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1. 发明授权

US06753815B2 Antenna device 失效
公开(公告)号：US06753815B2
公开(公告)日：2004-06-22
申请号：US10275244
申请日：2003-01-16
申请人： Akihiko Okubora , Takayuki Hirabayashi , Norikazu Nakayama , Hiroyuki Arai
发明人： Akihiko Okubora , Takayuki Hirabayashi , Norikazu Nakayama , Hiroyuki Arai
IPC分类号： H01Q138
CPC分类号： H01Q9/14 , H01Q1/243 , H01Q1/36 , H01Q1/38 , H01Q9/0407 , H01Q9/0442 , H01Q21/30
摘要： The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.

2. 发明授权

US06889155B2 High frequency module board device 失效
公开(公告)号：US06889155B2
公开(公告)日：2005-05-03
申请号：US10416683
申请日：2002-10-03
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： H05K3/46 , H01F17/00 , H01L23/12 , H01L23/498 , H01L23/66 , H01P1/00 , H01P3/08 , H05K1/00 , H05K1/02 , H05K1/16 , H01L27/04
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

3. 发明授权

US06528732B1 Circuit device board, semiconductor component, and method of making the same 失效
标题翻译：电路器件板，半导体元件及其制造方法
公开(公告)号：US06528732B1
公开(公告)日：2003-03-04
申请号：US09642498
申请日：2000-08-18
申请人： Akihiko Okubora , Takayuki Hirabayashi , Hideyuki Shikichi
发明人： Akihiko Okubora , Takayuki Hirabayashi , Hideyuki Shikichi
IPC分类号： H05K114
CPC分类号： H01P1/20327 , H01L23/642 , H01L23/66 , H01L2224/16 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/1305 , H01L2924/3011 , H01L2924/3025 , H01P1/2039 , H05K1/0237 , H05K3/4611 , Y10T29/49126 , H01L2924/00 , H01L2224/05599
摘要： A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11a and 11b incorporating a resonator is joined by a prepreg 13 to a printed board 12 carrying patterns 12a and 12b, which are substantially identical to the patterns 11a and 11b, so that the patterns come opposite to each other. As a grounding conductor is provided on the outer side of each of the printed boards 11 and 12, a band-pass filter having the three-plate structure is completed. The patterns 11a and 12a are connected to each other for determining the signal input while the patterns 11b and 12b are connected to each other for determining the signal output. Accordingly, the frequency response can be obtained at a desired level regardless of the thickness of the prepreg 13.
摘要翻译：具有期望特性的电路器件板通过接合电介质基板而提供。一个载有图案11a和11b的共振器的印刷电路板11由预浸料13连接到承载图案12a和12b的印刷电路板12上，印刷电路板12基本上与图案11a和11b，使得图案彼此相反。由于在每个印刷电路板11和12的外侧设置接地导体，因此完成了具有三板结构的带通滤波器。图案11a和12a彼此连接以确定信号输入，同时图案11b和12b彼此连接以确定信号输出。因此，与预浸料13的厚度无关地，能够以所需的水平获得频率响应。

4. 发明授权

US07187559B2 Circuit board device and its manufacturing method 有权
标题翻译：电路板装置及其制造方法
公开(公告)号：US07187559B2
公开(公告)日：2007-03-06
申请号：US10467473
申请日：2002-12-04
申请人： Takayuki Hirabayashi , Akihiko Okubora
发明人： Takayuki Hirabayashi , Akihiko Okubora
IPC分类号： H05K1/16 , H05K7/06
CPC分类号： H01P1/20363 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L23/552 , H01L23/66 , H01L2221/68345 , H01L2224/16 , H01L2224/16235 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/19011 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01P11/007 , H05K1/16 , H05K1/183 , H05K3/4644 , H05K2201/1006 , Y10T29/49126 , H01L2224/0401
摘要： This invention is a circuit board device having a filter element. It has a base board (4), a circuit part (2) mounted on the base board (4), a filter element (5) arranged between the circuit part (2) and the base board (4), and a semiconductor component (3) mounted on the same plate as the circuit part (2) on the base board (4). The semiconductor component (3) is mounted on a thin plate region (17) that is thinner than a thick plate region (16) having its thickness increased by mounting the circuit part (2) on the base board (4). Thus, the thickness of the whole circuit board device is reduced and the filter element (5) is covered with a sufficiently thick dielectric insulating material so as to prevent deterioration in filter characteristic.
摘要翻译：本发明是一种具有过滤元件的电路板装置。它具有基板（4），安装在基板（4）上的电路部分（2），布置在电路部分（2）和基板（4）之间的滤波元件（5）（3）安装在与基板（4）上的电路部分（2）相同的板上。半导体部件（3）安装在比通过将电路部分（2）安装在基板（4）上而增加厚度的厚板区域（16）的薄板区域（17）上。因此，整个电路板器件的厚度减小，并且过滤元件（5）被足够厚的介电绝缘材料覆盖，以防止过滤器特性的劣化。

