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1. 发明授权

US4296219A Bismide-ether compounds, compositions thereof, and method of producing same 失效
标题翻译：二苯醚类化合物及其组合物及其制备方法
公开(公告)号：US4296219A
公开(公告)日：1981-10-20
申请号：US5233
申请日：1979-01-22
申请人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Akio Nishikawa
发明人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Akio Nishikawa
IPC分类号： C07D207/44 , C07D207/448 , C08G73/12
CPC分类号： C07D207/448 , C08G73/121
摘要： A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.
摘要翻译：通过使烯键式不饱和二羧酸酐，二胺化合物和分子中至少两个羟基的酚类化合物反应，或者使酸酐与二胺化合物的预聚物与酚类化合物：其中R1是含有至少两个碳原子的基团，R2是含有至少两个碳原子的基团，R'2是含有至少两个碳原子的基团和碳 - 碳双键，R3 是芳族基团，酰亚胺环的氮原子直接连接到基团R1的不同碳原子上，酰亚胺环的羰基直接连接到基团R 2或R'2的不同碳原子上，氧原子在基团R 2和R 3直接连接到基团R 3的芳香环上，且n是0，1或1以上的整数。

2. 发明授权

US4346206A Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture 失效
标题翻译：由环氧化合物与双酰亚胺/二胺反应混合物反应的酰亚胺预聚物
公开(公告)号：US4346206A
公开(公告)日：1982-08-24
申请号：US176740
申请日：1980-08-11
申请人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
发明人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
IPC分类号： C08G59/00 , C08G59/40 , C08G73/00 , C08G73/12 , C08G79/08 , C08L63/00 , H05K1/03 , C08G73/10
CPC分类号： C08G79/08 , C08G59/4042 , C08G73/121 , C08L63/00 , H05K1/0346
摘要： A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
摘要翻译：一种制备热固性酰亚胺型预聚物的方法，其包括在沸点为70〜170℃的有机溶剂的存在下加热双酰亚胺（A）和二胺（B），并将反应混合物加热与环氧化合物（C）。根据本发明方法制备的酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。

3. 发明授权

US4283522A Process for preparing thermosetting prepolymer from mixture of polyfunctional maleimide and bis-maleimide 失效
标题翻译：由多官能马来酰亚胺和双马来酰亚胺的混合物制备热固性预聚物的方法
公开(公告)号：US4283522A
公开(公告)日：1981-08-11
申请号：US71518
申请日：1979-08-31
申请人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Kenji Tsukanishi
发明人： Akio Takahashi , Yutaka Itoh , Motoyo Wajima , Hirosada Morishita , Kenji Tsukanishi
IPC分类号： C08G73/12 , C08J5/24 , C08G69/26 , C08G73/10
CPC分类号： C08G73/121
摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises heating (A) a polyfunctional maleimide compound derived from a polyamine prepared from aniline and formalin, (B) a bis-maleimide and (C) a diamine. The thermosetting maleimide type prepolymer prepared according to the process of the present invention is excellent in solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having excellent heat resisting properties.
摘要翻译：一种制备热固性马来酰亚胺型预聚物的方法，其包括加热（A）由苯胺和福尔马林制备的多胺衍生的多官能马来酰亚胺化合物，（B）双马来酰亚胺和（C）二胺。根据本发明的方法制备的热固性马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中的溶解性优异，可以低成本获得。因此，预聚物有利地用于生产具有优异的耐热性能的层压板。

4. 发明授权

US4400438A Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor 失效
标题翻译：制造阻燃和耐热铜包层压板的方法及其清漆
公开(公告)号：US4400438A
公开(公告)日：1983-08-23
申请号：US249242
申请日：1981-03-30
申请人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
发明人： Akio Takahashi , Yutaka Itoh , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
IPC分类号： B32B15/04 , B32B15/08 , B32B15/088 , B32B27/04 , C08J5/24 , C09D179/08 , H05K1/03 , B32B31/12
CPC分类号： C09D179/085 , B32B27/04 , H05K1/0373 , H05K2201/012 , H05K2203/122 , Y10S428/92 , Y10S428/921 , Y10T428/31681
摘要： A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.
摘要翻译：一种阻燃和耐热铜包覆层压板的制造方法，其特征在于，使用含有少量特定的卤代二苯醚化合物的马来酰亚胺树脂型清漆浸渍基材。根据本发明生产的覆铜层压板可以根据UL 94（垂直燃烧试验）在耐火或阻燃性能方面得到如此提高的等级为94V-0，并且在热量方面基本上不降低耐铜性以及铜箔剥离强度。

