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1. 发明申请

US20100236722A1 PREPREG MANUFACTURING DEVICE 有权
标题翻译： PREPREG制造设备
公开(公告)号：US20100236722A1
公开(公告)日：2010-09-23
申请号：US12681561
申请日：2007-12-25
申请人： Akihiko Machii , Kazunari Imai , Masaaki Hirai
发明人： Akihiko Machii , Kazunari Imai , Masaaki Hirai
IPC分类号： B65H39/04 , B32B38/08 , B32B37/00
CPC分类号： C08J5/24 , B29B15/122 , C08J5/04 , C08J2379/08 , Y10T156/15 , Y10T156/1705 , Y10T156/172
摘要： An extremely practical prepreg manufacturing device whereby a fiber body can be easily impregnated with a high-viscosity, low-concentration thermosetting resin using existing hot-melt method equipment, without having to use a solvent. In a prepreg manufacturing device for manufacturing a prepreg (5) by laminating and heating a resin sheet (4) formed by laminating a resin (3) with a release film (2), a resin sheet feeding mechanism (6) for feeding the resin sheet (4) laminated with a conveyed fiber body (1) comprises a release film feeding part (7) for feeding the release film (2), and a resin application part (8) for applying the resin (3) on the release film (2), the resin (3) containing a solvent. The resin sheet feeding mechanism (6) is configured so that the fiber body (1) is laminated with the resin sheet (4) formed by laminating the resin (3) with the release film (2), without the resin sheet (4) being formed into a roll shape.
摘要翻译：一种非常实用的预浸料制造装置，其中纤维体可以使用现有的热熔方法设备容易地用高粘度，低浓度的热固性树脂浸渍，而不必使用溶剂。在通过层压和加热通过将树脂（3）与剥离膜（2）层压而形成的树脂片（4）制造预浸料（5）的预浸料制造装置中，用于供给树脂的树脂片材进给机构（6）与传送的纤维体（1）层压的片材（4）包括用于供给脱模膜（2）的剥离膜供给部（7）和用于将树脂（3）施加到剥离膜上的树脂施加部（8）（2），含有溶剂的树脂（3）。树脂片材进给机构（6）被构造成使得纤维体（1）与树脂（3）与剥离膜（2）层压而形成的树脂片（4）不具有树脂片（4）形成卷状。

2. 发明授权

US08789571B2 Prepreg manufacturing device 有权
标题翻译：预浸料制造装置
公开(公告)号：US08789571B2
公开(公告)日：2014-07-29
申请号：US12681561
申请日：2007-12-25
申请人： Akihiko Machii , Kazunari Imai , Masaaki Hirai
发明人： Akihiko Machii , Kazunari Imai , Masaaki Hirai
IPC分类号： B29C47/00 , B29C65/18
CPC分类号： C08J5/24 , B29B15/122 , C08J5/04 , C08J2379/08 , Y10T156/15 , Y10T156/1705 , Y10T156/172
摘要： An extremely practical prepreg manufacturing device whereby a fiber body can be easily impregnated with a high-viscosity, low-concentration thermosetting resin using existing hot-melt method equipment, without having to use a solvent. In a prepreg manufacturing device for manufacturing a prepreg (5) by laminating and heating a resin sheet (4) formed by laminating a resin (3) with a release film (2), a resin sheet feeding mechanism (6) for feeding the resin sheet (4) laminated with a conveyed fiber body (1) comprises a release film feeding part (7) for feeding the release film (2), and a resin application part (8) for applying the resin (3) on the release film (2), the resin (3) containing a solvent. The resin sheet feeding mechanism (6) is configured so that the fiber body (1) is laminated with the resin sheet (4) formed by laminating the resin (3) with the release film (2), without the resin sheet (4) being formed into a roll shape.
摘要翻译：一种非常实用的预浸料制造装置，其中纤维体可以使用现有的热熔方法设备容易地用高粘度，低浓度的热固性树脂浸渍，而不必使用溶剂。在通过层压和加热通过将树脂（3）与剥离膜（2）层压而形成的树脂片（4）制造预浸料坯（5）的预浸料制造装置中，用于供给树脂的树脂片材进给机构（6）与传送的纤维体（1）层压的片材（4）包括用于供给脱模膜（2）的剥离膜供给部（7）和用于将树脂（3）施加到剥离膜上的树脂施加部（8）（2），含有溶剂的树脂（3）。树脂片材进给机构（6）被构造成使得纤维体（1）与树脂（3）与剥离膜（2）层压而形成的树脂片（4）不具有树脂片（4）形成卷状。

