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1. 发明申请

US20130048350A1 BASE MEMBER 审中-公开
标题翻译：基地会员
公开(公告)号：US20130048350A1
公开(公告)日：2013-02-28
申请号：US13588013
申请日：2012-08-17
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
IPC分类号： H05K1/05
CPC分类号： H05K3/4608 , H05K1/0287 , H05K1/0306 , H05K3/002 , H05K3/4061 , H05K3/42 , H05K2201/09609
摘要： A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.
摘要翻译：基底构件包括：芯层，包括：由氧化铝制成的板状体; 以及在板状体的厚度方向上穿过板状体的多个线状导体; 形成在芯层的第一表面和第二表面中的至少一个上的结合层; 以及形成在所述接合层上的硅层或玻璃层。

2. 发明授权

US08362369B2 Wiring board 有权
标题翻译：接线板
公开(公告)号：US08362369B2
公开(公告)日：2013-01-29
申请号：US12792334
申请日：2010-06-02
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Masao Nakazawa
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Masao Nakazawa
IPC分类号： H05K1/11
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K1/0287 , H05K1/0306 , H05K3/4605 , H05K3/4644 , H05K2201/09609 , H05K2201/09945 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.
摘要翻译：布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。绝缘基材由无机电介质制成。由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

3. 发明申请

US20110184991A1 INFORMATION MANAGING COMPUTER PRODUCT, APPARATUS, AND METHOD 有权
标题翻译：信息管理计算机产品，设备和方法
公开(公告)号：US20110184991A1
公开(公告)日：2011-07-28
申请号：US13005157
申请日：2011-01-12
申请人： Yuichi MATSUDA , Yuji Nomura
发明人： Yuichi MATSUDA , Yuji Nomura
IPC分类号： G06F17/30
CPC分类号： H04L41/069 , G06F11/079 , H04L41/0622
摘要： A computer-readable non-transitory recording medium storing therein an information managing program causing a computer to execute extracting from among events that have occurred at objects under management and having dependence relations, combinations of a first event that has occurred at a source-of-dependence object and a second event that has occurred at a dependent object dependent on the source-of-dependence object; judging for each extracted combination, whether a dependence relation exists between the first event and the second event, by using the difference between the time of occurrence of the first event and that of the second event; determining from among the events and based on a judgment result obtained at the judging, an event that has occurred at an object that is a source-of-dependence object but not a dependent object, to be an event to be stored; and storing to a database, information related to the event to be stored.
摘要翻译：一种存储信息管理程序的计算机可读的非暂时性记录介质，其使得计算机执行从在管理对象发生的事件中提取并具有依赖关系的信息管理程序，依赖对象和依赖于依赖关系对象的依赖对象发生的第二个事件; 对于每个提取的组合，通过使用第一事件的发生时间和第二事件的发生时间之间的差异，判断第一事件和第二事件之间是否存在依赖关系; 从所述事件中确定并且基于在所述判断处获得的判断结果，将在作为依赖源的对象而不是依赖对象的对象发生的事件作为要存储的事件; 并向数据库存储与要存储的事件相关的信息。

4. 发明申请

US20110175235A1 WIRING SUBSTRATE AND SEMICONDUCTOR APPARATUS INCLUDING THE WIRING SUBSTRATE 有权
标题翻译：配线基板和半导体装置，包括布线基板
公开(公告)号：US20110175235A1
公开(公告)日：2011-07-21
申请号：US13009987
申请日：2011-01-20
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda
IPC分类号： H01L23/48
CPC分类号： H01L23/552 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L24/16 , H01L25/0657 , H01L25/105 , H01L2223/6622 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/3025 , H01L2924/00
摘要： A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.
摘要翻译：布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。

5. 发明申请

US20110018144A1 WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
标题翻译：接线板和半导体器件
公开(公告)号：US20110018144A1
公开(公告)日：2011-01-27
申请号：US12813692
申请日：2010-06-11
申请人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio Horiuchi , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
IPC分类号： H01L23/48 , H05K1/00
CPC分类号： H01L23/49827 , H01L23/49838 , H01L23/50 , H01L24/16 , H01L2224/16225 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/0227 , H05K1/162 , H05K3/4605 , H05K2201/09236 , H05K2201/093 , H05K2201/09309 , H05K2201/09345 , H05K2201/09609
摘要： A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
摘要翻译：布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线线性导体。

