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1. 发明申请

US20060189032A1 PROCESS FOR ASSEMBLING A DOUBLE-SIDED CIRCUIT COMPONENT 有权
标题翻译：组装双面电路组件的方法
公开(公告)号：US20060189032A1
公开(公告)日：2006-08-24
申请号：US10906518
申请日：2005-02-23
申请人： Ze Etta Murphy
发明人： Ze Etta Murphy
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H05K3/3405 , H01L21/6835 , H01L23/49531 , H01L23/49861 , H01L2221/68313 , H01L2924/0002 , H05K1/145 , H05K3/368 , H05K2201/1034 , H05K2201/10924 , H05K2203/0165 , H01L2924/00
摘要： A process for producing a circuit component having a double-sided circuit device between a pair of substrates. The process entails depositing a solder material on contact areas on surfaces of the substrates, placing a first of the substrates within a cavity in a receptacle, and then placing a lead member on the substrate so that the lead member is supported by the receptacle and a portion of the lead member is aligned with a portion of the contact area of the substrate. A fixture is then placed on the lead member and over the substrate so that the fixture is supported by the receptacle. After aligning the circuit device with the contact area of the remaining substrate, the substrate-device assembly is placed in an aperture in the fixture so that a surface of the device electrically contacts the contact area of the first substrate and the opposite surface of the device electrically contacts the contact area of the second substrate. The resulting fixtured assembly then undergoes reflow.
摘要翻译：一种用于制造在一对基板之间具有双面电路器件的电路部件的工艺。该过程需要将焊料材料沉积在基板的表面上的接触区域上，将第一基板放置在容器内的空腔内，然后将引线部件放置在基板上，使得引线部件由插座支撑，引线构件的一部分与衬底的接触区域的一部分对准。然后将夹具放置在引导构件上并在基板上方，使得固定装置由插座支撑。在将电路装置与剩余基板的接触区域对准之后，将基板装置组件放置在固定装置中的孔中，使得装置的表面与第一基板的接触区域和装置的相对表面电接触电接触第二基板的接触区域。所得到的夹具组件然后经受回流。

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