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1. 发明申请

US20130076575A1 PORTABLE ELECTRONIC APPARATUS WITH ANTENNA STRUCTURE 审中-公开
标题翻译：具有天线结构的便携式电子设备
公开(公告)号：US20130076575A1
公开(公告)日：2013-03-28
申请号：US13334067
申请日：2011-12-22
申请人： Ching-Chia Mai , Chih-Ching Hsu , Cheng-Han Lee , Yuan-Chin Hsu
发明人： Ching-Chia Mai , Chih-Ching Hsu , Cheng-Han Lee , Yuan-Chin Hsu
IPC分类号： H01Q1/24
CPC分类号： H01Q1/52 , H01Q1/243
摘要： A portable electronic apparatus with antenna structure is disclosed. The portable electronic apparatus includes an apparatus casing, an antenna structure, and an electronic component. The apparatus casing has an accommodating space and an appearance casing. The antenna structure is disposed adjacent to the appearance casing. The electronic component is disposed in the accommodating space and leaks electromagnetic wave during operation. Thereby, even though the electronic component leaks electromagnetic wave toward the antenna structure, the invention can reduce the influence on the antenna structure by the leaked electromagnetic wave by disposing the antenna structure as away from the electronic component as possible. Therefore, the antenna structure still can work normally during the operation of the electronic component, which solves the problem that an antenna structure of a conventional portable electronic apparatus is easily interrupted in the range of the leaked electromagnetic wave in the prior art.
摘要翻译：公开了一种具有天线结构的便携式电子设备。便携式电子设备包括装置壳体，天线结构和电子部件。设备壳体具有容纳空间和外观壳体。天线结构设置在外观外壳附近。电子部件设置在容纳空间中，在运转时泄漏电磁波。因此，即使电子部件向天线结构泄漏电磁波，本发明也可以通过将天线结构尽可能远离电子部件来减少由泄露的电磁波对天线结构的影响。因此，在电子部件的动作中，天线结构仍然可以正常工作，这解决了现有技术中传统的便携式电子设备的天线结构在泄漏电磁波的范围内容易中断的问题。

2. 发明授权

US09112265B2 Method for manufacturing antenna structure 有权
标题翻译：制造天线结构的方法
公开(公告)号：US09112265B2
公开(公告)日：2015-08-18
申请号：US13609090
申请日：2012-09-10
申请人： Tzuh-Suan Wang , Yu-Fu Kuo , Yuan-Chin Hsu , Chih-Yung Shih
发明人： Tzuh-Suan Wang , Yu-Fu Kuo , Yuan-Chin Hsu , Chih-Yung Shih
IPC分类号： H01P11/00 , H01Q1/24 , H01Q1/38
CPC分类号： H01Q1/243 , H01Q1/38 , Y10T29/49016
摘要： A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.
摘要翻译：公开了一种用于制造天线结构的方法。采用与催化剂混合并嵌入金属插入物的步骤可以简化制造天线结构的步骤。此外，通过本文公开的方法制造的非导电框架可以表现出防水效果。将上述催化剂与塑料混合，然后注入模具以形成非导电性框架。上述金属插入件在注射塑料的步骤之前设置在模具中。或者，在注塑塑料的步骤之后，将金属插入件嵌入非导电框架中。

3. 发明申请

US20130318778A1 METHOD FOR MANUFACTURING ANTENNA STRUCTURE 有权
标题翻译：制造天线结构的方法
公开(公告)号：US20130318778A1
公开(公告)日：2013-12-05
申请号：US13609090
申请日：2012-09-10
申请人： Tzuh-Suan WANG , Yu-Fu Kuo , Yuan-Chin Hsu , Chih-Yung Shih
发明人： Tzuh-Suan WANG , Yu-Fu Kuo , Yuan-Chin Hsu , Chih-Yung Shih
IPC分类号： H01P11/00
CPC分类号： H01Q1/243 , H01Q1/38 , Y10T29/49016
摘要： A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.
摘要翻译：公开了一种用于制造天线结构的方法。采用与催化剂混合并嵌入金属插入物的步骤可以简化制造天线结构的步骤。此外，通过本文公开的方法制造的非导电框架可以表现出防水效果。将上述催化剂与塑料混合，然后注入模具以形成非导电性框架。上述金属插入件在注射塑料的步骤之前设置在模具中。或者，在注塑塑料的步骤之后，将金属插入件嵌入非导电框架中。

