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    • 5. 发明授权
    • Bistable fuse by amorphization of polysilicon
    • 双稳态保险丝通过多晶硅非晶化
    • US6117745A
    • 2000-09-12
    • US148260
    • 1998-09-04
    • Srikanth Krishnan
    • Srikanth Krishnan
    • H01L23/525H01L21/20
    • H01L23/5256H01L2924/0002
    • An embodiment of the instant invention is a method of substantially isolating an electrical device over a semiconductor substrate from a structure which collects charge, the method comprising the steps of: forming an insulating layer (layer 304) on the substrate; forming a conductive layer (layer 306) on the insulating layer; incorporating at least one element (element 310) into portions of the conductive layer so as to render that portion the conductive layer more resistive; and wherein the portion of the conductive layer which has been rendered more resistive (region 312) is rendered conductive after one or more charging events by subjecting the portion of the conductive layer to an elevated temperature. Preferably, the element is comprised of an element selected from the group comprised of: As, P, N, Ar, Si, H, B, Ge, C, Sb, F, Cl, O, any noble element, and any combination thereof and their isotopes. The structure which collects charge is, preferably, a conductive structure (structure 11) which collects charge during plasma processing.
    • 本发明的一个实施例是一种从收集电荷的结构基本上隔离半导体衬底上的电子器件的方法,该方法包括以下步骤:在衬底上形成绝缘层(层304); 在绝缘层上形成导电层(层306); 将至少一个元件(元件310)结合到导电层的部分中,以使该部分导电层更具阻性; 并且其中通过使导电层的一部分经历升高的温度,在一个或多个充电事件之后,已经变得更加电阻(区域312)的导电层的部分变得导电。 优选地,元素由选自As,P,N,Ar,Si,H,B,Ge,C,Sb,F,Cl,O,任何贵金属及其任何组合的元素组成 及其同位素。 收集电荷的结构优选地是在等离子体处理期间收集电荷的导电结构(结构11)。