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1. 外观设计

USD624887S1 Light emitting diode module 有权
公开(公告)号：USD624887S1
公开(公告)日：2010-10-05
申请号：US29358967
申请日：2010-04-02
申请人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa
设计人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa

2. 外观设计

USD624889S1 Light emitting diode module 有权
公开(公告)号：USD624889S1
公开(公告)日：2010-10-05
申请号：US29358970
申请日：2010-04-02
申请人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa
设计人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa

3. 外观设计

USD624888S1 Light emitting diode module 有权
标题翻译：发光二极管模块
公开(公告)号：USD624888S1
公开(公告)日：2010-10-05
申请号：US29358969
申请日：2010-04-02
申请人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa
设计人： Akimichi Takahashi , Kazuto Morikawa , Yusuke Shibahara , Kozo Ogawa

4. 外观设计

USD625694S1 Light emitting diode module 有权
公开(公告)号：USD625694S1
公开(公告)日：2010-10-19
申请号：US29353209
申请日：2010-01-05
申请人： Kazuto Morikawa , Yusuke Shibahara , Akimichi Takahashi
设计人： Kazuto Morikawa , Yusuke Shibahara , Akimichi Takahashi

5. 发明申请

US20100219735A1 LIGHTING DEVICE AND LIGHTING FIXTURE 失效
标题翻译：照明设备和照明设备
公开(公告)号：US20100219735A1
公开(公告)日：2010-09-02
申请号：US12713230
申请日：2010-02-26
申请人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
发明人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
IPC分类号： H01J61/52
CPC分类号： F21V23/06 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , F21Y2115/30
摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.
摘要翻译：本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部，所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

6. 发明授权

US08760042B2 Lighting device having a through-hole and a groove portion formed in the thermally conductive main body 失效
标题翻译：具有形成在导热性主体中的通孔和槽部的照明装置
公开(公告)号：US08760042B2
公开(公告)日：2014-06-24
申请号：US12713230
申请日：2010-02-26
申请人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
发明人： Makoto Sakai , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Erika Takenaka
IPC分类号： H01J61/52
CPC分类号： F21V23/06 , F21K9/23 , F21K9/238 , F21V3/00 , F21V23/002 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2113/13 , F21Y2115/10 , F21Y2115/30
摘要： A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.
摘要翻译：本发明实施例的照明装置和照明器具包括：导热主体，其在一个端部具有基板支撑部分，并且具有形成在基板支撑部分中的通孔和槽部，所述槽从所述主体的一端部延伸到另一端部，所述槽部从所述通孔连续地延伸，安装有半导体发光装置的基板，并且设置在所述基板支撑部上，电连接器连接到所述半导体发光装置的电源装置，容纳在所述主体中并且被配置为使所述半导体发光装置点亮的电源装置，连接到所述电源装置的电线和所述电连接器，同时插入所述通孔和槽部，以及设置在主体的另一端部并连接到电源装置的基部构件。因此，本发明的该实施例的照明装置和照明器具尺寸减小，被配置为适合于批量生产并且能够产生一定的光通量。

7. 发明申请

US20110074269A1 SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 失效
标题翻译：自封灯和照明设备
公开(公告)号：US20110074269A1
公开(公告)日：2011-03-31
申请号：US12886025
申请日：2010-09-20
申请人： TAKESHI HISAYASU , Kazuto Morikawa , Yusuke Shibahara , Makoto Sakai , Tomohiro Sanpei
发明人： TAKESHI HISAYASU , Kazuto Morikawa , Yusuke Shibahara , Makoto Sakai , Tomohiro Sanpei
IPC分类号： H01J61/52
CPC分类号： F21V3/00 , F21K9/23 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.
摘要翻译：提供具有基体部的基体和设置在基体部的圆周上的多个散热片。在基体的一端侧设置有具有半导体发光元件的发光模块和覆盖发光模块的球面。在基础男孩的另一端设置帽。照明电路容纳在基体和盖之间。从球体到盖的灯总长度为70至120mm，并且每1W向发光组件充电的功率暴露于外部的基体的表面面积为20.5至24.4cm2 / W.

