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1. 发明授权

US08453324B2 Method of manufacturing FPCB substrate 失效
标题翻译： FPCB基板的制造方法
公开(公告)号：US08453324B2
公开(公告)日：2013-06-04
申请号：US13306811
申请日：2011-11-29
申请人： Rui-Wu Liu , Yung-Wei Lai , Shing-Tza Liou
发明人： Rui-Wu Liu , Yung-Wei Lai , Shing-Tza Liou
IPC分类号： H01K3/10
CPC分类号： H05K3/4084 , H05K3/326 , H05K2201/0397 , H05K2201/10598 , H05K2203/0165 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.
摘要翻译： FPCB基板的制造方法包括以下步骤。首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。导电层具有第一表面和相对的第二表面。绝缘层具有第三表面和相对的第四表面。第三表面与第二表面接触。其次，形成从第一表面延伸到第四表面的通孔。通孔包括导电层中的金属孔和绝缘层中的绝缘孔。第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

2. 发明授权

US07985482B2 Stiffener sheet and flexible printed circuit board using the same 有权
标题翻译：加强板和柔性印刷电路板使用相同
公开(公告)号：US07985482B2
公开(公告)日：2011-07-26
申请号：US12144260
申请日：2008-06-23
申请人： Yung-Wei Lai , Cheng-Wei Kuo , Shing-Tza Liou
发明人： Yung-Wei Lai , Cheng-Wei Kuo , Shing-Tza Liou
IPC分类号： B32B27/08 , B32B27/34
CPC分类号： H05K3/0064 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/34 , B32B2250/42 , B32B2307/30 , B32B2307/306 , B32B2307/546 , B32B2307/714 , B32B2457/08 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721 , Y10T428/31725
摘要： A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.
摘要翻译：用于柔性印刷柔性印刷电路板的加强片包括交替层叠的聚酰亚胺层和聚酰胺酰亚胺层，其中聚酰胺酰亚胺的分子结构由下式表示：其中Ar和Ar'表示不同的取代芳族基团。

3. 发明申请

US20090166063A1 STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
标题翻译：加强型和加强型柔性印刷电路板
公开(公告)号：US20090166063A1
公开(公告)日：2009-07-02
申请号：US12144254
申请日：2008-06-23
申请人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
发明人： YUNG-WEI LAI , CHENG-WEI KUO , SHING-TZA LIOU
IPC分类号： H05K1/03 , B32B27/08 , C08G73/10
CPC分类号： H05K3/007 , H05K1/0393 , H05K2201/0154 , H05K2201/0195 , H05K2203/0156 , Y10T428/265 , Y10T428/31721
摘要： An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula:
摘要翻译：示例性的加强件包括至少一个聚酰亚胺层和粘附到至少一个聚酰亚胺层的至少一个聚醚酰亚胺层。所述至少一种聚醚酰亚胺层由以下通式表示：

4. 发明申请

US20130098675A1 METHOD AND APPARATUS FOR APPLICATION OF ANTI-STICTION COATING 审中-公开
标题翻译：应用防粘涂料的方法和装置
公开(公告)号：US20130098675A1
公开(公告)日：2013-04-25
申请号：US13279132
申请日：2011-10-21
申请人： Jan Bos , David Heald , Yen Hua Lin , Yung-Wei Lai , Jui-Chih Liao , Yoke-Hou Tan , Nageswara Tadepalli , Yan Du , Jianwei Liu , Richard Pietri
发明人： Jan Bos , David Heald , Yen Hua Lin , Yung-Wei Lai , Jui-Chih Liao , Yoke-Hou Tan , Nageswara Tadepalli , Yan Du , Jianwei Liu , Richard Pietri
IPC分类号： H05K7/00 , B05D5/12
CPC分类号： G02B26/001 , B81B3/0005 , B81C1/00285 , B81C2201/112
摘要： This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.
摘要翻译：本公开提供了用于制造机电系统（EMS）封装的装置，系统和方法。一种方法包括制造包含无气体防粘涂层的EMS包装。抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。在一些实施方式中，该方法包括将EMS装置密封到包装中，然后使用排出至少一部分残留溶剂的温度分布来加热包装。该方法可以包括孵育烘烤循环，以将抗静电材料分配到EMS包装内的显示元件。温育烘烤循环还可以更均匀地分布EMS包装内的污染物，以减少其影响。

