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1. 发明申请

US20160150653A1 MANUFACTURING METHOD FOR BACK DRILLING HOLE IN PCB AND PCB 有权
标题翻译： PCB和PCB背面钻孔的制造方法
公开(公告)号：US20160150653A1
公开(公告)日：2016-05-26
申请号：US14909176
申请日：2013-11-28
申请人： PEKING UNIVERSITY FOUNDER GROUP CO., LTD. , ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD , FOUNDER INFORMATION INDUSTRY HOLDINGS CO., LTD.
发明人： Xiaren CHEN , Baowei REN
IPC分类号： H05K3/00 , H05K1/11 , H05K3/42
CPC分类号： H05K3/0047 , H05K1/115 , H05K3/0094 , H05K3/427 , H05K2201/0959 , H05K2203/0207 , H05K2203/0214
摘要： A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion, and the manufacturing process is simple.
摘要翻译：提供了一种在印刷电路板（PCB）和PCB中制造背面钻孔的方法。制造后钻孔的方法包括：在PCB（1）中形成通孔; 在所述通孔的内壁上形成规定厚度的金属层（12）; 在已经形成有金属层（12）的通孔中填充树脂; 在填充有树脂的通孔上进行后钻加工; 去除金属屑残留在通孔中。该制造方法通过用树脂填充孔保护孔壁铜，使得酸腐蚀工艺仅在小孔后钻时除去剩余的金属屑，不影响树脂保护部分的孔铜，并且制造工艺简单。

2. 发明授权

US09232632B2 Methods and apparatuses for detecting registration offsets 有权
标题翻译：用于检测登记偏移的方法和装置
公开(公告)号：US09232632B2
公开(公告)日：2016-01-05
申请号：US13724981
申请日：2012-12-21
申请人： PEKING UNIVERSITY FOUNDER GROUP CO., LTD. , ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO., LTD.
发明人： Xinhong Su , Chen Chen
IPC分类号： H01B12/00 , H05K1/02 , H05K3/06 , H05K3/46
CPC分类号： H05K1/0269 , H05K3/067 , H05K3/4679
摘要： A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a printed circuit board (PCB) substrate. The first pattern has a reference scale. The method further includes transferring a second pattern to a metal layer on a second side opposite to the first side of the PCB substrate. The second pattern has a measurement scale. The second pattern is transferred by aligning an origin of the measurement scale with an origin of the reference scale in an apparatus such that at least a portion of the reference scale is overlapped with the measurement scale. The method includes etching the metal layers of the PCB substrate and measuring an offset in the patterns on the PCB substrate by using the reference scale and the measurement scale.
摘要翻译：公开了一种用于检测配准偏移的方法。该方法包括将第一图案转印到印刷电路板（PCB）基板的第一侧上的金属层。第一个模式有参考比例。该方法还包括将第二图案转移到与PCB基板的第一侧相对的第二侧上的金属层。第二种模式具有测量尺度。通过将测量刻度的原点与参考刻度的原点对准在装置中，使得参考刻度的至少一部分与测量刻度重叠来传送第二图案。该方法包括蚀刻PCB衬底的金属层，并通过使用参考刻度和测量刻度来测量PCB衬底上的图案中的偏移。

