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    • 2. 发明申请
    • Vertical Embedded Sensor and Process of Manufacturing Thereof
    • 垂直嵌入式传感器及其制造工艺
    • US20140338075A1
    • 2014-11-13
    • US14271344
    • 2014-05-06
    • APPLIED NANOSTRUCTURES, INC.
    • Jeremy J. GoeckeritzGary D. AdenAmi ChandJosiah F. Willard
    • G01Q70/14G01Q70/16
    • G01Q70/14B82Y35/00G01Q60/58G01Q70/16
    • A scanning probe assembly having a nanometer sensor element defined at a tip apex and its method of fabrication using micro-electromechanical systems (MEMS) processing techniques. The assembly comprises a probe body, a cantilever extending outward, and a hollow tip at the end of the cantilever. A first conductive material is disposed on the hollow tip, followed by a dielectric layer thus embedding the conductive layer. A nanometer hole is milled through the tip, first conductor and dielectric materials. A metal sensor element is deposited by means of electrochemical deposition in the through-hole. A second conductor is deposited on a lower layer. The first and second conductors form electrical connections to the sensor element in the tip. The intra-tip metal, in combination with other layers, may form a thermocouple, thermistor, Schottky diode, ultramicroelectrode, or Hall Effect sensor, and used as a precursor to grow spikes such a nanotubes.
    • 具有限定在顶端顶点处的纳米传感器元件的扫描探针组件及其使用微机电系统(MEMS)处理技术的制造方法。 组件包括探针主体,向外延伸的悬臂和悬臂末端的中空尖端。 第一导电材料设置在中空尖端上,随后是介电层从而嵌入导电层。 通过尖端,第一导体和电介质材料研磨纳米孔。 金属传感器元件通过电化学沉积沉积在通孔中。 第二导体沉积在下层上。 第一和第二导体与尖端中的传感器元件形成电连接。 尖端金属与其他层结合可形成热电偶,热敏电阻,肖特基二极管,超微电极或霍尔效应传感器,并用作生长诸如纳米管的尖峰的前体。
    • 3. 发明授权
    • Vertical embedded sensor and process of manufacturing thereof
    • 垂直嵌入式传感器及其制造工艺
    • US09389244B2
    • 2016-07-12
    • US14271344
    • 2014-05-06
    • Applied Nanostructures, Inc.
    • Jeremy J. GoeckeritzGary D. AdenAmi ChandJosiah F. Willard
    • G01Q70/14G01Q60/58G01Q70/16B82Y35/00
    • G01Q70/14B82Y35/00G01Q60/58G01Q70/16
    • A scanning probe assembly having a nanometer sensor element defined at a tip apex and its method of fabrication using micro-electromechanical systems (MEMS) processing techniques. The assembly comprises a probe body, a cantilever extending outward, and a hollow tip at the end of the cantilever. A first conductive material is disposed on the hollow tip, followed by a dielectric layer thus embedding the conductive layer. A nanometer hole is milled through the tip, first conductor and dielectric materials. A metal sensor element is deposited by means of electrochemical deposition in the through-hole. A second conductor is deposited on a lower layer. The first and second conductors form electrical connections to the sensor element in the tip. The intra-tip metal, in combination with other layers, may form a thermocouple, thermistor, Schottky diode, ultramicroelectrode, or Hall Effect sensor, and used as a precursor to grow spikes such a nanotubes.
    • 具有限定在顶端顶点处的纳米传感器元件的扫描探针组件及其使用微机电系统(MEMS)处理技术的制造方法。 组件包括探针主体,向外延伸的悬臂和悬臂末端的中空尖端。 第一导电材料设置在中空尖端上,随后是介电层从而嵌入导电层。 通过尖端,第一导体和电介质材料研磨纳米孔。 金属传感器元件通过电化学沉积沉积在通孔中。 第二导体沉积在下层上。 第一和第二导体与尖端中的传感器元件形成电连接。 尖端金属与其他层结合可形成热电偶,热敏电阻,肖特基二极管,超微电极或霍尔效应传感器,并用作生长诸如纳米管的尖峰的前体。