5. 发明申请

US20120066903A1 METHOD OF MANUFACTURING FPCB SUBSTRATE 失效
标题翻译：制造FPCB基板的方法
公开(公告)号：US20120066903A1
公开(公告)日：2012-03-22
申请号：US13306811
申请日：2011-11-29
申请人： RUI-WU LIU , YUNG-WEI LAI , SHING-TZA LIOU
发明人： RUI-WU LIU , YUNG-WEI LAI , SHING-TZA LIOU
IPC分类号： H05K3/42
CPC分类号： H05K3/4084 , H05K3/326 , H05K2201/0397 , H05K2201/10598 , H05K2203/0165 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer.
摘要翻译： FPCB基板的制造方法包括以下步骤。首先，提供一种包含绝缘层和形成在绝缘层上的导电层的FPCB材料。导电层具有第一表面和相对的第二表面。绝缘层具有第三表面和相对的第四表面。第三表面与第二表面接触。其次，形成从第一表面延伸到第四表面的通孔。通孔包括导电层中的金属孔和绝缘层中的绝缘孔。第三，扩大绝缘孔，使金属孔周围的一部分导电层露出。最后，暴露部分被弯曲以形成通过扩大的绝缘孔并从绝缘层的第四表面突出的钩。

6. 发明授权

US08052881B2 Method of manufacturing multilayer printed circuit board having buried holes 有权
标题翻译：具有埋孔的多层印刷电路板的制造方法
公开(公告)号：US08052881B2
公开(公告)日：2011-11-08
申请号：US12164422
申请日：2008-06-30
申请人： Yun-Li Zhu , Yung-Wei Lai , Shing-Tza Liou
发明人： Yun-Li Zhu , Yung-Wei Lai , Shing-Tza Liou
IPC分类号： H05K13/00
CPC分类号： H05K3/4638 , H05K1/0269 , H05K3/20 , H05K3/4069 , H05K3/4617 , H05K2201/09063 , H05K2201/09563 , H05K2201/096 , H05K2201/10378 , H05K2203/0156 , H05K2203/166 , Y10T29/49128 , Y10T29/49156 , Y10T29/49165 , Y10T156/10
摘要： A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board.
摘要翻译：一种制造多层印刷电路板的方法包括以下步骤。提供了许多层压单元。每个层压单元包括其中限定有电路图案的导电层和可剥离地附接到导电层的剥离层。提供了许多绝缘层。每个绝缘层在其中确定了金属化的通孔。导电层和绝缘层交替地堆叠在一起，使得相邻的导电层被一个绝缘层绝缘，并且金属化的通孔电连接相邻的导电层的电路图案。在堆叠步骤中，在将导电层堆叠在各绝缘层上之后，从层压单元中去除剥离层，从而获得预层压多层印刷电路板。层叠的导电层和绝缘层被层叠在一起以实现多层印刷电路板。

7. 发明申请

US20090217520A1 METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE 审中-公开
标题翻译：在印刷电路板基板上形成焊膏的方法
公开(公告)号：US20090217520A1
公开(公告)日：2009-09-03
申请号：US12266801
申请日：2008-11-07
申请人： FENG-YAN HUANG , YUNG-WEI LAI , SHING-TZA LIOU
发明人： FENG-YAN HUANG , YUNG-WEI LAI , SHING-TZA LIOU
IPC分类号： H05K3/10
CPC分类号： H05K3/3484 , H01L24/11 , H01L2924/14 , H01L2924/1461 , H05K2203/043 , H05K2203/0568 , Y10T29/49155 , H01L2924/00
摘要： In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.
摘要翻译：在本发明中，提供了一种在印刷电路板（PCB）基板上形成焊料块的方法。提供了包括形成在其基板表面上的数个电迹线和焊盘的PCB基板。将液体光致抗蚀剂施加到PCB基板上，使得形成限定多个开口的光致抗蚀剂层，并且通过每个开口暴露每个焊盘。焊料块填充到每个开口中。焊料质量被回流并且去除光致抗蚀剂层。