3. 发明授权

US09258885B2 PCB back drill detection method and PCB plating 有权
标题翻译： PCB后钻检测方法和PCB电镀
公开(公告)号：US09258885B2
公开(公告)日：2016-02-09
申请号：US14123082
申请日：2012-10-29
申请人： Peking University Founder Group Co., Ltd. , Zhuhai Founder Tech Hi-Density Electronic Co Ltd.
发明人： Shiqing Huang , Jinhong Li , Xianren Chen
IPC分类号： H05K1/11 , B23P19/04 , H05K3/02 , H01K3/10 , H05K1/02 , H05K3/00 , G01R31/28
CPC分类号： H05K1/0237 , G01R31/2805 , H05K1/0216 , H05K1/0251 , H05K1/0268 , H05K1/0293 , H05K1/115 , H05K1/116 , H05K3/0047 , H05K3/429 , H05K2201/09627 , H05K2201/09781 , H05K2203/0207 , H05K2203/0242 , Y10T29/49155 , Y10T408/03
摘要： A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according to positions of the back-drilled holes during a process of forming the PCB, wherein each of the formed metal rings has an outer diameter greater than an aperture of each of the back-drilled holes; forming, at positions corresponding to the positions of the back-drilled holes, metal holes extending through an outer layer of the PCB and the formed metal rings; forming two first detection holes electrically connected with the formed metal rings; forming the back-drilling holes on the PCB, which extend through and expand the metal holes; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled holes and the metal holes.
摘要翻译：提供了用于检测PCB和PCB面板中的后钻孔的方法。该方法包括：在形成PCB的过程期间，根据多孔PCB的第一内层的金属层形成金属环，其中每个所形成的金属环具有外径大于每个后钻孔的孔径; 在对应于后钻孔的位置的位置处形成延伸穿过PCB的外层的金属孔和形成的金属环; 形成与形成的金属环电连接的两个第一检测孔; 在PCB上形成延伸穿过并膨胀金属孔的后钻孔; 并且检测两个第一检测孔之间的电导率，以便确定在后钻孔和金属孔之间是否存在位置偏移。

4. 发明申请

US20130180761A1 Printed Circuit Board Compensation Processing Method, Device, and PCB 有权
标题翻译：印刷电路板补偿处理方法，设备和PCB
公开(公告)号：US20130180761A1
公开(公告)日：2013-07-18
申请号：US13715947
申请日：2012-12-14
申请人： Peking University Founder Group Co., Ltd. , Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. , Zhuhai Founder PCB Development Co., Ltd.
发明人： Lanyuan CHEN , Haode LI
IPC分类号： H05K3/00 , H05K1/02
CPC分类号： H05K3/0005 , H05K1/0296 , H05K1/111 , H05K2201/09381 , H05K2201/10734 , Y02P70/611
摘要： The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.
摘要翻译：本发明公开了一种用于制造BGA的印刷电路板补偿处理方法，尽管BGA的线和焊盘之间的距离很小。所述方法包括在预定条件下补偿焊盘和/或线，以及当所述经补偿的线和焊盘之间的最短距离小于第一预定距离时，将面向所述线的所述焊盘的一部分移除第二预定宽度。本发明还公开了一种用于执行该方法的装置和使用该方法制造的PCB。

5. 发明申请

US20130168140A1 Printed Circuit Board and Method of Manufacturing Same 审中-公开
标题翻译：印刷电路板及其制造方法相同
公开(公告)号：US20130168140A1
公开(公告)日：2013-07-04
申请号：US13730149
申请日：2012-12-28
申请人： PEKING UNIVERSITY FOUNDER GROUP CO., LTD. , ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD.
发明人： Xianren CHEN , Lianghong LIAO , Xin CHEN , Yongshuan HU
IPC分类号： H05K3/00 , H05K1/02
CPC分类号： H05K3/0044 , H05K1/02 , H05K3/0008 , H05K2201/09063 , H05K2201/09136 , H05K2203/167 , Y10T409/303752
摘要： A method of manufacturing a printed circuit board (PCB) is provided. The method includes defining an area on the PCB to be subjected to a controlled-depth milling. The area includes a warp. The method further includes providing a plurality of positioning holes adjacent to edges of the area of the PCB, installing positioning members in the positioning holes so as to fix the PCB on a flat surface of a table of a milling equipment, and milling the area of the PCB. A PCB is also provided. The PCB includes a controlled-depth area containing patterns and having a surface lower than a surface of the PCB. The PCB further includes a plurality of positioning holes formed adjacent to edges of the controlled-depth area.
摘要翻译：提供一种制造印刷电路板（PCB）的方法。该方法包括在PCB上限定要进行受控深度铣削的区域。该区域包括翘曲。该方法还包括提供与PCB的区域的边缘相邻的多个定位孔，将定位构件安装在定位孔中，以将PCB固定在铣削设备的工作台的平坦表面上，并铣削 PCB。还提供PCB。 PCB包括受控深度区域，其包含图案并且具有低于PCB表面的表面。 PCB还包括与受控深度区域的边缘相邻形成的多个定位孔。