5. 发明授权

US07064630B2 High-frequency module and its manufacturing method 失效
标题翻译：高频模块及其制造方法
公开(公告)号：US07064630B2
公开(公告)日：2006-06-20
申请号：US10312248
申请日：2002-04-25
申请人： Takayuki Hirabayashi , Takahiko Kosemura , Akihiko Okubora , Tatsuya Ogino , Kuniyuki Hayashi
发明人： Takayuki Hirabayashi , Takahiko Kosemura , Akihiko Okubora , Tatsuya Ogino , Kuniyuki Hayashi
IPC分类号： H01P1/20
CPC分类号： H05K3/4688 , H01L23/49822 , H01L23/66 , H01L25/16 , H01L2223/6677 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01078 , H01L2924/01087 , H01L2924/15313 , H01L2924/16152 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/165 , H05K3/4602 , H05K3/4652
摘要： The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.
摘要翻译：本发明提供一种其中形成有分布常数电路的高频模块装置，该装置包括：具有高频元件层形成表面（3）的基板（2），其通过在最上层进行平坦化处理而形成在芯板（6）的一个主表面上以多层形式形成具有接地部分的印刷布线层和由介电绝缘材料制成的介电绝缘层的多层印刷布线部分; 以及高频元件层部分（5），其具有无源元件和用于接收功率的电路元件或通过由介电绝缘材料制成的介电绝缘部分从基板（2）提供的信号，在高频基板（2）的元件层形成表面（3）。基板（2）具有由图案布线形成的分布常数电路（4）。

6. 发明授权

US06800936B2 High-frequency module device 有权
标题翻译：高频模块设备
公开(公告)号：US06800936B2
公开(公告)日：2004-10-05
申请号：US10332015
申请日：2003-01-03
申请人： Takahiko Kosemura , Akihiko Okubora , Takayuki Hirabayashi , Tatsuya Ogino , Kuniyuki Hayashi
发明人： Takahiko Kosemura , Akihiko Okubora , Takayuki Hirabayashi , Tatsuya Ogino , Kuniyuki Hayashi
IPC分类号： H01L2324
CPC分类号： H01L23/66 , H01F17/0006 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/01087 , H05K1/165 , H05K3/4602 , H05K3/4664 , H05K3/467 , H05K2201/0195 , H05K2201/09881
摘要： The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).
摘要翻译：本发明提供构成微通信功能模块的高频模块，其包括具有多个图案布线层（6a）（6b）（9a）（9b）和介电绝缘层（5）的基底（2） 8）（11），并且具有用于使其上层平坦化的积层表面和形成在积累表面上的高频元件层（4），该高频元件层（4）具有经由绝缘层形成在其中的电感器（20） 19）形成在积聚表面上。基底基板（2）具有区域（30），其中图形布线层（6a）（6b）（9a）（9b））不沿着厚度方向至少至少其中间部分形成，并且高频元件层（4）的电感器（20）直接形成在区域（30）的正上方。

7. 发明申请

US20050195891A1 High frequency module board device 失效
标题翻译：高频模块板设备
公开(公告)号：US20050195891A1
公开(公告)日：2005-09-08
申请号：US11104039
申请日：2005-04-12
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： H05K3/46 , H01F17/00 , H01L23/12 , H01L23/498 , H01L23/66 , H01P1/00 , H01P3/08 , H05K1/00 , H05K1/02 , H05K1/16 , H04L5/16
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.
摘要翻译：本发明涉及具有用于调制和解调高频信号的高频发射和接收电路的高频模块板装置。高频模块板装置包括：基板（2），其主表面形成为积层面（2a），高频电路部分（3）形成在基板（2）的积聚面上）并形成无源元件。基板（2）具有从第四布线层（8b）不在下层形成配线的区域（29）。高频电路部分（3）在对应于未形成布线的区域（29）的位置具有上电极部分（36）和下电极部分（35）。因此，由于在没有形成配线的区域29的正上方设置电容（18），电容（18）从接地图案（14）接收的寄生电容减少。因此，可以提高电容（18）的特性。