5. 发明授权

US4482703A Thermosetting resin composition comprising dicyanamide and polyvalent imide 失效
标题翻译：包含二氰胺和多价酰亚胺的热固性树脂组合物
公开(公告)号：US4482703A
公开(公告)日：1984-11-13
申请号：US435766
申请日：1982-10-20
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： C08G73/00 , C08G73/06 , C08G73/12 , C09D179/08 , C08G73/10
CPC分类号： C08G73/12
摘要： A thermosetting resin composition comprises (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds. A thermosetting prepolymer can be obtained by subjecting the composition to a preliminary reaction with heating to the B stage and this prepolymer can give a cured product having excellent heat resistance of class C and flexibility. An exemplary composition containing 60 parts by wt. of 4,4'-dicyanomidodiphenylmethane and 40 parts by wt. of N,N'-4,4'-diphenylmethane bismaleimide dissolved in methyl Cellosolve is reacted at 70.degree. to 110.degree. C. for about 40 minutes to obtain a prepolymer soluble in methyl ethyl ketone. This prepolymer when admixed with 2-ethyl-4-methyl-imidazole and after removal of the methyl cellusolve will form an insoluble and infusible cured product upon heating at temperatures on the order of 170.degree. to 200.degree. C. for about 80 minutes. The resin composition when admixed with a solvent, is useful for impregnation and when used as a powder, it is useful as a molding resin.
摘要翻译：热固性树脂组合物包含（A）至少一种二氰酰胺化合物和（B）至少一种具有一个或多个不饱和键的多价酰亚胺，并且如果需要（C）至少一种环氧化合物的可聚合化合物，酚类化合物和三烯丙基异氰脲酸酯化合物。通过将加热至B阶段的组合物进行预反应，可以获得热固性预聚物，该预聚物可以得到具有优异的C级耐热性和柔软性的固化产物。含有60重量份的示例性组合物的4,4'-二氰基二苯基甲烷和40重量份。溶解在甲基溶纤剂中的N，N'- 4,4'-二苯基甲烷双马来酰亚胺在70〜110℃下反应约40分钟，得到可溶于甲基乙基酮的预聚物。当与2-乙基-4-甲基 - 咪唑混合并且除去甲基溶液后，该预聚物将在约170℃至200℃的温度下加热约80分钟时形成不溶性和不可渗透的固化产物。当与溶剂混合时，树脂组合物可用于浸渍，并且当用作粉末时，其可用作模制树脂。

6. 发明授权

US4546168A Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound 失效
标题翻译：包含（1）二氰胺，（2）多价酰亚胺和（3）可聚合化合物的热固性树脂组合物
公开(公告)号：US4546168A
公开(公告)日：1985-10-08
申请号：US639092
申请日：1984-08-09
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： C08G73/00 , C08G73/06 , C08G73/12 , C09D179/08 , C08G73/10
CPC分类号： C08G73/12
摘要： A thermosetting resin composition comprising (A) at least one dicyanamide compound and (B) at least one polyvalent imide having one or more unsaturated bonds and, if necessary (C) at least one polymerizable compound of epoxy compounds, phenolic compounds and triallyl isocyanurate compounds, and a prepolymer thereof obtained by subjecting the composition to a preliminary reaction with heating to the B stage can give a cured product having excellent heat resistance of class C and flexibility.

7. 发明授权

US4526835A Multi-layer printed circuit board and process for production thereof 失效
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US4526835A
公开(公告)日：1985-07-02
申请号：US541248
申请日：1983-10-12
申请人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Takeshi Shimazaki , Motoyo Wajima , Hirosada Morishita
IPC分类号： B32B15/04 , B32B15/08 , B32B27/04 , C08G59/40 , C08G59/56 , C08G73/06 , C08J5/24 , C08L79/08 , H01B3/30 , H05K1/03 , H05K3/46 , B32B27/38 , B32B27/28 , C09J5/02
CPC分类号： H05K3/4688 , B32B27/04 , C08G59/4042 , C08G59/56 , C08G73/0644 , C08J5/24 , C08L79/08 , C08L79/085 , H01B3/30 , H05K1/0346 , H05K2201/0154 , H05K2201/09536 , H05K2203/061 , H05K2203/1105 , H05K3/4623 , Y10S428/901 , Y10T428/31511 , Y10T428/31721
摘要： A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.
摘要翻译：一种多层印刷电路板，其通过预浸料树脂片层叠多个单位电路片而制成，所述单元电路板中的固化树脂具有玻璃化转变温度Tg1，所述预浸料树脂片是通过浸渍增强基材树脂组合物，其可在等于或低于固化后的预浸料树脂片中的树脂的Tg1的玻璃化转变温度和Tg2的两倍以上的温度下固化，并且在等于或低于Tg1和Tg2的温度，具有优异的尺寸稳定性，耐热性和通孔可靠性。

