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2. 发明申请

US20170020001A1 METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SENSOR CHIP, AND PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于嵌入式传感器芯片的印刷电路板的制造方法和印刷电路板
公开(公告)号：US20170020001A1
公开(公告)日：2017-01-19
申请号：US15121844
申请日：2015-02-20
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald WEIDINGER
IPC分类号： H05K1/18 , H05K3/40 , H05K1/09 , H01L23/538 , H05K3/32 , H05K3/00 , H01L21/683 , H05K1/11 , H05K3/12
摘要： A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), in which at least one sensor face (5) and terminals (4) are arranged on a face of the chip, said method comprising the following steps: a) providing an adhesive film (1), b) printing a conductor structure (2) formed from a conductive paste onto a surface of the adhesive film, c) placing the at least one sensor chip (3) with the face comprising the at least one sensor face (5) and the terminals (4) onto the conductor structure (2) formed from a conductive paste, in an indexed manner, d) curing the conductive paste, e) applying an insulation layer (6) having a conductor layer (7) arranged thereabove to the surface of the structure, created in the previous steps, comprising the chip (3), f) laminating the structure created in the previous steps, g) structuring the conductor layer (7) and forming vias (9) from the conductor layer to conductive tracks (7b, 7c) of the conductor structure on the surface of the adhesive film, and h) removing the adhesive film (1).
摘要翻译：一种用于制造具有至少一个嵌入式传感器芯片（3）的印刷电路板（10）的方法，其中至少一个传感器面（5）和连接器（4）布置在芯片的表面上，包括以下步骤 a）提供粘合膜（1），b）将由导电浆料制成的导体结构（2）印刷在粘合剂膜的表面上，c）将至少一个传感器芯片（3）放置在具有至少一个传感器面（5）和连接器（4）以注册方式由导电浆料制成到导体结构（2）上，d）固化导电浆料，e）将导电体（6）施加于导体（7）位于具有前述步骤中形成的结构的芯片（3）的表面上，f）层叠前述步骤中产生的结构，g）构造导体层（7）并形成通孔（9）从导体层到粘合剂f表面上的导体结构的印刷导体（7b，7c）并且h）去除粘合膜（1）。

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