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    • 2. 发明授权
    • Corrosion-resistant member
    • 耐腐蚀构件
    • US06258741B1
    • 2001-07-10
    • US09201030
    • 1998-11-30
    • Shoji KohsakaYumiko ItohHitoshi MatsunosakoHidemi MatsumotoMasahito Nakanishi
    • Shoji KohsakaYumiko ItohHitoshi MatsunosakoHidemi MatsumotoMasahito Nakanishi
    • C04B35563
    • C04B35/563
    • This invention relates to a corrosion-resistant member used in a region in which a gas or a plasma of a halogen-containing compound is used, in a process for producing semiconductors, especially a member used as jigs such as a supporter for supporting a material to be treated, or as an inner wall member in an apparatus for producing semiconductors, which has a high corrosion resistance to a fluorine type or a chlorine type corrosive gas, or a fluorine type or a chlorine type plasma. According to this invention, there are provided a corrosion-resistant member to be used ina region in which a gas or plasma of a halogen compound is used in a process of producing a semiconductor, wherein at least surface exposed to the gas or plasma is formed of a boron carbide sintered body having a relative density of at least 96% and containing 300 ppm or below, in a total amount, of an alkali metal, an alkalin earth metal and a transition metal, and a process for producing the same.
    • 本发明涉及在半导体制造方法中使用的含卤素化合物的气体或等离子体的区域中使用的耐腐蚀性构件,特别是用作支撑材料的支撑体等的构件 作为对氟类或氯型腐蚀性气体或氟型或氯型等离子体具有高耐腐蚀性的半导体制造装置中的内壁部件。 根据本发明,提供了在制造半导体的工艺中使用卤素化合物的气体或等离子体的区域中使用的耐腐蚀构件,其中形成至少暴露于气体或等离子体的表面 的碳化硼烧结体及其制造方法,其总量相对于碱金属,碱土金属和过渡金属的相对密度为96%以上且含有300ppm以下。
    • 8. 发明授权
    • Ceramic member resistant to halogen-plasma corrosion
    • 陶瓷构件耐卤素等离子体腐蚀
    • US06383964B1
    • 2002-05-07
    • US09450162
    • 1999-11-29
    • Masahiro NakaharaYumiko Itoh
    • Masahiro NakaharaYumiko Itoh
    • C04B35505
    • C04B35/18C04B35/117
    • The present invention is to provide ceramic members for being used as members constituting a processing chamber for etching or cleaning semiconductor substrates or wafers by halogen plasma. A ceramic member includes at least 10% by volume of a compound of yttrium-aluminum-garnet (YAG) phase and not more than 90% by volume of at least an oxide phase selected from aluminum oxide, yttrium oxide and aluminum nitride. Particularly, the ceramic member contains yttrium within a range of 35 to 80 mole % in terms of yttrium oxide Y2O3 and aluminum within a range of 20 to 65 mole % in terms of aluminum oxide Al2O3 to form a mixture of YAG phase with yttria phase, producing ceramic material having high corrosion resistance to halogenous gas and its plasma. Such ceramic material may be well applicable to members to be exposed by the halogen plasma, for example, a chamber wall, a wafer stage, a clamp ring, a shower head, which are used in systems for etching and cleaning semiconductor wafers. A ceramic member of the invention can also be composed of YAG and alumina or aluminum nitride, showing high thermal conductivity enough to prevent a deposit of the reaction products of halide over the whole members in the chamber by external heating.
    • 本发明提供陶瓷构件,用作构成用于通过卤素等离子体蚀刻或清洗半导体衬底或晶片的处理室的构件。 陶瓷构件包括至少10体积%的钇 - 铝 - 石榴石(YAG)相的化合物和不大于90体积%的至少一种选自氧化铝,氧化钇和氮化铝的氧化物相。 特别地,陶瓷构件以氧化钇Y 2 O 3换算为35〜80摩尔%的范围,铝氧化铝为20〜65摩尔%的铝,形成YAG相与氧化钇相的混合物, 生产对卤素气体及其等离子体具有高耐腐蚀性的陶瓷材料。 这种陶瓷材料可以很好地应用于被卤素等离子体暴露的构件,例如用于蚀刻和清洁半导体晶片的系统中的室壁,晶片台,夹紧环,淋浴头。 本发明的陶瓷构件也可以由YAG和氧化铝或氮化铝组成,显示出高的导热性,足以防止卤化物的反应产物通过外部加热沉积在室中的整个构件上。