6. 发明申请

US20110013340A1 CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电容器及其制造方法
公开(公告)号：US20110013340A1
公开(公告)日：2011-01-20
申请号：US12833185
申请日：2010-07-09
申请人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Yukio Shimizu , Tomoo Yamasaki , Yuta Sakaguchi
IPC分类号： H01G4/06 , H05K3/30
CPC分类号： H05K1/162 , H01G4/012 , H01G4/232 , H01G4/302 , H05K1/0287 , H05K1/0306 , H05K2201/09263 , H05K2201/09563 , H05K2201/09609 , H05K2201/097 , H05K2201/09945
摘要： A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.
摘要翻译：电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

7. 发明申请

US20110012266A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及制造半导体器件的方法
公开(公告)号：US20110012266A1
公开(公告)日：2011-01-20
申请号：US12832177
申请日：2010-07-08
申请人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
发明人： Michio HORIUCHI , Yasue Tokutake , Yuichi Matsuda , Tomoo Yamasaki , Yuta Sakaguchi
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/09701 , H05K1/0306 , H05K1/185 , H05K3/4605 , H05K2201/0116 , H05K2201/09609 , H05K2201/09945 , H05K2201/10674 , H05K2203/0315 , H05K2203/1142 , H01L2924/00
摘要： In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on the top surfaces of the substrate and the semiconductor chip. A first wiring layer is formed on the first insulating layer and electrically connected via through holes of the first insulating layer to the semiconductor chip and some line conductors exposed to one of the through holes. A second insulating layer is formed on the bottom surfaces of the substrate and the semiconductor chip. A second wiring layer is formed on the second insulating layer and electrically connected via a through hole of the second insulating layer to some line conductors exposed to the through hole.
摘要翻译：在半导体器件中，衬底包括从衬底的顶表面到底表面穿透衬底的多个线导体。半导体芯片固定在基板的孔中。在衬底和半导体芯片的顶表面上形成第一绝缘层。第一布线层形成在第一绝缘层上，并且经由第一绝缘层的通孔与半导体芯片电连接，一些线导体暴露于一个通孔。在基板和半导体芯片的底面上形成第二绝缘层。第二布线层形成在第二绝缘层上，并且经由第二绝缘层的通孔与暴露于通孔的一些线导体电连接。

8. 发明申请

US20100307808A1 WIRING BOARD 有权
标题翻译：接线板
公开(公告)号：US20100307808A1
公开(公告)日：2010-12-09
申请号：US12792334
申请日：2010-06-02
申请人： Michio HORIUCHI , Yasue TOKUTAKE , Yuichi MATSUDA , Masao NAKAZAWA
发明人： Michio HORIUCHI , Yasue TOKUTAKE , Yuichi MATSUDA , Masao NAKAZAWA
IPC分类号： H05K1/11
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K1/0287 , H05K1/0306 , H05K3/4605 , H05K3/4644 , H05K2201/09609 , H05K2201/09945 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.
摘要翻译：布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。绝缘基材由无机电介质制成。由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

9. 发明申请

US20090310500A1 DELAY TIME MEASURING APPARATUS, COMPUTER READABLE RECORD MEDIUM ON WHICH DELAY TIME MEASURING PROGRAM IS RECORDED, AND DELAY TIME MEASURING METHOD 有权
标题翻译：延迟时间测量装置，延迟时间测量程序记录的计算机可读记录介质和延迟时间测量方法
公开(公告)号：US20090310500A1
公开(公告)日：2009-12-17
申请号：US12410138
申请日：2009-03-24
申请人： Yuichi Matsuda , Yuji Nomura
发明人： Yuichi Matsuda , Yuji Nomura
IPC分类号： H04L12/26
CPC分类号： H04L43/0864 , H04L43/106
摘要： In a delay time measuring apparatus a sequence number, data length, and receiving time of a data packet transmitted from a source unit to a destination unit are stored in a storage section. In addition, an ACK number and receiving time of an ACK packet returned from the destination unit to the source unit are stored in the storage section. After that, a calculation section obtains an ACK packet an ACK number of which is equal to a value obtained by adding data length of a second data packet of two successive data packets transmitted without waiting for the ACK packet to a sequence number of the second data packet of the two successive data packets from the storage section. Then the calculation section calculates round trip time from receiving time of the second data packet of the two successive data packets and receiving time of the ACK packet obtained.
摘要翻译：在延迟时间测量装置中，从源单元发送到目的地单元的数据分组的序列号，数据长度和接收时间被存储在存储部分中。此外，从目的地单元返回到源单元的ACK分组的ACK号码和接收时间被存储在存储部分中。之后，计算部分获得ACK分组的ACK数量，该ACK分组的数量等于通过将不等待ACK分组发送的两个连续的数据分组的第二数据分组的数据长度与第二数据的序列号相加而获得的值来自存储部分的两个连续数据分组的分组。然后，计算部分计算两个连续数据分组的第二数据分组的接收时间和获得的ACK分组的接收时间的往返时间。

