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1. 发明申请

US20120156483A1 ASHESIVE TAPE OR SHEET, AND BASE MATERIAL THEREFOR 审中-公开
标题翻译：带状胶带或其他材料
公开(公告)号：US20120156483A1
公开(公告)日：2012-06-21
申请号：US13392738
申请日：2010-08-26
申请人： Yuta Shimazaki , Eiichi Imoto , Kunio Nagasaki
发明人： Yuta Shimazaki , Eiichi Imoto , Kunio Nagasaki
IPC分类号： B32B7/12 , B05D5/10 , B05D3/06
CPC分类号： C08F290/067 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/22 , C09J175/16 , C09J2205/31 , C09J2433/006 , C09J2475/006 , Y10T428/28 , C08G18/48
摘要： An object of the present invention is to obtain a pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet which is capable of free design of a pressure-sensitive adhesive and is peelable after use without adding special components to the pressure-sensitive adhesive, and to obtain a base material for use in such a pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet. The base material for pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet according to the present invention, the base material being a composite film containing a urethane polymer having an acryloyl group at its molecular chain end and a (meth)acrylic polymer, in which the composite film has a water absorption ratio of 5% or more. A (meth)acrylic monomer for forming the (meth)acrylic polymer preferably contains at least one compound selected from the group consisting of (meth)acrylic acid and (meth)acryloylmorpholine.
摘要翻译：本发明的目的是获得能够自由设计压敏粘合剂的粘合带或压敏粘合片，并且在使用后可剥离而不向压敏粘合剂添加特殊组分，并且以获得用于这种压敏粘合带或压敏粘合片的基材。根据本发明的压敏粘合带或压敏粘合片基材，该基材是含有分子链末端具有丙烯酰基的氨基甲酸酯聚合物和（甲基）丙烯酸类聚合物的复合膜，复合膜的吸水率为5％以上。用于形成（甲基）丙烯酸类聚合物的（甲基）丙烯酸类单体优选含有至少一种选自（甲基）丙烯酸和（甲基）丙烯酰基吗啉的化合物。

2. 发明申请

US20120056338A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER 失效
标题翻译：用于保护半导体波形的压敏粘合片
公开(公告)号：US20120056338A1
公开(公告)日：2012-03-08
申请号：US13223629
申请日：2011-09-01
申请人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： H01L23/29
CPC分类号： H01L21/67132 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/10 , C09J175/16 , C09J2203/326 , C09J2475/00 , C08G18/48
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译：本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。保护片具有一个具有粘性的面，在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。

3. 发明授权

US08546958B2 Pressure-sensitive adhesive sheet for protecting semiconductor wafer 失效
标题翻译：用于保护半导体晶片的压敏粘合片
公开(公告)号：US08546958B2
公开(公告)日：2013-10-01
申请号：US13223629
申请日：2011-09-01
申请人： Takashi Habu , Fumiteru Asai , Tomokazu Takahashi , Eiichi Imoto , Yuta Shimazaki
发明人： Takashi Habu , Fumiteru Asai , Tomokazu Takahashi , Eiichi Imoto , Yuta Shimazaki
IPC分类号： H01L23/52 , H01L23/48
CPC分类号： H01L21/67132 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/10 , C09J175/16 , C09J2203/326 , C09J2475/00 , C08G18/48
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译：本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。保护片具有一个具有粘性的面，在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。

4. 发明申请

US20120065350A1 VISCOELASTIC BODY AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：粘弹体及其制造方法
公开(公告)号：US20120065350A1
公开(公告)日：2012-03-15
申请号：US13223523
申请日：2011-09-01
申请人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： C08F283/00
CPC分类号： C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48
摘要： The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.
摘要翻译：本发明提供一种可用于保护半导体晶片等的压敏粘合片的树脂材料，当半导体晶片被研磨时，不会导致半导体晶片中的弯曲（翘曲），因此具有优异的随机性图案在研磨操作中具有足够的应力分散性，抑制晶片中的裂纹和晶片边缘的碎裂，并且在剥离操作中不会在晶片的表面上留下粘合剂残留物。树脂材料应为包含聚氨酯聚合物和丙烯酸类聚合物的共聚物的粘弹性体，该共聚物通过具有可与氨基甲酸酯聚合物形成氨基甲酸酯键并具有可共聚的活性炭双键的官能团的单体形成与（甲基）丙烯酰基在一个分子中。

5. 发明申请

US20120058336A1 TEMPORARY FIXING SHEET FOR MANUFACTURING PROCESS OF ELECTRONIC PARTS 审中-公开
标题翻译：电子部件制造工艺的临时固定表
公开(公告)号：US20120058336A1
公开(公告)日：2012-03-08
申请号：US13223777
申请日：2011-09-01
申请人： Daisuke SHIMOKAWA , Yuta SHIMAZAKI , Kunio NAGASAKI , Eiichi IMOTO
发明人： Daisuke SHIMOKAWA , Yuta SHIMAZAKI , Kunio NAGASAKI , Eiichi IMOTO
IPC分类号： B32B7/12
CPC分类号： H01L21/6836 , C08F290/067 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/114 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , Y10T428/2878 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.
摘要翻译：本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后通过冷却到预定温度可以有效且容易地将其自身剥离或更低，设计自由度高，操作性好。临时固定片包括支撑基板和设置在其至少一个面上的临时固定层，其中临时固定层包含聚氨酯聚合物和乙烯基聚合物。