8. 发明申请

US20090120671A1 FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译： FPCB基板及其制造方法
公开(公告)号：US20090120671A1
公开(公告)日：2009-05-14
申请号：US12170735
申请日：2008-07-10
申请人： Rui-Wu Liu , Yung-Wei Lai , Shing-Tza Liou
发明人： Rui-Wu Liu , Yung-Wei Lai , Shing-Tza Liou
IPC分类号： H05K1/03 , H05K3/42
CPC分类号： H05K3/4084 , H05K3/326 , H05K2201/0397 , H05K2201/10598 , H05K2203/0165 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.
摘要翻译：柔性印刷电路板基板包括导电层，绝缘层和钩。导电层具有与第一表面相对的第一表面和第二表面。该绝缘层具有与第三表面相对的第三表面和第四表面。绝缘层的第三表面与导电层的第二表面结合。在导电层和绝缘层中限定了通孔，该绝缘层从导电层的第一表面延伸到绝缘层的第四表面。钩从导电层延伸并穿过通孔从绝缘层的第四表面突出。

9. 发明授权

US06758713B2 Package method and apparatus for organic electro-luminescent display 失效
标题翻译：有机电致发光显示器的封装方法和装置
公开(公告)号：US06758713B2
公开(公告)日：2004-07-06
申请号：US10063976
申请日：2002-05-30
申请人： Mao-Kuo Wei , Yung-Wei Lai
发明人： Mao-Kuo Wei , Yung-Wei Lai
IPC分类号： H05B3310
CPC分类号： H01L51/5246 , H01L51/524
摘要： A package method for an organic electro-luminescent display, which spreads a certain amount of ultra-violet curing resin or thermal curing resin on a lamination plate or a substrate, to obtain a global spreading effect by forming a trench at an of the lamination plate. The lamination plate with the trench at the edge thereon is provided by a lamination plate supply system. The lamination plate is aligned and laminated with the substrate, and ultra-violet light radiation or thermal process is performed for curing the ultra-violet or thermal curing resin, respectively. In the alignment and lamination process, the space between the lamination plate and the substrate is controlled by adjusting lamination pressure and movement of the lamination machine; thereby, the exceeding ultra-violet or thermal curing resin flows into the trench at the edge of the lamination plate, and dimension of the package can thus be controlled.
摘要翻译：一种用于有机电致发光显示器的封装方法，其在层压板或基板上铺展一定量的紫外线固化树脂或热固化树脂，以通过在层压板上形成沟槽来获得全局扩散效果。在其边缘处具有沟槽的层压板由层压板供应系统提供。层压板与衬底对准并层压，并且执行紫外光辐射或热处理以分别固化紫外线或热固化树脂。在对准和层压过程中，通过调节层压机的层压压力和移动来控制层压板和基板之间的空间; 从而超过紫外线或热固化树脂流入层压板边缘的沟槽，从而可以控制封装的尺寸。

10. 发明授权

US08205330B2 Method for manufacturing a printed circuit board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US08205330B2
公开(公告)日：2012-06-26
申请号：US12135873
申请日：2008-06-09
申请人： Qi Zhang , Yung-Wei Lai , Shing-Tza Liou
发明人： Qi Zhang , Yung-Wei Lai , Shing-Tza Liou
IPC分类号： H01K3/10
CPC分类号： H05K3/4069 , H05K3/4602 , H05K3/4652 , H05K3/4664 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
摘要翻译：提供了制造印刷电路板的示例性方法。在该方法中，提供了具有在基板与第一表面相对的第一表面和第二表面的基板。形成在第一表面和第二表面之间的衬底中的多个通孔。将导电浆料施加到基材上以填充限定在基材中的通孔，以形成多个填充构件，并印刷在基板的第一表面和第二表面中的至少一个上以形成多个电迹线。位于衬底中的通孔中的填充构件和印刷在衬底上的电迹线被固化。

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