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    • 9. 发明授权
    • Semiconductor device and method for making the same
    • 半导体装置及其制造方法
    • US5308784A
    • 1994-05-03
    • US955108
    • 1992-10-01
    • Yungi KimByeongyeol KimSoohan Choi
    • Yungi KimByeongyeol KimSoohan Choi
    • H01L21/76H01L21/308H01L21/762
    • H01L21/3086H01L21/76224Y10S148/05
    • There is disclosed in the present invention a method for manufacturing a semiconductor device including an isolation region defined by trenches having different or equal widths respectively on a single semiconductor substrate comprising the steps of:forming insulating films on the semiconductor substrate and then forming an aperture on a passive region (isolation region);forming spacers of etch rate different from that of the insulating films on sidewalls of the aperture to define ring-shaped trench regions surrounding outline of active regions;forming another insulating film of etch rate different from that of the spacers on the substrate where the spacers are defined and removing the spacers by etching to expose the substrate within the etched spacers; andforming trenches on the exposed area of the substrate, forming an insulating film of equal character to that of the insulating films used at the time of the formation of the aperture to refill the trenches and forming the spacers on the sidewalls of the insulating film in the passive region, thereby forming ring-shaped trenches surrounding the outlines of the active regions to be an isolation region.
    • 在本发明中公开了一种用于制造半导体器件的方法,该半导体器件包括在单个半导体衬底上分别具有不同宽度或相等宽度的沟槽限定的隔离区域,包括以下步骤:在半导体衬底上形成绝缘膜,然后形成孔 被动区域(隔离区域); 形成与孔的侧壁上的绝缘膜的蚀刻速率不同的间隔物,以限定围绕有源区的轮廓的环形沟槽区; 形成另一绝缘膜,该绝缘膜的蚀刻速率不同于限定衬垫的衬底上的间隔物的蚀刻速率,并通过蚀刻去除间隔物以暴露蚀刻间隔物内的衬底; 以及在衬底的暴露区域上形成沟槽,形成与在形成孔口时使用的绝缘膜的绝缘膜相同的绝缘膜,以重新填充沟槽并在绝缘膜的侧壁上形成间隔物 从而形成围绕有源区域的轮廓的环形沟槽成为隔离区域。