8. 发明授权

US08395304B2 Lamp and lighting equipment with thermally conductive substrate and body 有权
标题翻译：灯具和照明设备带有导热基板和主体
公开(公告)号：US08395304B2
公开(公告)日：2013-03-12
申请号：US12888921
申请日：2010-09-23
申请人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara
发明人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara
IPC分类号： H01J61/52
CPC分类号： F21V19/0055 , F21K9/23 , F21K9/238 , F21V3/00 , F21V19/004 , F21V23/002 , F21V23/006 , F21Y2115/10
摘要： In one embodiment, a lamp includes a thermal conductive hollow base body having a concave container portion, an opening portion formed at one end portion so as to communicate with the container portion and a substrate support portion formed at a peripheral portion of the opening portion. A substrate is formed of one of a thermal conductive metal plate and a thermal conductive insulating plate and including a semiconductor lighting element mounted on one surface. A peripheral portion of the other surface of the substrate is fixed to the substrate support portion so as to cover the opening portion in a thermally conductive state therebetween. A power supply device is accommodated in the container portion of the base body to light on the semiconductor lighting element. A base is provided at the other end portion side of the base body and electrically connected with the power supply device.
摘要翻译：在一个实施例中，灯包括导热中空基体，其具有凹形容器部分，在一个端部形成以与容器部分连通的开口部分和形成在开口部分的周边部分的基板支撑部分。基板由导热金属板和导热绝缘板中的一个形成，并且包括安装在一个表面上的半导体照明元件。基板的另一个表面的周边部分固定到基板支撑部分，以便在其间以导热状态覆盖开口部分。电源装置被容纳在基体的容器部分中以在半导体照明元件上点亮。基座设置在基体的另一端部侧并与电源装置电连接。

9. 发明授权

US08324789B2 Self-ballasted lamp and lighting equipment 失效
标题翻译：自镇流灯和照明设备
公开(公告)号：US08324789B2
公开(公告)日：2012-12-04
申请号：US12886025
申请日：2010-09-20
申请人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara , Makoto Sakai , Tomohiro Sanpei
发明人： Takeshi Hisayasu , Kazuto Morikawa , Yusuke Shibahara , Makoto Sakai , Tomohiro Sanpei
IPC分类号： H01J1/02
CPC分类号： F21V3/00 , F21K9/23 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm2/W.
摘要翻译：提供具有基体部的基体和设置在基体部的圆周上的多个散热片。在基体的一端侧设置有具有半导体发光元件的发光模块和覆盖发光模块的球面。在基础男孩的另一端设置帽。照明电路容纳在基体和盖之间。从球体到盖的灯总长度为70至120mm，并且每1W向发光组件充电的功率暴露于外部的基体的表面面积为20.5至24.4cm2 / W.

10. 发明申请

US20100327751A1 SELF-BALLASTED LAMP AND LIGHTING EQUIPMENT 审中-公开
标题翻译：自封灯和照明设备
公开(公告)号：US20100327751A1
公开(公告)日：2010-12-30
申请号：US12825956
申请日：2010-06-29
申请人： Erika Takenaka , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Mokoto Sakai
发明人： Erika Takenaka , Shigeru Osawa , Yusuke Shibahara , Takeshi Hisayasu , Kazuto Morikawa , Tomohiro Sanpei , Mokoto Sakai
IPC分类号： H01J13/32 , H05B37/02
CPC分类号： F21V23/002 , F21K9/232 , F21K9/233 , F21V3/061 , F21V3/062 , F21V29/773 , F21Y2115/10
摘要： The present invention provides a self-ballasted lamp which efficiently conducts heat of a plurality of LED chips of a light emitting module to its holder, and can prevent the temperature rise of the LED chips. The holder has a base portion, an edge portion provided at one end side of the base portion, which is thick at the base portion side thereof and thin at the distal end side thereof, and heat radiation fins provided at the other end side from the edge part and at the circumference of the base portion. The heat from the semiconductor light emitting elements is conducted from the base portion to the edge part and radiated therefrom. At this time, the edge part is thickened at the base portion side, wherein the thermal capacity is increased, and the heat conduction is improved.
摘要翻译：本发明提供了一种自发镇流灯，其有效地将发光模块的多个LED芯片的热量传导到其保持器，并且可以防止LED芯片的温度升高。保持器具有基部，设置在基部的一端侧的边缘部，其基部侧较厚，其前端侧较薄，并且设置在另一端侧的散热片边缘部分和基部的圆周处。来自半导体发光元件的热量从基部传导到边缘部分并从其辐射。此时，边缘部分在基部侧增厚，其中热容量增加，并且热传导得到改善。

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