3. 发明授权

US07007530B2 Bending method and bending device 失效
标题翻译：弯曲方法和弯曲装置
公开(公告)号：US07007530B2
公开(公告)日：2006-03-07
申请号：US10169747
申请日：2001-01-17
申请人： Junichi Koyama , Kazunari Imai , Hitoshi Omata , Osamu Hayama , Hidekatsu Ikeda
发明人： Junichi Koyama , Kazunari Imai , Hitoshi Omata , Osamu Hayama , Hidekatsu Ikeda
IPC分类号： B21D5/02
CPC分类号： B21D5/02 , Y10S72/702
摘要： In bending a workpiece, a position of the workpiece relatively pressed down by a punch is directly detected by a plurality of position detectors provided in a V-groove of a die, and a bending speed calculation section obtains a bending speed from a change in this position. If bending speeds at position of the respective position detectors differ, a uniform speed arithmetic operation section calculates a bending speed to make the bending speeds at the positions of all of the position detectors, and a driving shaft instruction section controls driving shafts to bend the workpiece at the uniform bending speed.
摘要翻译：在弯曲工件时，通过设置在模具的V形槽中的多个位置检测器直接检测由冲头相对压下的工件的位置，并且弯曲速度计算部分从该变形中获得弯曲速度位置。如果各位置检测器的位置的弯曲速度不同，则统一的速度算术运算部分计算弯曲速度，使得弯曲速度在所有位置检测器的位置处，并且驱动轴指令部分控制驱动轴弯曲工件以均匀的弯曲速度。

4. 发明授权

US06832526B2 Bending method and single elongation value specifying device of bending apparatus 有权
标题翻译：弯曲装置的弯曲方法和单伸长值指定装置
公开(公告)号：US06832526B2
公开(公告)日：2004-12-21
申请号：US10311325
申请日：2002-12-30
申请人： Junichi Koyama , Kazunari Imai , Osamu Hayama , Hitoshi Omata
发明人： Junichi Koyama , Kazunari Imai , Osamu Hayama , Hitoshi Omata
IPC分类号： G01N320
CPC分类号： B21D5/02 , B21D5/01
摘要： A bending apparatus for bending a workpiece W according to cooperation of a punch P and a die D previously carries out various step bending or makes simulation of step bending, and calculates an approximation formula based on a correlation between a ratio % of a one-sided elongation value &agr; to a plate thickness t and a step bending angle &thgr; based on a relationship among the plate thickness t, the step bending angle &thgr; and the one-sided elongation value &agr; of the workpiece W so as to store the formula as a database. The more accurate one-sided elongation value &agr; of the step bending is calculated by small parameters including only two data including the plate thickness t and the step bending angle &thgr; previously input at the time of actual bending based on the approximation formula in the data base so that the bending is carried out easily.
摘要翻译：根据冲头P和模具D的协调来弯曲工件W的弯曲装置预先执行各种步骤弯曲或使步进弯曲的模拟，并且基于单侧的比率％之间的相关性来计算近似公式基于板厚度t，阶梯弯曲角度θ和工件W的单面伸长值α之间的关系的板厚度t的延伸值α和阶梯弯曲角度θ，以便将公式存储为数据库。基于数据库中的近似公式，通过小参数（包括仅实际弯曲时预先输入的板厚t和阶梯弯曲角θ）的两个数据计算出步进弯曲的更准确的单侧伸长值α 使得弯曲容易进行。

5. 发明授权

US06730859B2 Substrate for mounting electronic parts thereon and method of manufacturing same 失效
标题翻译：用于在其上安装电子部件的基板及其制造方法
公开(公告)号：US06730859B2
公开(公告)日：2004-05-04
申请号：US09817947
申请日：2001-03-27
申请人： Shigetsugu Muramatsu , Kazunari Imai
发明人： Shigetsugu Muramatsu , Kazunari Imai
IPC分类号： H01R1204
CPC分类号： H05K3/3447 , H05K3/002 , H05K3/0032 , H05K3/0094 , H05K3/4602 , H05K2201/092 , H05K2201/09536 , H05K2201/0959 , H05K2203/1394 , Y10T29/49139
摘要： A substrate for mounting an electronic part or parts thereon, which comprises a core substrate and at least a set of insulation layer and patterned wiring line layer, which is formed on the insulation layer, at at least one side of the core substrate, the core substrate having holes, in each of which a lead pin of the electronic part to be mounted is to be inserted, and being provided with lands which surround the opening of the hole and to which the lead pin inserted in the hole is to be bonded, wherein the insulation layer or layers at at least one side of the core substrate has bores, which expose the land at their bottoms, and communicate with the hole. A method of manufacturing such a substrate is also disclosed.
摘要翻译：一种用于安装其上的电子部件的基板，其包括在所述芯基板的至少一侧上形成在所述绝缘层上的芯基板和至少一组绝缘层和图案化布线线层，所述芯具有孔的基板，其中每个要安装的电子部件的引脚插入，并且设置有围绕孔的开口的焊盘，插入孔中的引脚与引脚抵接，其中所述芯基板的至少一侧的所述绝缘层或多个孔具有孔，其在其底部暴露所述焊盘并与所述孔连通。还公开了制造这种基板的方法。

