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1. 发明公开

US20240030095A1 Electronic Package Comprising a Decoupling Layer Structure 审中-公开
公开(公告)号：US20240030095A1
公开(公告)日：2024-01-25
申请号：US18473775
申请日：2023-09-25
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Mikael Andreas Tuominen , Seok Kim Tay , Johannes Stahr , Andreas Zluc , Timo Schwarz , Gerald Weidinger , Mario Schober
IPC分类号： H01L23/373 , H01L23/492 , H01L23/00 , H01L21/56
CPC分类号： H01L23/3737 , H01L23/492 , H01L24/20 , H01L24/19 , H01L21/56 , H01L2224/21 , H01L2224/2201 , H01L2224/19
摘要： An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.

2. 发明授权

US11495513B2 Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled 有权
公开(公告)号：US11495513B2
公开(公告)日：2022-11-08
申请号：US16827193
申请日：2020-03-23
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Andreas Zluc , Mike Morianz , Heinz Moitzi
IPC分类号： H01L23/34 , H01L23/367 , H01L23/498 , H05K1/02 , H05K3/46
摘要： A component carrier with a stack that has at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and a highly-conductive block embedded in the stack and being thermally and/or electrically coupled with the semiconductor component is illustrated and described.

3. 发明申请

US20190124772A1 Embedding Component With Pre-Connected Pillar in Component Carrier 审中-公开
公开(公告)号：US20190124772A1
公开(公告)日：2019-04-25
申请号：US16169741
申请日：2018-10-24
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Hannes Stahr , Hannes Voraberger , Andreas Zluc , Bettina Schuster
IPC分类号： H05K1/18 , H05K3/40 , H05K3/34 , H05K1/11
摘要： A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

4. 发明授权

US11749613B2 Component with dielectric layer for embedding in component carrier 有权
公开(公告)号：US11749613B2
公开(公告)日：2023-09-05
申请号：US17451012
申请日：2021-10-15
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Andreas Zluc
IPC分类号： H01L23/538 , H01L23/31 , H01L23/373 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L23/373 , H01L23/5386 , H01L24/19 , H01L24/20 , H01L2224/214
摘要： A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.

5. 发明授权

US11658142B2 Connection arrangement, component carrier and method of forming a component carrier structure 有权
公开(公告)号：US11658142B2
公开(公告)日：2023-05-23
申请号：US16947786
申请日：2020-08-17
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Heinz Moitzi , Johannes Stahr , Andreas Zluc
IPC分类号： H01L21/00 , H01L23/00 , H01L21/48 , H01L23/498 , H05K1/11 , H05K1/18 , H05K3/34
CPC分类号： H01L24/16 , H01L21/4846 , H01L23/49838 , H01L24/05 , H01L24/13 , H01L24/81 , H05K1/111 , H05K1/181 , H05K3/3436 , H01L2224/0401 , H01L2224/05557 , H01L2224/05572 , H01L2224/13019 , H01L2224/1607 , H01L2224/16059 , H01L2224/81143 , H01L2224/81345 , H01L2224/81801 , H05K2201/09472 , H05K2201/10636 , H05K2201/10727 , H05K2203/048
摘要： A connection arrangement for forming a component carrier structure is disclosed. The connection arrangement includes a first electrically conductive connection element and a second electrically conductive connection element. The first connection element and the second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction, a form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. A component carrier and a method of forming a component carrier structure are also disclosed.

6. 发明授权

US11523520B2 Method for making contact with a component embedded in a printed circuit board 有权
公开(公告)号：US11523520B2
公开(公告)日：2022-12-06
申请号：US16184470
申请日：2018-11-08
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gerald Weidinger , Andreas Zluc , Johannes Stahr
IPC分类号： H05K3/46 , H05K1/18 , H05K1/11 , H05K3/06 , H05K3/32 , H05K3/26
摘要： The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and formation of a conductor pattern on at least the one outer surface of the core on which the component is arranged, as well as the interconnecting paths between the contacts and the conductor pattern, and Removal of the areas of the conductor layer not belonging to the conductor pattern.

