专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120164909A1 DISPLAY DEVICE MANUFACTURING METHOD AND APPARATUS 审中-公开
标题翻译：显示器件制造方法和装置
公开(公告)号：US20120164909A1
公开(公告)日：2012-06-28
申请号：US13275792
申请日：2011-10-18
申请人： Yukihiko OHASHI , Hirokazu YAMANISHI
发明人： Yukihiko OHASHI , Hirokazu YAMANISHI
IPC分类号： H01J9/00
CPC分类号： G02F1/1333 , G02F1/133305
摘要： The present disclosure is directed to a method of manufacturing a display device including a first substrate including a conductive layer and a terminal, a second substrate, and a display element disposed between the first substrate and the second substrate.The first substrate and the second substrate are bonded together.A groove is formed in the second substrate, the groove defining a border of a facing section facing the terminal of the first substrate.The groove may be formed before bonding the first substrate and the second substrate together.A nail member is inserted into a gap between the facing section of the second substrate and the terminal of the first substrate, and the nail member is moved to a direction including a component in a direction vertical to an extending direction of the groove.
摘要翻译：本公开涉及一种制造显示装置的方法，所述显示装置包括包括导电层和端子的第一基板，第二基板以及设置在第一基板和第二基板之间的显示元件。第一基板和第二基板接合在一起。在所述第二基板中形成凹槽，所述凹槽限定面向所述第一基板的端子的面对部分的边界。可以在将第一基板和第二基板接合在一起之前形成凹槽。指甲部件被插入到第二基板的相对部分和第一基板的端子之间的间隙中，并且指甲部件沿垂直于凹槽的延伸方向的方向移动到包括部件的方向。

2. 发明申请

US20110076009A1 OPTICAL AXIS ADJUSTING APPARATUS AND OPTICAL AXIS ADJUSTING METHOD 审中-公开
标题翻译：光轴调整装置和光轴调整方法
公开(公告)号：US20110076009A1
公开(公告)日：2011-03-31
申请号：US12887625
申请日：2010-09-22
申请人： Masahiko SATO , Jun MATSUEDA , Yukihiko OHASHI , Yoshinori HINO
发明人： Masahiko SATO , Jun MATSUEDA , Yukihiko OHASHI , Yoshinori HINO
IPC分类号： H04J14/00
CPC分类号： G02B6/3588 , G02B6/2938 , G02B6/3512 , G02B6/3548 , G02B6/356
摘要： An optical axis adjusting apparatus for an optical device includes a drive unit moving an optical component through which communication light emitted from a light source passes, a plate member disposed facing the optical component, the plate member allowing light to transmit through the plate member and reflecting light to the optical component, a photographing unit disposed on a back side of the plate member, taking an image irradiated with the light transmitted through the plate member, and a control section controlling the drive unit to move the optical component based on the image and information on optical characteristics of the light reflected by the plate member.
摘要翻译：光学装置的光轴调整装置包括：驱动单元，其移动通过光源发出的通信光的光学部件;与该光学部件相对设置的板部件;使该光透过板部件反射的板部件; 照射到所述光学部件的照相机，设置在所述平板部件的背面侧的拍摄单元，拍摄通过所述平板部件透射的光照射的图像;以及控制部，其控制所述驱动部，基于所述图像移动所述光学部件，关于由板构件反射的光的光学特性的信息。

3. 发明申请

US20090321014A1 SEMICONDUCTOR DEVICE PRODUCING METHOD, SEMICONDUCTOR DEVICE PRODUCING APPARATUS AND PIN 失效
标题翻译：半导体器件制造方法，制造设备和引脚的半导体器件
公开(公告)号：US20090321014A1
公开(公告)日：2009-12-31
申请号：US12394883
申请日：2009-02-27
申请人： Yukihiko OHASHI
发明人： Yukihiko OHASHI
IPC分类号： B32B38/18 , B32B37/00
CPC分类号： H01L21/6838 , H01L21/563 , H01L24/28 , H01L24/81 , H01L24/95 , H01L2224/73203 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , Y10T29/4913 , Y10T29/49895 , Y10T156/17
摘要： A semiconductor device producing method includes: vacuum-adsorbing a printed substrate on a vacuum adsorption surface of a stage with the printed substrate being pressed on the vacuum adsorption surface; temporarily fixing the printed substrate on the stage by commonly inserting a pin to a through hole formed in the printed substrate and a hole formed in the stage; and releasing the vacuum adsorption.
摘要翻译：一种半导体器件的制造方法，其特征在于，在印刷基板被真空吸附面压制的阶段的真空吸附面上真空吸附印刷基板; 通过将销插入到形成在印刷基板上的通孔和在台中形成的孔来临时将印刷基板固定在平台上; 并释放真空吸附。