6. 发明授权

US06410858B1 Multilayered wiring board, a production process for, and semiconductor device using, the same 有权
标题翻译：多层接线板，生产工艺和半导体器件使用，相同
公开(公告)号：US06410858B1
公开(公告)日：2002-06-25
申请号：US09736886
申请日：2000-12-14
申请人： Masayuki Sasaki , Kazunari Imai
发明人： Masayuki Sasaki , Kazunari Imai
IPC分类号： H05K103
CPC分类号： H05K3/4641 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16237 , H01L2224/73204 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/15311 , H05K1/162 , H05K3/20 , H05K3/4602 , H05K2201/0175 , H05K2201/0179 , H05K2201/09309 , H05K2201/09536 , H05K2201/09736 , H05K2203/0152 , Y10T29/435 , H01L2224/05599
摘要： A multilayered wiring board comprising, at least, two wiring layers and an interlaminar insulating layer, in which said wiring board further has, incorporated therein, at least one capacitor element which comprises a sandwiched structure of a lower electrode-forming metallic layer having formed thereon at least one recess portion, a dielectric layer formed over the lower electrode-forming metallic layer, and an upper electrode-forming metallic layer formed over the dielectric layer, and its production process. The semiconductor device comprising the multilayered wiring board having mounted thereon a semiconductor element is also disclosed.
摘要翻译：一种多层布线基板，包括至少两个布线层和层间绝缘层，其中所述布线板还包括至少一个电容器元件，该电容器元件包括形成在其上的下电极形成金属层的夹层结构至少一个凹部，形成在下电极形成金属层上的电介质层和形成在电介质层上的上电极形成金属层及其制造方法。还公开了包括其上安装有半导体元件的多层布线板的半导体器件。

7. 发明授权

US06297553B1 Semiconductor device and process for producing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06297553B1
公开(公告)日：2001-10-02
申请号：US09422746
申请日：1999-10-22
申请人： Michio Horiuchi , Kazunari Imai
发明人： Michio Horiuchi , Kazunari Imai
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , H01L23/3114 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01322 , H01L2924/15174 , H01L2924/15311 , H05K3/3473 , H05K3/4038 , H05K3/423 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2203/0733 , H01L2224/05599
摘要： A semiconductor device that meets the demand for realizing semiconductor chips in small sizes. A semiconductor device in which connection lands 20 formed on the electrode terminal carrying surface of a semiconductor chip 10 are electrically connected, through connection bumps 14, to connection pads 22 formed on one surface of an interposing substrate 12 of an insulating material so as to face the connection lands 20, wherein conductor wiring patterns 24 inclusive of the connection pads 22 are formed on one surface of the interposing substrate 12, conductor wiring patterns 30 inclusive of terminal lands on where the external connection terminals 26 will be mounted, are formed on the other surface of the interposing substrate 12, and the conductor wiring patterns 24 formed on one surface of the interposing substrate 12 are connected to the conductor wiring patterns 30 formed on the other surface of the interposing substrate 12 through vias 32 formed by filling recesses with a metal by plating, the recesses being formed to penetrate through the insulating material of the interposing substrate 12 and permitting the back surfaces of the conductor wiring patterns 24 on the side of the insulating material to be exposed on the bottom surfaces thereof.
摘要翻译：一种满足小尺寸半导体芯片实现需求的半导体器件。形成在半导体芯片10的电极端子承载表面上的连接焊盘20通过连接凸块14电连接到形成在绝缘材料的插入基板12的一个表面上的连接焊盘22的半导体器件，连接焊盘20，其中包括连接焊盘22的导体布线图案24形成在插入基板12的一个表面上，导体布线图案30包括将安装外部连接端子26的端子焊盘的导体布线图案30形成在插入基板12的另一个表面和形成在插入基板12的一个表面上的导体布线图案24通过通孔32连接到形成在插入基板12的另一个表面上的导体布线图案30，通过电镀形成金属，所述凹部形成为穿透插入物的绝缘材料 g基板12，并且使绝缘材料侧的导体布线图案24的背面露出在其底面上。