7. 发明授权

US11049778B2 Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity 有权
公开(公告)号：US11049778B2
公开(公告)日：2021-06-29
申请号：US16436111
申请日：2019-06-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Gerald Weidinger , Gerhard Schmid , Andreas Zluc
IPC分类号： H01L23/13 , H01L23/498 , H01L23/00 , H05K1/18
摘要： Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

8. 发明授权

US09967972B2 Circuit board having an asymmetric layer structure 有权
公开(公告)号：US09967972B2
公开(公告)日：2018-05-08
申请号：US15534897
申请日：2015-12-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Andreas Zluc , Gerald Weidinger , Mario Schober , Hannes Stahr , Timo Schwarz , Benjamin Gruber
IPC分类号： H05K1/03 , H05K1/00 , B32B15/08 , H05K1/02 , H05K1/18 , H01L23/538 , H01L23/00 , H05K3/46 , H05K3/00 , H01L21/48 , H01L23/14 , H05K1/11
CPC分类号： H05K1/0271 , H01L21/481 , H01L21/4857 , H01L21/568 , H01L23/145 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/2518 , H01L2224/32145 , H01L2224/73267 , H01L2224/9222 , H01L2924/0002 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/0393 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/0017 , H05K3/0097 , H05K3/4602 , H05K2201/0129 , H05K2201/0133 , H05K2201/0187 , H05K2201/0191 , H05K2201/068 , H05K2201/09136 , H01L2924/00
摘要： A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

9. 发明授权

US09418930B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US09418930B2
公开(公告)日：2016-08-16
申请号：US14897217
申请日：2014-05-06
申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Johannes Stahr , Andreas Zluc , Gernot Grober , Timo Schwarz
IPC分类号： H01L23/36 , H01L23/498 , H01L23/373 , H01L23/31 , H01L23/367 , H01L23/538
CPC分类号： H01L23/49838 , H01L23/3121 , H01L23/36 , H01L23/367 , H01L23/3735 , H01L23/49833 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/06181 , H01L2224/18 , H01L2224/24137 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/0002 , H01L2924/00
摘要： A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates, wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is connected via a contact, a portion of a structured conductor layer, and the conductive, metal intermediate layer to at least one portion of the metal inner layer of the heat dissipation plate, which forms part of the terminal line to the electrode terminal.
摘要翻译：一种具有印刷电路板芯的功率模块，其包含嵌入绝缘层中的至少一个电子功率部件，所述芯布置在两个散热板之间，其中每个散热板具有金属外层和金属内层通过导热的电绝缘中间层与所述金属外层电隔离，并且至少一个功率部件的电极端子经由端子线从芯引出，其中绝缘层两侧的印刷电路板芯具有导体层，至少一个导体层至少部分地构成，并且每个导体层至少部分地通过导电的金属中间层连接到散热板的金属内层，从结构化导体层至少一个功率部件的电极端子，以及至少一个功率部件的至少一个电源端子通过接触，结构化导体层的一部分和导电的金属中间层将热功率元件连接到散热板的金属内层的至少一部分，其形成端子线的一部分到电极终奌站。

10. 发明申请

US20140307403A1 METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：将电子元件集成到印刷电路板中的方法
公开(公告)号：US20140307403A1
公开(公告)日：2014-10-16
申请号：US14314163
申请日：2014-06-25
申请人： AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
发明人： Günther Weichslberger , Arno Kriechbaum , Mike Morianz , Nikolai Haslebner , Johannes Stahr , Fritz Haring , Gerhard Freydl , Andrea Koertvelyessy , Mark Beesley , Andreas Zluc , Wolfgang Schrittwieser
IPC分类号： H05K1/18
CPC分类号： H05K1/183 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L2224/24137 , H01L2224/2518 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15174 , H01L2924/351 , H05K1/0206 , H05K1/185 , H05K3/305 , H05K3/4652 , H05K2201/0355 , H05K2201/09845 , H05K2201/10507 , H05K2201/10674 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , H01L2924/00
摘要： This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
摘要翻译：该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

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