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1. 发明申请

US20200378543A1 THERMAL INSULATION STRUCTURE 审中-公开
公开(公告)号：US20200378543A1
公开(公告)日：2020-12-03
申请号：US16624339
申请日：2018-06-19
申请人： Advanced Insulation Limited , Dow Silicones Corporation
发明人： Simon Harry Shepherd , Laura Louise Jordan , Brian Swanton , Patrick Beyer , Roman Vanecek
IPC分类号： F16L59/02 , B32B15/08 , B32B27/20 , B32B27/28
摘要： A thermal insulation structure for a substrate for use subsea, and a method of providing a thermal insulating structure. The structure comprises: an inner layer and an outer layer. The inner layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises a mixture of organohydrogensiloxane having two Si—H bonds per molecule and organohydrogensiloxane having at least three Si—H bonds per molecule. The outer layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises organohydrogensiloxane having at least two Si—H bonds per molecule and alkenylated MQ silicone resin, wherein said M group comprises at least two Si-alkenyl bonds per molecule.

2. 发明授权

US11009176B2 Thermal insulation structure 有权
公开(公告)号：US11009176B2
公开(公告)日：2021-05-18
申请号：US16624339
申请日：2018-06-19
申请人： Advanced Insulation Limited , Dow Silicones Corporation
发明人： Simon Harry Shepherd , Laura Louise Jordan , Brian Swanton , Patrick Beyer , Roman Vanecek
IPC分类号： F16L59/02 , B32B15/08 , B32B27/20 , B32B27/28 , C08L83/04 , E21B36/00
摘要： A thermal insulation structure for a substrate for use subsea, and a method of providing a thermal insulating structure. The structure comprises: an inner layer and an outer layer. The inner layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises a mixture of organohydrogensiloxane having two Si—H bonds per molecule and organohydrogensiloxane having at least three Si—H bonds per molecule. The outer layer is the reaction product of a first part and a second part, wherein the weight ratio of the first part to the second part is from about 15:1 to 1:1. The first part comprises any of alkenyldialkyl terminated polydialkylsiloxane, alkenyldialkyl terminated polydialkylalkenylmethylsiloxane or mixtures thereof, which will individually or collectively have a viscosity of from 250 to 10000 mPa·s at 25° C., and a hydrosilylation catalyst. The second part comprises organohydrogensiloxane having at least two Si—H bonds per molecule and alkenylated MQ silicone resin, wherein said M group comprises at least two Si-alkenyl bonds per molecule.

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