8. 发明授权

US06285083B1 Semiconductor device and mounting structure of a semiconductor device 失效
标题翻译：半导体器件和半导体器件的安装结构
公开(公告)号：US06285083B1
公开(公告)日：2001-09-04
申请号：US09531376
申请日：2000-03-21
申请人： Kazunari Imai , Shoji Watanabe
发明人： Kazunari Imai , Shoji Watanabe
IPC分类号： H01L2348
CPC分类号： H01L24/12 , H01L23/3114 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/0401 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16225 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/181 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2924/00
摘要： A mounting structure is provided for mounting a semiconductor device having an electrode on a mounting substrate having a conductive pad. A metallic bump electrically connects the electrode of the semiconductor device to the conductive pad. A first eutectic solder is used for soldering between the metallic bump and the electrode of the semiconductor device. A second eutectic solder is used for soldering between the metallic bump and the conductive pad of the substrate. A melting point of the metallic bump is higher than those of the eutectic solders and a resistance to fatigue of the first eutectic solder is higher than that of the second eutectic solder. The first eutectic solder is composed of an Sn component of 63% by mass, a Pb component of 34.3% by mass, an In component of 1% by mass, an Sb component of 0.7% by mass, and an Ag component of 1% by mass.
摘要翻译：提供一种安装结构，用于将具有电极的半导体器件安装在具有导电焊盘的安装基板上。金属凸块将半导体器件的电极与导电焊盘电连接。第一共晶焊料用于焊接金属凸块和半导体器件的电极之间。第二共晶焊料用于在金属凸块和衬底的导电焊盘之间焊接。金属凸块的熔点高于共晶焊料的熔点，第一共晶焊料的耐疲劳性高于第二共晶焊料。第一共晶焊料由以下组成：Sn成分为63质量％，Pb成分为34.3质量％，In成分为1质量％，Sb成分为0.7质量％，Ag成分为1质量％的质量。

9. 发明申请

US20060208374A1 Method of manufacturing lens sheet 审中-公开
标题翻译：制造镜片的方法
公开(公告)号：US20060208374A1
公开(公告)日：2006-09-21
申请号：US11343265
申请日：2006-01-30
申请人： Hiroyuki Shimotsuma , Makoto Soyama , Yukio Asano , Kazunari Imai
发明人： Hiroyuki Shimotsuma , Makoto Soyama , Yukio Asano , Kazunari Imai
IPC分类号： B29D11/00
CPC分类号： B29D11/00269 , B29C33/40 , B29C33/444 , B29C33/50 , B29C35/0888 , B29C39/026 , B29C41/36 , B29C2035/0827 , B29D11/0073 , B29L2011/005
摘要： A method of manufacturing a lens sheet including: a mold making process in which the flexible mold used for molding the lens portion is made; a resin pouring process in which the resin for the lens portion is poured and filled in between the mold and the glass substrate; a resin curing process in which the resin for the lens portion is cured; and a mold releasing process in which the one edge of the mold is pulled up and bended the body thereof to be separated from the glass substrate completely.
摘要翻译：一种制造透镜片的方法，包括：制造用于模制透镜部分的柔性模具的模具制造工艺; 树脂浇注方法，其中将用于透镜部分的树脂注入并填充在模具和玻璃基板之间; 树脂固化工艺，其中用于透镜部分的树脂固化; 以及脱模工序，其中模具的一个边缘被拉起并弯曲其主体以完全与玻璃基板分离。

10. 发明授权

US07040129B2 Sheet working method, sheet working system, and various devices related to such system 失效
公开(公告)号：US07040129B2
公开(公告)日：2006-05-09
申请号：US10169743
申请日：2001-01-16
申请人： Junichi Koyama , Hitoshi Omata , Osamu Hayama , Kazunari Imai , Tokuro Takehara , Tetsuya Anzai
发明人： Junichi Koyama , Hitoshi Omata , Osamu Hayama , Kazunari Imai , Tokuro Takehara , Tetsuya Anzai
IPC分类号： G06F15/46 , B21D28/00 , B30B15/00 , G01B21/08 , B21C51/00
CPC分类号： B21D5/02 , B21D28/12 , B21D28/24 , Y10S72/702
摘要： An actual plate thickness and actual material constants are measured during punching before bending. The measured information is reflected on the bending, so that the bending is performed efficiently and accurately. Punching is carried out for each blank developed based on a nominal plate thickness and nominal material constants in blanking before the bending of a work W. Then, an actual plate thickness distribution and an actual material constant distribution of the work W are calculated based on various data containing a ram stroke and a pressure detected in the punching.

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