6. 发明申请

US20130161072A1 Methods and Apparatuses for Detecting Registration Offsets 有权
标题翻译：检测注册偏移的方法和装置
公开(公告)号：US20130161072A1
公开(公告)日：2013-06-27
申请号：US13724981
申请日：2012-12-21
申请人： PEKING UNIVERSITY FOUNDER GROUP CO. LTD. , ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO., LTD.
发明人： Xinhong SU , Chen CHEN
IPC分类号： H05K1/02 , H05K3/06
CPC分类号： H05K1/0269 , H05K3/067 , H05K3/4679
摘要： A method for detecting a registration offset is disclosed. The method includes transferring a first pattern to a metal layer on a first side of a printed circuit board (PCB) substrate. The first pattern has a reference scale. The method further includes transferring a second pattern to a metal layer on a second side opposite to the first side of the PCB substrate. The second pattern has a measurement scale. The second pattern is transferred by aligning an origin of the measurement scale with an origin of the reference scale in an apparatus such that at least a portion of the reference scale is overlapped with the measurement scale. The method includes etching the metal layers of the PCB substrate and measuring an offset in the patterns on the PCB substrate by using the reference scale and the measurement scale.
摘要翻译：公开了一种用于检测配准偏移的方法。该方法包括将第一图案转印到印刷电路板（PCB）基板的第一侧上的金属层。第一个模式有参考比例。该方法还包括将第二图案转移到与PCB基板的第一侧相对的第二侧上的金属层。第二种模式具有测量尺度。通过将测量刻度的原点与参考刻度的原点对准在装置中，使得参考刻度的至少一部分与测量刻度重叠来传送第二图案。该方法包括蚀刻PCB衬底的金属层，并通过使用参考刻度和测量刻度来测量PCB衬底上的图案中的偏移。

7. 发明授权

US09185808B2 Printed circuit board compensation processing method, device, and PCB 有权
标题翻译：印刷电路板补偿处理方法，器件和PCB
公开(公告)号：US09185808B2
公开(公告)日：2015-11-10
申请号：US13715947
申请日：2012-12-14
申请人： PEKING UNIVERSITY FOUNDER GROUP CO., LTD. , ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD. , ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD.
发明人： Lanyuan Chen , Haode Li
IPC分类号： G06F17/50 , H05K3/00 , H05K1/02 , H05K1/11
CPC分类号： H05K3/0005 , H05K1/0296 , H05K1/111 , H05K2201/09381 , H05K2201/10734 , Y02P70/611
摘要： The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.
摘要翻译：本发明公开了一种用于制造BGA的印刷电路板补偿处理方法，尽管BGA的线和焊盘之间的距离很小。所述方法包括在预定条件下补偿焊盘和/或线，以及当所述经补偿的线和焊盘之间的最短距离小于第一预定距离时，将面向所述线的所述焊盘的一部分移除第二预定宽度。本发明还公开了一种用于执行该方法的装置和使用该方法制造的PCB。