10. 发明授权

US07482063B2 Molded object obtained by in-mold coating and process for producing the same 失效
标题翻译：通过模内涂布获得的成型体及其制造方法
公开(公告)号：US07482063B2
公开(公告)日：2009-01-27
申请号：US10525383
申请日：2003-08-21
申请人： Takeshi Minoda , Yuichi Matsuda , Kaoru Yorita , Kenji Yonemochi , Kenji Oota , Etsuo Okahara , Toshio Arai
发明人： Takeshi Minoda , Yuichi Matsuda , Kaoru Yorita , Kenji Yonemochi , Kenji Oota , Etsuo Okahara , Toshio Arai
IPC分类号： B32B25/04 , B32B27/26 , B32B27/30 , B32B27/32 , B32B37/10
CPC分类号： B29C37/0028 , B29C45/1679 , C08J5/00 , Y10T428/31855 , Y10T428/31909 , Y10T428/31913 , Y10T428/31928 , Y10T428/31935 , Y10T428/31938
摘要： An in-mold coating molded article is obtained by coating the surface of a resin molded product comprising a hydroxyl group-containing polypropylene resin composition (A) with a paint composition for in-mold coating, wherein the composition (A) comprises a polypropylene resin (i), an additive rubber (ii) and optionally a polymer compound (iii) other than the polypropylene resin (i) and the additive rubber (ii), the total hydroxyl value of the polypropylene resin (i), the additive rubber (ii) and the optional polymer compound (iii) is from 1 to 40, the composition (A) has a rubber component content (total of the amount of the additive rubber (ii) and the amount of components soluble in n-decane at 23° C. of the polypropylene resin (i) and the optional polymer compound (iii)) of from 15 to 80% by mass based on 100% by mass of the total amount of the rubber component and the resin component other than the rubber component, the paint composition comprises a vehicle component comprising 10 to 70% by mass of an oligomer having at least two (meth)acrylate groups and 90 to 30% by mass of an ethylenically unsaturated monomer copolymerizable with the oligomer, a (meth)acryl modified chlorinated polyolefin having a chlorine content of from 2 to 40% by mass, an organic peroxide polymerization initiator, and a polyisocyanate compound.
摘要翻译：通过将包含含羟基的聚丙烯树脂组合物（A）的树脂成型体的表面与用于模内涂布的涂料组合物进行涂布而获得模内涂布成型体，其中，组合物（A）含有聚丙烯树脂（i），除了聚丙烯树脂（i）和添加剂橡胶（ii）以外的添加剂橡胶（ii）和任选的高分子化合物（iii），聚丙烯树脂（i），添加剂橡胶 ii）和任选的聚合物化合物（iii）为1至40，组合物（A）的橡胶组分含量（添加剂橡胶（ii）的总量）和可溶于正癸烷的组分的量在23 相对于橡胶成分和除了橡胶成分以外的树脂成分的总量的100质量％，聚丙烯树脂（i）和任选的高分子化合物（iii）的含量为15〜80质量％，所述涂料组合物包含包含10的载体组分至70质量％的具有至少两个（甲基）丙烯酸酯基的低聚物和90〜30质量％的可与低聚物共聚的烯键式不饱和单体，具有氯含量为2〜（甲基）丙烯酸改性氯化聚烯烃 40质量％，有机过氧化物聚合引发剂和多异氰酸酯化合物。

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