4. 发明授权

US08286340B2 Method of manufacturing and warpage correcting of printed circuit board assembly 有权
标题翻译：印刷电路板组件的制造和翘曲校正方法
公开(公告)号：US08286340B2
公开(公告)日：2012-10-16
申请号：US11841393
申请日：2007-08-20
申请人： Yukihiko Ohashi
发明人： Yukihiko Ohashi
IPC分类号： H05K3/20
CPC分类号： H05K3/0058 , H05K1/0271 , H05K3/341 , H05K3/3494 , H05K13/0069 , H05K2201/09136 , H05K2201/09781 , H05K2203/0152 , H05K2203/0195 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： A printed circuit board for mounting an electronic part includes a mounting surface configured so that the electronic part is mounted. A warpage correcting metal pattern is provided on a back surface of the printed circuit board opposite to the mounting surface. The warpage correcting metal pattern may be formed of a metal film or a metal layer joinable with a thermally meltable joining material.
摘要翻译：一种用于安装电子部件的印刷电路板，包括安装在电子部件上的安装面。翘曲校正金属图案设置在印刷电路板的与安装表面相对的背面上。翘曲校正金属图案可以由与可热熔接合材料接合的金属膜或金属层形成。

5. 发明授权

US07733374B2 Image pickup device and substrate mounting apparatus for an electronic part 有权
标题翻译：用于电子部件的图像拾取装置和基板安装装置
公开(公告)号：US07733374B2
公开(公告)日：2010-06-08
申请号：US11068914
申请日：2005-03-02
申请人： Yukihiko Ohashi
发明人： Yukihiko Ohashi
IPC分类号： H04N5/225 , H04N7/18 , H04N9/07
CPC分类号： G02B27/62
摘要： An image pickup device includes: a prism ii including light entrance holes (16, 16) and a light exit hole (17) for exiting incident light by refracting the incident light from the light entrance holes (16, 16) and; a lens (12) located on a light exit hole (17) side of the prism (11); a camera (13) located on an opposite side to the prism (11) with respect to the lens (12), and a base (14) that supports the prism (11), the lens (12), and the camera (13). The light exit hole (16) of the prism (11), the lens (12), and the camera (13) are arranged on the same optical axis (10). Any one or both of the prism (11) and the lens (12) and/or the lens (12) and the camera (13) are separated from each other.
摘要翻译：一种图像拾取装置包括：棱镜ii，包括光入射孔（16,16）和光出射孔（17），用于通过折射来自光入射孔（16,16）的入射光来射出入射光; 位于所述棱镜（11）的光出射孔（17）侧的透镜（12）; 相对于透镜（12）位于与棱镜（11）相反的一侧的相机（13），以及支撑棱镜（11），透镜（12）和照相机（13）的基座（14））。棱镜（11）的光出射孔（16），透镜（12）和照相机（13）被布置在相同的光轴（10）上。棱镜（11）和透镜（12）和/或透镜（12）和相机（13）中的任何一个或两个彼此分离。

6. 发明申请

US20080123307A1 PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD ASSEMBLY, ELECTRONIC DEVICE, MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD, AND WARPAGE CORRECTING METHOD OF PRINTED CIRCUIT BOARD 有权
标题翻译：印刷电路板，印刷电路板组件，电子设备，印刷电路板的制造方法和印刷电路板的修正方法
公开(公告)号：US20080123307A1
公开(公告)日：2008-05-29
申请号：US11841393
申请日：2007-08-20
申请人： Yukihiko OHASHI
发明人： Yukihiko OHASHI
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/0058 , H05K1/0271 , H05K3/341 , H05K3/3494 , H05K13/0069 , H05K2201/09136 , H05K2201/09781 , H05K2203/0152 , H05K2203/0195 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： A printed circuit board for mounting an electronic part includes a mounting surface configured so that the electronic part is mounted. A warpage correcting metal pattern is provided on a back surface of the printed circuit board opposite to the mounting surface. The warpage correcting metal pattern may be formed of a metal film or a metal layer joinable with a thermally meltable joining material
摘要翻译：一种用于安装电子部件的印刷电路板，包括安装在电子部件上的安装面。翘曲校正金属图案设置在印刷电路板的与安装表面相对的背面上。翘曲校正金属图案可以由与可热熔接合材料接合的金属膜或金属层形成