8. 发明申请

US20140318832A1 FABRICATION METHOD OF A RIGID-FLEXIBLE CIRCUIT BOARD AND RIGID-FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：刚性柔性电路板和刚性柔性印刷电路板的制造方法
公开(公告)号：US20140318832A1
公开(公告)日：2014-10-30
申请号：US14129011
申请日：2012-09-25
申请人： Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. , Peking University Founder Group Co., Ltd.
发明人： Yong Huang , Zhengqing Chen
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H05K3/46 , H05K1/02 , H05K3/4691 , H05K3/4694 , H05K2201/09127 , H05K2203/061 , Y10T29/49126
摘要： A manufacturing method of an anode foil for an aluminum electrolytic capacitor is provided, which comprises a first step of forming a porous oxide film, i.e. subjecting an etched foil having etched holes thereon to an anodic oxidation process to form a porous oxide film on both the outer surface of the etched foil and the inner surface of etched holes, and a second step of forming a dense oxide film, i.e. converting the porous oxide film into the dense oxide film. The method can be used to manufacture an anode foil for various voltage ranges, e.g. an ultra-high voltage anode foil whose voltage is more than 800 vf, and the method can increase specific capacity, reduce power consumption, simplify the process, and increase production efficiency.
摘要翻译：提供了一种用于铝电解电容器的阳极箔的制造方法，其包括形成多孔氧化膜的第一步骤，即将其上具有蚀刻孔的蚀刻箔经历阳极氧化工艺以在两者上形成多孔氧化膜蚀刻箔的外表面和蚀刻孔的内表面，以及形成致密氧化膜的第二步骤，即将多孔氧化物膜转化为致密氧化物膜。该方法可用于制造用于各种电压范围的阳极箔，例如电压超过800vf的超高压阳极箔，该方法可以提高比容量，降低功耗，简化工艺，提高生产效率。

9. 发明授权

US09756734B2 Manufacturing method for back drilling hole in PCB and PCB 有权
公开(公告)号：US09756734B2
公开(公告)日：2017-09-05
申请号：US14909176
申请日：2013-11-28
申请人： PEKING UNIVERSITY FOUNDER GROUP CO., LTD. , ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD. , FOUNDER INFORMATION INDUSTRY HOLDINGS CO., LTD.
发明人： Xianren Chen , Baowei Ren
IPC分类号： H05K3/00 , H05K3/42 , H05K1/11
CPC分类号： H05K3/0047 , H05K1/115 , H05K3/0094 , H05K3/427 , H05K2201/0959 , H05K2203/0207 , H05K2203/0214
摘要： A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (1); forming a metal layer (12) with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (12); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion.

10. 发明申请

US20150264804A1 PCB BACK DRILL DETECTION METHOD AND PCB PLATING 有权
标题翻译： PCB背面钻探检测方法和PCB镀层
公开(公告)号：US20150264804A1
公开(公告)日：2015-09-17
申请号：US14123082
申请日：2012-10-29
申请人： Zhuhai Founder Tech Hi-Density Electronic Co Ltd. , Peking University Founder Group Co., Ltd.
发明人： Shiqing Huang , Jinhong Li , Xianren Chen
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00
CPC分类号： H05K1/0237 , G01R31/2805 , H05K1/0216 , H05K1/0251 , H05K1/0268 , H05K1/0293 , H05K1/115 , H05K1/116 , H05K3/0047 , H05K3/429 , H05K2201/09627 , H05K2201/09781 , H05K2203/0207 , H05K2203/0242 , Y10T29/49155 , Y10T408/03
摘要： A method for detecting back-drilled holes in a PCB and a PCB panel are provided. The method comprises: forming, on a metal layer of a first inner layer of a multi-layer PCB, metal rings according to positions of the back-drilled holes during a process of forming the PCB, wherein each of the formed metal rings has an outer diameter greater than an aperture of each of the back-drilled holes; forming, at positions corresponding to the positions of the back-drilled holes, metal holes extending through an outer layer of the PCB and the formed metal rings; forming two first detection holes electrically connected with the formed metal rings; forming the back-drilling holes on the PCB, which extend through and expand the metal holes; and detecting an electrical conduction between the two first detection holes so as to determine whether a position offset exists between the back-drilled holes and the metal holes.
摘要翻译：提供了用于检测PCB和PCB面板中的后钻孔的方法。该方法包括：在形成PCB的过程期间，根据多孔PCB的第一内层的金属层形成金属环，其中每个所形成的金属环具有外径大于每个后钻孔的孔径; 在对应于后钻孔的位置的位置处形成延伸穿过PCB的外层的金属孔和形成的金属环; 形成与形成的金属环电连接的两个第一检测孔; 在PCB上形成延伸穿过并膨胀金属孔的后钻孔; 并且检测两个第一检测孔之间的电导率，以便确定在后钻孔和金属孔之间是否存在位置偏移。

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