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1. 发明申请

US20110215427A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20110215427A1
公开(公告)日：2011-09-08
申请号：US13009212
申请日：2011-01-19
申请人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu OBATA , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L29/84
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

2. 发明授权

US08476741B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

3. 发明申请

US20110186982A1 SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：表面安装二极管及其制造方法
公开(公告)号：US20110186982A1
公开(公告)日：2011-08-04
申请号：US13016239
申请日：2011-01-28
申请人： Tomoyuki KITANI , Akira TOJO , Takao NOGI , Kazuhito HIGUCHI , Tomohiro IGUCHI , Masako FUKUMITSU , Susumu OBATA , Yusaku ASANO
发明人： Tomoyuki KITANI , Akira TOJO , Takao NOGI , Kazuhito HIGUCHI , Tomohiro IGUCHI , Masako FUKUMITSU , Susumu OBATA , Yusaku ASANO
IPC分类号： H01L23/48 , H01L21/782
CPC分类号： H01L21/782 , H01L23/48 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment, a surface mount diode including a diode chip including a first main surface and a second main surface, a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion, an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion, a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip, and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member.
摘要翻译：根据一个实施例，一种表面贴装二极管，其包括具有第一主表面和第二主表面的二极管芯片，在第一主表面上包括第一内部电极部分的第一内部电极部分和第一内部电极部分上的第一外部电极部分包括第二主表面上的第二内部电极部分和第二内部电极部分上的第二外部电极部分的阳极电极，第二外部电极部分的厚度与第一外部电极部分的厚度相同，覆盖所述内部电极部分中的一个的周边表面和所述二极管芯片的外围表面的第一覆盖部件和覆盖所述另一个所述内部电极部分的周边表面的第二覆盖部件，所述第二覆盖部件的颜色不同于第一个覆盖成员。

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