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    • 7. 发明申请
    • Intraneural Implant
    • 神经内植入
    • US20140358174A1
    • 2014-12-04
    • US14372380
    • 2012-01-25
    • Chuladatta ThenuwaraMark B. Downing
    • Chuladatta ThenuwaraMark B. Downing
    • A61N1/05
    • A61N1/0541A61B2017/320044A61N1/0551A61N1/0558A61N1/3605
    • An intraneural implant comprises a lead comprising a number of electrode wires, a number of electrodes communicatively coupled to the electrode wires, the electrodes forming an electrode array, and an overmold surrounding the electrode wires and at least a portion of the electrodes, and a blunt dissector tip coupled to the lead to penetrate nerve tissues as the electrode array is implanted. An intraneural implant system comprises a flexible lead. The flexible lead comprises a lead body, an electrode array communicatively coupled to the lead body, a blunt dissector tip to penetrate a nerve bundle as the electrode array is implanted into the nerve bundle, and an implantation tool coupled to the electrode array to implant the electrode array into the nerve bundle.
    • 神经内植入物包括引线,其包括多个电极引线,多个电极通信地耦合到电极线,形成电极阵列的电极以及围绕电极线和至少一部分电极的包覆模制,以及钝器 剥离器尖端耦合到引线,以便在植入电极阵列时穿透神经组织。 内膜植入系统包括柔性引线。 柔性引线包括引线本体,与引线主体通信地连接的电极阵列,当电极阵列被植入神经束时穿过神经束的钝性解剖器尖端以及与该电极阵列相连接的植入工具 电极阵列进入神经束。