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    • 1. 发明授权
    • Process for reducing blood pressure and blocking .beta.-adrenergic
receptor
    • 减少血压和阻止{62-肾上腺素能受体的方法
    • US4147799A
    • 1979-04-03
    • US463833
    • 1974-04-24
    • Hiroyuki ObaseYutaka Kasuya
    • Hiroyuki ObaseYutaka Kasuya
    • C07D317/58A61K31/36
    • C07D317/58
    • Ethanolamine derivatives and their acid addition salts are prepared (1) by reacting a 1-(3,4-methylenedioxyphenyl)-2-aminoethanol compound or an .alpha.-amino-(3,4-methylenedioxy)acetophenone compound with an alkanal or an alkanone under reduction conditions, (2) by hydrogenating and/or hydrogenolyzing a 1-(3,4-methylenedioxyphenyl)-2-(N-substituted amino)-ethanol compound or an .alpha.-(N-substituted amino)-(3,4-methylenedioxy)acetophenone compound, and (3) by reacting a (3,4-methylenedioxyphenyl)-ethylene oxide compound or a 1-(3,4-methylenedioxyphenyl)-2-substituted ethanol compound with an amine. The ethanolamine derivatives and their salts show .beta.-adrenergic receptor blocking activity, and are expected to be useful in the treatment of heart disease, hypertension, myocardites and pheochromocytoma.
    • 通过使1-(3,4-亚甲二氧基苯基)-2-氨基乙醇化合物或α-氨基 - (3,4-亚甲二氧基)苯乙酮化合物与链烷醛或烷酮反应制备乙醇胺衍生物及其酸加成盐(1) 在还原条件下,(2)通过氢化和/或氢解1-(3,4-亚甲二氧基苯基)-2-(N-取代的氨基) - 乙醇化合物或α-(N-取代的氨基) - (3,4 - 亚甲二氧基)苯乙酮化合物,和(3)使(3,4-亚甲二氧基苯基) - 二氧化乙烯化合物或1-(3,4-亚甲二氧基苯基)-2-取代的乙醇化合物与胺反应。 乙醇胺衍生物及其盐显示β-肾上腺素能受体阻断活性,预计可用于治疗心脏病,高血压,心肌和嗜铬细胞瘤。
    • 2. 发明申请
    • METHOD OF PLATING A WAFER
    • 抛光方法
    • US20100038252A1
    • 2010-02-18
    • US12189921
    • 2008-08-12
    • YUTAKA KASUYA
    • YUTAKA KASUYA
    • C25D5/00
    • C25D7/123C25D3/562C25D5/006
    • A plating method for forming a uniform magnetic film in conducting a plating treatment on a wafer with a magnetic film of, for instance, a Fe—Co-based alloy. Specifically, the method comprises the steps of supplying a plating solution through a plating-solution-supply section of a plating tank to a wafer, which placed on an opening of the plating tank, and conducting a plating treatment on the wafer while the plating solution is kept in contact with a plating target surface of the wafer, wherein the plating solution employed is one forming a magnetic film, and the plating treatment is done while a magnetic field is applied to the plating solution in contact with the plating target surface of the wafer.
    • 一种用例如Fe-Co类合金的磁性膜在晶圆上进行电镀处理时形成均匀的磁性膜的电镀方法。 具体而言,该方法包括以下步骤:通过镀槽的镀液供给部将电镀液供给到放置在电镀槽的开口部上的晶片,对电镀液进行电镀处理 与晶片的电镀目标表面保持接触,其中所用的电镀液是形成磁性膜的电镀液,并且在将电场施加到与镀层的镀覆目标表面接触的电镀液中进行电镀处理 晶圆。