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    • 3. 发明授权
    • Method for aligning semiconductor wafer surface scans and identifying
added and removed particles resulting from wafer handling or processing
    • 用于对准半导体晶片表面扫描并识别由晶片处理或加工产生的添加和去除的颗粒的方法
    • US5870187A
    • 1999-02-09
    • US907589
    • 1997-08-08
    • Yuri UritskyPatrick D. KinneyMan-Ping Cai
    • Yuri UritskyPatrick D. KinneyMan-Ping Cai
    • G01N21/95G01N21/00
    • G01N21/9501
    • An automated method for aligning wafer surface scan maps and locating defects such as particle contaminant distributions on a wafer surface. More specifically, the invention is an automated method for locating added and removed contaminants and other defects on a semiconductor wafer surface after the wafer has undergone wafer-handling and/or processing. A second data set of a second scan of a wafer surface is misalignment-corrected to a first coordinate system of a first scan of the wafer surface. Thereafter, a final match is made between a first data set of the first scan and the misalignment-corrected data of the second scan. Non-matching locations in the misalignment-corrected data of the second scan represent added defects on the surface of the wafer. Non-matching locations in the base data of the first scan represent removed defects from the surface of the wafer.
    • 用于对准晶片表面扫描图并定位诸如颗粒污染物分布在晶片表面上的缺陷的自动化方法。 更具体地,本发明是一种自动化方法,用于在晶片经过晶片处理和/或处理之后,在半导体晶片表面上定位添加和去除的污染物和其它缺陷。 晶片表面的第二次扫描的第二数据组对于晶片表面的第一次扫描的第一坐标系进行未对准校正。 此后,在第一扫描的第一数据集和第二扫描的未对准校正数据之间进行最终匹配。 第二扫描的未对准校正数据中的非匹配位置表示晶片表面上的附加缺陷。 第一次扫描的基础数据中的非匹配位置表示从晶片表面去除的缺陷。
    • 10. 发明授权
    • Optical inspection module and method for detecting particles and defects
on substrates in integrated process tools
    • 用于检测集成工艺工具中基板上的颗粒和缺陷的光学检测模块和方法
    • US5909276A
    • 1999-06-01
    • US50267
    • 1998-03-30
    • Patrick D. KinneyNagaraja P. Rao
    • Patrick D. KinneyNagaraja P. Rao
    • G01N21/956G01N21/94G06T1/00H01L21/66G01N21/00
    • G01N21/94G01N21/9501H01L22/12
    • An optical inspection module detects defects on an active surface of a substrate in an integrated process tool system. The optical inspection module includes an enclosure, a substrate holder, a light source, a light beam path, a lens and a photodetector array. The light source has a light beam port. The light beam path extends from the light beam port to the substrate holder and has a grazing angle of incidence with respect to the active surface of the substrate. The light beam path illuminates substantially the entire active surface. The lens is oriented to collect non-secularly reflected light scattered from the light beam path by any defects on the active surface. The photodetector array has a plurality of pixels which are positioned within a focal plane of the lens. Each pixel corresponds to an area on the active surface, and the plurality of pixels together form a field of view that covers substantially the entire active surface.
    • 光学检查模块检测集成处理工具系统中的基板的有效表面上的缺陷。 光学检查模块包括外壳,基板保持器,光源,光束路径,透镜和光电检测器阵列。 光源具有光束端口。 光束路径从光束端口延伸到衬底保持器,并且具有相对于衬底的有源表面的入射角。 光束路径基本上照亮整个有源表面。 该透镜被定向以从活性表面上的任何缺陷收集从光束路径散射的非长期反射光。 光电检测器阵列具有位于透镜的焦平面内的多个像素。 每个像素对应于有源表面上的区域,并且多个像素一起形成覆盖基本上整个有源表面的视场。