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    • 1. 发明授权
    • Apparatus for inspecting a wafer
    • 用于检查晶片的装置
    • US07079237B2
    • 2006-07-18
    • US10680342
    • 2003-10-08
    • Jai-Young WooKyung-Ho KimYun-Chang ChoiHye-Jung ChoiSung-Uk Park
    • Jai-Young WooKyung-Ho KimYun-Chang ChoiHye-Jung ChoiSung-Uk Park
    • G01N21/88
    • G01N21/9501G01N21/9503
    • An apparatus for inspecting a wafer includes a handling unit for supporting, rotating and moving the wafer in horizontal and vertical directions, a first image acquisition unit for acquiring a first image corresponding to an upper surface of the wafer supported by the handling unit, a second image acquisition unit for acquiring a second image, a third image and a fourth image corresponding to a peripheral portion of the upper surface, a side surface and a lower surface of the wafer supported by the handling unit, respectively, a first driving unit for rotating the second image acquisition unit about a peripheral portion of the wafer supported by the handling unit in order to acquiring the second, third and fourth images, and an image processing unit for inspecting defects of the wafer supported by the handling unit from the first to fourth images.
    • 用于检查晶片的装置包括:用于在水平和垂直方向上支撑,旋转和移动晶片的处理单元,用于获取与由处理单元支撑的晶片的上表面相对应的第一图像的第一图像获取单元; 用于获取第二图像的图像获取单元,对应于由所述处理单元支撑的所述晶片的上表面的周边部分,侧表面和下表面的第三图像和第四图像,用于旋转的第一驱动单元 所述第二图像获取单元围绕由所述处理单元支撑的晶片的周边部分,以获取所述第二,第三和第四图像;以及图像处理单元,用于检查由所述处理单元支撑的所述晶片的缺陷,所述图像处理单元从第一至第四 图片。