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    • 1. 发明授权
    • Method of manufacturing thin film transistor having a double channel
    • 具有双通道的薄膜晶体管的制造方法
    • US5670398A
    • 1997-09-23
    • US559880
    • 1995-11-20
    • Sung Wook YinYun Ki Kim
    • Sung Wook YinYun Ki Kim
    • G02F1/136H01L21/336H01L27/12H01L29/786H01L21/265
    • H01L29/78696H01L29/6675
    • This invention provides a method for manufacturing a thin film transistor which comprised the steps of providing an oxide layer; etching a portion of the oxide layer so that a recess is formed; forming a first channel layer on the resulting structure; forming a first gate oxide layer on the first channel layer in a portion including the recess region; forming a polysilicon layer on the resulting structure, filling in the recess region; etching back the polysilicon layer until the surface of a portion of the first gate oxide layer, leaving the residual layer on the first channel layer, which is exposed by the first gate oxide layer, wherein the surface of the resulting structure has uniform topology by the etching process; forming a second gate oxide layer on the polysilicon layer; forming a second channel layer on the resulting structure; and implanting impurity ions for forming source/drain regions, whereby the source/drain region consists of multi-layers, the first channel layer, the second polysilicon layer and the second channel layer.
    • 本发明提供一种制造薄膜晶体管的方法,其包括提供氧化物层的步骤; 蚀刻氧化物层的一部分以形成凹陷; 在所得结构上形成第一通道层; 在包括所述凹部区域的部分中的所述第一沟道层上形成第一栅氧化层; 在所得结构上形成多晶硅层,填充在凹陷区域中; 蚀刻回多晶硅层直到第一栅极氧化物层的一部分的表面,留下由第一栅极氧化物层暴露的第一沟道层上的残余层,其中所得结构的表面具有均匀的拓扑结构,由 蚀刻工艺; 在所述多晶硅层上形成第二栅氧化层; 在所得结构上形成第二通道层; 以及注入用于形成源/漏区的杂质离子,由此源/漏区由多层,第一沟道层,第二多晶硅层和第二沟道层组成。
    • 3. 发明授权
    • Method of manufacturing a capacitor in a semiconductor integrated circuit and a capacitor fabricated thereby
    • 在半导体集成电路中制造电容器的方法和由此制造的电容器
    • US06423608B1
    • 2002-07-23
    • US09704764
    • 2000-11-03
    • Yun-Ki Kim
    • Yun-Ki Kim
    • H01L2120
    • H01L27/10855H01L27/10814H01L28/91
    • A capacitor in a semiconductor integrated circuit, and a method for fabricating the capacitor is disclosed. A method of an embodiment of the invention includes first providing a semiconductor substrate having disposed thereon an interlayer insulating layer. A lower sacrificial insulating layer and an upper etching stopper layer then are sequentially formed on the interlayer insulating layer on the semiconductor substrate. The upper etching stopper layer and the lower sacrificial insulating layer then are sequentially patterned to form a storage electrode hole, and to expose a predetermined portion of the interlayer insulating layer. The method then includes forming an outer cylindrical storage electrode in the storage electrode hole, a conductive liner surrounded by the outer cylindrical storage electrode, and an inner storage electrode surrounded by the conductive liner. Finally, the method of an embodiment of the invention includes selectively etching the conductive liner to expose an inner sidewall of the outer cylindrical storage electrode and an outer sidewall of the inner storage electrode. Depending on the storage electrode dimension, the inner storage electrode can exhibit a circular columnar configuration or a cylindrical configuration.
    • 公开了一种半导体集成电路中的电容器及其制造方法。 本发明实施例的方法包括首先提供其上设置有层间绝缘层的半导体衬底。 然后在半导体衬底上的层间绝缘层上依次形成下牺牲绝缘层和上蚀刻阻挡层。 上蚀刻停止层和下牺牲绝缘层依次图案化以形成存储电极孔,并露出层间绝缘层的预定部分。 该方法包括在存储电极孔中形成外圆柱形存储电极,由外圆柱形存储电极包围的导电衬垫和由导电衬垫包围的内部存储电极。 最后,本发明实施例的方法包括选择性地蚀刻导电衬垫以暴露外圆柱形存储电极的内侧壁和内存储电极的外侧壁。 根据存储电极尺寸,内部存储电极可呈圆柱形或圆柱形。
    • 9. 发明授权
    • Thin film transistor having double channels and its manufacturing method
    • 具有双通道的薄膜晶体管及其制造方法
    • US5883399A
    • 1999-03-16
    • US893544
    • 1997-07-08
    • Sung Wook YinYun Ki Kim
    • Sung Wook YinYun Ki Kim
    • G02F1/136H01L21/336H01L27/12H01L29/786H01L29/205
    • H01L29/78696H01L29/6675
    • This invention provides a method for manufacturing a this film transistor which comprised the steps of providing an oxide layer; etching a portion of the oxide layer so that a recess is formed; forming a first channel layer on the resulting structure; forming a first gate oxide layer on the first channel layer in a portion including the recess region; forming a polysilicon layer on the resulting structure, filling in the recess region; etching back the polysilicon layer until the surface of a portion of the first gate oxide layer, leaving the residual layer on the first channel layer, which is exposed by the first gate oxide layer, wherein the surface of the resulting structure has uniform topology by the etching process; forming a second gate oxide layer on the polysilicon layer; forming a second channel layer on the resulting structure; and implanting impurity ions for forming source/drain regions, whereby the source/drain region consists of multi-layers, the first channel layer, the second polysilicon layer and the second channel layer.
    • 本发明提供一种制造该薄膜晶体管的方法,该方法包括以下步骤:提供氧化物层; 蚀刻氧化物层的一部分以形成凹陷; 在所得结构上形成第一通道层; 在包括所述凹部区域的部分中的所述第一沟道层上形成第一栅氧化层; 在所得结构上形成多晶硅层,填充在凹陷区域中; 蚀刻回多晶硅层直到第一栅极氧化物层的一部分的表面,留下由第一栅极氧化物层暴露的第一沟道层上的残余层,其中所得结构的表面具有均匀的拓扑结构,由 蚀刻工艺; 在所述多晶硅层上形成第二栅氧化层; 在所得结构上形成第二通道层; 以及注入用于形成源/漏区的杂质离子,由此源/漏区由多层,第一沟道层,第二多晶硅层和第二沟道层组成。