8. 发明授权

US06483403B2 Filter element and fabrication thereof 失效
标题翻译：过滤元件及其制造
公开(公告)号：US06483403B2
公开(公告)日：2002-11-19
申请号：US09374111
申请日：1999-08-16
申请人： Takayuki Hirabayashi , Akihiko Okubora
发明人： Takayuki Hirabayashi , Akihiko Okubora
IPC分类号： H01P1203
CPC分类号： H01P1/2039
摘要： The invention includes a filter element comprising a dielectric substrate and a strip conductive pattern formed on the dielectric substrate. The dielectric substrate has cavities with apertures on the surface of the dielectric substrate. The strip conductive pattern is formed over the apertures of the cavities to serve as inductance. The strip conductive pattern has an approximately uniform line width that effectively improves the production yield and reliability of the filter element.
摘要翻译：本发明包括包含介电基片和形成在所述电介质基板上的带状导体图案的过滤元件。在介质基片具有与所述电介质基板的表面上的孔腔。之上的空腔的孔所形成的条带的导电图案，作为电感。带状导电图案具有大致均匀的线宽，其有效地提高了过滤元件的产量和可靠性。

9. 发明授权

US07366629B2 High frequency module board device 失效
标题翻译：高频模块板设备
公开(公告)号：US07366629B2
公开(公告)日：2008-04-29
申请号：US11104039
申请日：2005-04-12
申请人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
发明人： Tatsuya Ogino , Akihiko Okubora , Takayuki Hirabayashi , Takahiko Kosemura , Kuniyuki Hayashi
IPC分类号： G06F17/50 , G06F17/00
CPC分类号： H05K1/162 , H01F17/0006 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/85399 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19011 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/0224 , H05K1/024 , H05K1/0298 , H05K3/4688 , H05K2201/09672 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.
摘要翻译：本发明涉及具有用于调制和解调高频信号的高频发射和接收电路的高频模块板装置。高频模块板装置包括：基板（2），其主表面形成为集成表面（2a）;以及高频电路部分（3），形成在基板（2）的积聚表面上）并形成无源元件。基板（2）具有从第四布线层（8b）不在下层形成配线的区域（29）。高频电路部分（3）在对应于未形成布线的区域（29）的位置具有上电极部分（36）和下电极部分（35）。因此，由于在没有形成配线的区域29的正上方设置电容（18），电容（18）从接地图案（14）接收的寄生电容减少。因此，可以提高电容（18）的特性。

10. 发明申请

US20070215913A1 Three-dimensional integrated device 失效
标题翻译：三维一体化设备
公开(公告)号：US20070215913A1
公开(公告)日：2007-09-20
申请号：US11715161
申请日：2007-03-07
申请人： Akihiko Okubora
发明人： Akihiko Okubora
IPC分类号： H01L29/80
CPC分类号： H01L25/0657 , H01L23/48 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2924/0002 , H01P1/2005 , H01L2924/00
摘要： A three-dimensional integrated device includes at least two integrated circuit substrates laminated to each other, each of the integrated circuit substrates having at least one ground plane, at least one aperture provided at a desired location in the ground plane, the end of a microstrip line formed in a pair with the ground plane and placed in the aperture, and a transmitter and/or a receiver that is connected to the microstrip line and transmits and/or receives signals at a frequency substantially corresponding to the perimeter λ of the aperture. Each of the apertures in each of the integrated circuit substrates is superimposed on at least one of the apertures in the other integrated circuit substrates in the direction perpendicular to the ground planes, and the signals are transported in a contactless manner between the integrated circuit substrates through the apertures at a frequency substantially corresponding to the perimeter λ of the apertures.
摘要翻译：三维集成装置包括彼此层叠的至少两个集成电路基板，每个集成电路基板具有至少一个接地平面，设置在接地平面中的期望位置处的至少一个孔，微带的端部与接地平面成对配置并放置在孔中的线，以及发射器和/或接收器，其连接到微带线并以基本对应于孔的周长λ的频率发送和/或接收信号。每个集成电路基板中的每个孔径在垂直于接地平面的方向上叠加在其它集成电路基板中的至少一个孔中，并且信号以非接触方式在集成电路基板之间通过孔的频率基本上对应于孔的周长λ。

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