8. 发明授权

US4486583A Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound 失效
标题翻译：芳香族氰胺化合物和芳香胺化合物的耐热树脂
公开(公告)号：US4486583A
公开(公告)日：1984-12-04
申请号：US525700
申请日：1983-08-23
申请人： Akio Takahashi , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Hirosada Morishita
发明人： Akio Takahashi , Masahiro Ono , Ritsuro Tada , Motoyo Wajima , Hirosada Morishita
IPC分类号： C08G73/00 , B32B27/04 , C08G73/06 , C08L79/04 , C08G73/08
CPC分类号： C08G73/0644 , Y10T428/31504
摘要： A polymer which has excellent heat resistance and mechanical properties which is useful as a molding material, contains the structural units having the following formulae [I] and [II]: ##STR1## wherein A and B each represents an at least divalent organic group having at least one aromatic ring such as a diphenyl ring; and m and n each represents a number of at least 1. The polymer is used in the form of a solution or varnish as an impregnating, laminating, bonding or film-forming coating or prepreg-forming varnish. A resin composition for forming the polymer contains an aromatic cyanamide compound and an aromatic amine which are reacted to form a prepolymer which, upon heating, is converted into a cured polymer having the structural units of formulae [I] and [II].
摘要翻译：具有优异的耐热性和机械性能的聚合物可用作成型材料，含有具有下式[I]和[II]的结构单元：即具有异质单胺环的聚合物单元（即，具有正常三聚氰胺环的聚合物单元）其中A和B各自表示至少具有至少一个芳环的二价有机基团，例如二苯基环; m和n各自表示至少为1的数量。聚合物以溶液或清漆的形式用作浸渍，层压，粘合或成膜涂层或预浸料形成清漆。用于形成聚合物的树脂组合物含有芳香族氰酰胺化合物和芳族胺，它们反应形成预聚物，其在加热时转化为具有式[I]和[II]结构单元的固化聚合物。

9. 发明授权

US4393188A Thermosetting prepolymer from polyfunctional maleimide and bis maleimide 失效
标题翻译：来自多官能马来酰亚胺和双马来酰亚胺的热固性预聚物
公开(公告)号：US4393188A
公开(公告)日：1983-07-12
申请号：US233746
申请日：1981-02-12
申请人： Akio Takahashi , Motoyo Wajima , Ritsuro Tada , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
发明人： Akio Takahashi , Motoyo Wajima , Ritsuro Tada , Hirosada Morishita , Yutaka Mizuno , Shunya Yokozawa , Kenji Tsukanishi
IPC分类号： C08G73/00 , C08G59/40 , C08G59/50 , C08G59/56 , C08G73/12 , C08J5/24 , H05K1/03 , C08G59/06
CPC分类号： C08G73/12 , C08G59/4042 , C08G59/56 , C08G73/121 , C08J5/24 , H05K1/0346 , Y10T428/31511 , Y10T428/31721
摘要： A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
摘要翻译：一种制备热固性马来酰亚胺型预聚物的方法，其包括使（A）多官能马来酰亚胺化合物，（B）双马来酰亚胺，（C）二胺和（D）环氧化合物反应。根据本发明的方法制备的马来酰亚胺型预聚物在低沸点溶剂如丙酮，甲基乙基酮和甲基溶纤剂中具有快速固化性和优异的溶解性，可以低成本获得。因此，预聚物有利地用于生产具有良好耐热性，低吸湿性和对诸如铜箔的各种基材的良好粘附性的层压板。

10. 发明授权

US4435560A Maleimide: aryloxy diamine resin composition and process for producing same 失效
标题翻译：马来酰亚胺：芳氧基二胺树脂组合物及其制造方法
公开(公告)号：US4435560A
公开(公告)日：1984-03-06
申请号：US300624
申请日：1981-09-09
申请人： Akio Takahashi , Moloyo Wajima , Akio Nishikawa , Hirosada Morishita
发明人： Akio Takahashi , Moloyo Wajima , Akio Nishikawa , Hirosada Morishita
IPC分类号： C08G59/00 , C08G59/18 , C08G59/40 , C08G59/50 , C08G73/00 , C08G73/06 , C08G73/10 , C08G73/12
CPC分类号： C08G73/124 , Y10T428/31721
摘要： The disclosure is concerned with a maleimide-diamine resin composition which is well soluble to a low boiling point solvent and is excellent in heat resistance. The composition is featured by containing a maleimide-diamine adduct having the general formula: ##STR1## wherein A is a mono-, di-, tri- or tetravalent organic group containing at least two carbon atoms, R.sub.1 through R.sub.6 are hydrogen atom, a lower alkyl group, a lower alkoxy group, chlorine atom, bromine atom, trifluoromethyl group, or trichloromethyl group, and m is an integer of 0-4.
摘要翻译：本发明涉及一种易溶于低沸点溶剂且耐热性优异的马来酰亚胺二胺树脂组合物。该组合物的特征在于含有具有以下通式的马来酰亚胺 - 二胺加合物：其中A是含有至少两个碳原子的单，二，三或四价有机基团，R 1至R 6 是氢原子，低级烷基，低级烷氧基，氯原子，溴原子，三氟甲基或三氯甲基，m是0-4的整数。

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