6. 发明申请

US20130034737A1 PRODUCTION METHOD OF CURED MULTILAYER SHEET AND CURED MULTILAYER SHEET 审中-公开
标题翻译：固化多层板和固化多层板的生产方法
公开(公告)号：US20130034737A1
公开(公告)日：2013-02-07
申请号：US13640465
申请日：2011-04-04
申请人： Eiichi Imoto , Yuta Shimazaki , Tatsuya Kitahara , Kunio Nagasaki
发明人： Eiichi Imoto , Yuta Shimazaki , Tatsuya Kitahara , Kunio Nagasaki
IPC分类号： B32B27/18 , B32B37/18
CPC分类号： C08J5/18 , B32B33/00 , B32B37/0015 , Y10T428/31536
摘要： Disclosed is a cured multilayer sheet production method, comprising adjacently laminating a first uncured layer formed by a first curable resin and a second uncured layer formed by a second curable resin to form a laminated body, wherein the first curable resin contains a first monomer or partial polymer thereof, and an immiscible substance, the second curable resin contains a second monomer and polymer, the first monomer concentration in the first curable resin is higher than the polymerizable monomer concentration in the second curable resin, wherein in the laminating step, the immiscible substance is eccentrically distributed on or near an interface on the side opposite to the second uncured layer, and thereafter curing the layers, so that a cured multilayer sheet, wherein a substance different from a polymer cured layer is eccentrically located on the surface of the polymer cured layer, is produced at high productivity.
摘要翻译：公开了一种固化多层片材的制造方法，其包括相邻地层压由第一可固化树脂形成的第一未固化层和由第二可固化树脂形成的第二未固化层以形成层压体，其中所述第一可固化树脂含有第一单体或部分聚合物和不混溶物质，第二固化性树脂含有第二单体和聚合物，第一可固化树脂中的第一单体浓度高于第二可固化树脂中的可聚合单体浓度，其中在层压步骤中，不混溶物质偏心分布在与第二未固化层相反一侧的界面上或附近，然后固化该层，使得固化的多层片材，其中不同于聚合物固化层的物质偏心地位于聚合物固化的表面上层，以高生产率生产。

7. 发明申请

US20120059124A1 TEMPORARY FIXING SHEET 审中-公开
标题翻译：临时固定片
公开(公告)号：US20120059124A1
公开(公告)日：2012-03-08
申请号：US13223841
申请日：2011-09-01
申请人： Yuta SHIMAZAKI , Eiichi IMOTO , Daisuke SHIMOKAWA , Kunio NAGASAKI
发明人： Yuta SHIMAZAKI , Eiichi IMOTO , Daisuke SHIMOKAWA , Kunio NAGASAKI
IPC分类号： C09J175/16 , C09J133/08
CPC分类号： H01L21/6836 , C08F283/008 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , C08G18/48
摘要： The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40° C., and loses the tack strength at the particular temperature or lower.
摘要翻译：本发明提供了一种在陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后可以通过冷却到预定温度来有效且容易地将其自身剥离，或更低，给予设计的高度自由度并具有足够的可操作性。临时固定片具有包含氨基甲酸酯聚合物组分和乙烯基聚合物的树脂层，在特定温度等于或高于40℃的情况下产生粘着强度，并且在特定温度或更低温度下失去粘着强度。

8. 发明申请

US20120058319A1 PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR WAFER 审中-公开
标题翻译：用于保护半导体波形的压敏粘合片
公开(公告)号：US20120058319A1
公开(公告)日：2012-03-08
申请号：US13223966
申请日：2011-09-01
申请人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
发明人： Akiyoshi YAMAMOTO , Takashi HABU , Fumiteru ASAI , Tomokazu TAKAHASHI , Eiichi IMOTO , Yuta SHIMAZAKI
IPC分类号： B32B7/12 , B32B7/02 , C09J7/02
CPC分类号： H01L21/67132 , C09J7/10 , C09J2201/622 , C09J2203/326 , Y10T428/24942 , Y10T428/26 , Y10T428/28
摘要： The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
摘要翻译：本发明提供一种用于保护半导体晶片的压敏粘合片，其在半导体晶片被研磨时不引起半导体晶片的弯曲（翘曲），对图案的追随性优异，在研磨操作，抑制晶片中的裂纹和晶片边缘的碎裂，并且不会在晶片的表面上留下粘合剂残留物。保护片在基材和粘合剂之间不存在界面，并且由一层制成，并且该粘合片在两个表面上具有不同的粘着强度。

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