7. 发明授权

US08147646B2 Semiconductor device producing method 失效
标题翻译：半导体器件制造方法
公开(公告)号：US08147646B2
公开(公告)日：2012-04-03
申请号：US12394883
申请日：2009-02-27
申请人： Yukihiko Ohashi
发明人： Yukihiko Ohashi
IPC分类号： C09J5/00 , B29C65/00
CPC分类号： H01L21/6838 , H01L21/563 , H01L24/28 , H01L24/81 , H01L24/95 , H01L2224/73203 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , Y10T29/4913 , Y10T29/49895 , Y10T156/17
摘要： A semiconductor device producing method includes: vacuum-adsorbing a printed substrate on a vacuum adsorption surface of a stage with the printed substrate being pressed on the vacuum adsorption surface; temporarily fixing the printed substrate on the stage by commonly inserting a pin to a through hole formed in the printed substrate and a hole formed in the stage; and releasing the vacuum adsorption.
摘要翻译：一种半导体器件的制造方法，其特征在于，在印刷基板被真空吸附面压制的阶段的真空吸附面上真空吸附印刷基板; 通过将销插入到形成在印刷基板上的通孔和在台中形成的孔来临时将印刷基板固定在平台上; 并释放真空吸附。

8. 发明申请

US20070175563A1 Optical component manufacturing apparatus and method, and optical component lens assembling apparatus 有权
标题翻译：光学部件制造装置和方法以及光学部件透镜组装装置
公开(公告)号：US20070175563A1
公开(公告)日：2007-08-02
申请号：US11431619
申请日：2006-05-11
申请人： Masahiko Sato , Mitsuji Matsumoto , Yoshinori Hino , Yukihiko Ohashi , Hideaki Namiki
发明人： Masahiko Sato , Mitsuji Matsumoto , Yoshinori Hino , Yukihiko Ohashi , Hideaki Namiki
IPC分类号： B32B37/12 , B32B38/00
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/4225 , Y10T156/1744 , Y10T156/1798
摘要： An object is to provide an optical component lens assembling apparatus which is capable of automating the assembly of an optical component having a minute lens and an optical fiber. This apparatus includes: a fiber block fixing device 20 that fixes in position a fiber block 13 on which an optical fiber 11 is provided; a lens grasping device 21 for grasping the outer peripheral side surface of a lens 12 supplied to a lens supply position; an adhesive applying device 22; a lens moving device 23 for placing the one end surface of the lens 12, to which the adhesive has been applied, at a predetermined position of the fiber block 13; and an optical axis alignment state detecting device 24 for detecting the optical axis alignment state of the optical fiber 11 and the lens 12.
摘要翻译：本发明的目的是提供一种能够使具有微小透镜和光纤的光学部件的组装自动化的光学部件透镜组装装置。该装置包括：光纤块固定装置20，其固定在其上设置有光纤11的光纤块13; 用于抓住提供给透镜供给位置的透镜12的外周侧表面的透镜抓握装置21; 粘合剂施加装置22; 用于将已经施加有粘合剂的透镜12的一个端面放置在光纤块13的预定位置的透镜移动装置23; 以及用于检测光纤11和透镜12的光轴取向状态的光轴取向状态检测装置24。

9. 发明申请

US20060092308A1 Image pickup device and substrate mounting apparatus for an electronic part 有权
标题翻译：用于电子部件的图像拾取装置和基板安装装置
公开(公告)号：US20060092308A1
公开(公告)日：2006-05-04
申请号：US11068914
申请日：2005-03-02
申请人： Yukihiko Ohashi
发明人： Yukihiko Ohashi
IPC分类号： G02B13/16
CPC分类号： G02B27/62
摘要： An image pickup device includes: a prism 11 including light entrance holes 16, 16 and a light exit hole 17 for exiting incident light by refracting the incident light from the light entrance holes 16, 16 and; a lens 12 located on a light exit hole 17 side of the prism 11; a camera 13 located on an opposite side to the prism 11 with respect to the lens 12, and a base 14 that supports the prism 11, the lens 12, and the camera 13. The light exit hole 16 of the prism 11, the lens 12, and the camera 13 are arranged on the same optical axis 10. Any one or both of the prism 11 and the lens 12 and/or the lens 12 and the camera 13 are separated from each other.
摘要翻译：图像拾取装置包括：棱镜11，其包括光入射孔16,16和光出射孔17，用于通过折射来自光入射孔16,16的入射光来射出入射光; 位于棱镜11的光出射孔17侧的透镜12; 相对于透镜12位于与棱镜11相反的一侧的相机13以及支撑棱镜11，透镜12和照相机13的基座14.棱镜11的光出射孔16，透镜 12，相机13配置在相同的光轴10上。棱镜11和透镜12和/或透镜12和照相机13中的任何一个或两个彼此分离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式