械性能，可用于层压，模塑，铸造和粘合等应用。

10. 发明申请

US20050131167A1 Indole resins epoxy resins and resin compositions containing the same 有权
标题翻译：吲哚树脂环氧树脂和含有它们的树脂组合物
公开(公告)号：US20050131167A1
公开(公告)日：2005-06-16
申请号：US10504272
申请日：2003-02-10
申请人： Masashi Kaji , Hisashi Yamada
发明人： Masashi Kaji , Hisashi Yamada
IPC分类号： C07D209/08 , C08G59/50 , C08G61/12 , C08G73/06 , C08L61/04 , C08L63/00 , C08L65/00 , H05K1/03
CPC分类号： C08G73/0672 , C07D209/08 , C08G59/506 , C08G61/122 , C08G61/124 , C08L61/04 , C08L63/00 , C08L65/00 , H05K1/0326
摘要： This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.
摘要翻译：本发明涉及含有吲哚作为结构单元的环氧树脂，吲哚树脂和含有所述环氧树脂和吲哚树脂的树脂组合物，由于其优异的阻燃性，粘合性，耐湿性和热性，它们可用于层压，模塑，铸造和粘合等应用抵抗性。本发明的吲哚树脂和由其获得的环氧树脂由以下通式I和II表示，其中R 1是H，烷基等，X是由-C（ R 2 R 3） - 或C（R 4 R 5） - Ar-C（R a SUB >其中R 2〜R 5是H，烷基等，Ar是苯或联苯环），G为缩水甘油基，n为1-20的整数。

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