4. 发明授权

US07262078B2 Method of forming a wear-resistant dielectric layer 失效
标题翻译：形成耐磨介电层的方法
公开(公告)号：US07262078B2
公开(公告)日：2007-08-28
申请号：US10906972
申请日：2005-03-15
申请人： Wei-Shun Lai , Shu-Hua Hu , Kuan-Jui Huang , Chin-Chang Pan , Yuan-Chin Hsu
发明人： Wei-Shun Lai , Shu-Hua Hu , Kuan-Jui Huang , Chin-Chang Pan , Yuan-Chin Hsu
IPC分类号： H01L21/44
CPC分类号： B81C1/00365 , B81C2201/0132 , B81C2201/018 , H01L23/3192 , H01L24/11 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05572 , H01L2224/1147 , H01L2224/13006 , H01L2224/13099 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/00014 , H01L2224/05552 , H01L2924/013
摘要： A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.
摘要翻译：提供基板。衬底包括设置在衬底中的多个器件，设置在衬底的表面上并电连接到器件的多个接触焊盘以及位于衬底表面上的表面电介质层。此后，进行至少包括等离子体蚀刻工艺的表面处理工艺。随后，至少进行等离子体增强化学气相沉积（PECVD）工艺以在表面电介质层上形成电介质层。以高频/低频交替方式执行PECVD处理。接着，形成电介质层上的掩模图案，进行各向异性蚀刻处理，以形成对应于电介质层中的接触焊盘的多个开口。这些开口暴露接触垫，并且每个开口具有向外倾斜的侧壁。

5. 发明申请

US20070158829A1 Connecting module having passive components 审中-公开
标题翻译：具有无源元件的连接模块
公开(公告)号：US20070158829A1
公开(公告)日：2007-07-12
申请号：US11434733
申请日：2006-05-17
申请人： Yuan-Chin Hsu , Chen-Hsiung Yang
发明人： Yuan-Chin Hsu , Chen-Hsiung Yang
IPC分类号： H01L23/52 , H01L23/34 , H01L21/00
CPC分类号： H01L23/49811 , H01L23/13 , H01L23/498 , H01L24/48 , H01L24/49 , H01L25/16 , H01L2224/16145 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： The present invention provides a connecting module having at least one passive component including a substrate, a connecting wire layout, at least one passive component and a chip-setting area, wherein the connecting wire layout is formed on the substrate, the passive components are formed on the connecting wire layout to electrically connect to the connecting wire layout. The chip-setting areas are formed in the substrate locating at different areas from the connecting wire layout, wherein the size of the passive components can be adjusted to match the needed impedance, and the numbers and the location of the chip-setting areas can be adjusted dynamically for reducing the dimension of the module.
摘要翻译：本发明提供了一种具有至少一个无源元件的连接模块，包括基板，连接线布局，至少一个无源元件和芯片设置区域，其中连接线布局形成在基板上，形成无源元件在连接线布局上电连接到连接线布局。芯片设置区域形成在位于与连接布线布局不同的区域的基板中，其中可以调节无源部件的尺寸以匹配所需的阻抗，芯片设置区域的数量和位置可以是动态调整以减少模块的尺寸。

6. 发明申请

US20060183259A1 METHOD OF FORMING A WEAR-RESISTANT DIELECTRIC LAYER 失效
标题翻译：形成耐磨介质层的方法
公开(公告)号：US20060183259A1
公开(公告)日：2006-08-17
申请号：US10906972
申请日：2005-03-15
申请人： Wei-Shun Lai , Shu-Hua Hu , Kuan-Jui Huang , Chin-Chang Pan , Yuan-Chin Hsu
发明人： Wei-Shun Lai , Shu-Hua Hu , Kuan-Jui Huang , Chin-Chang Pan , Yuan-Chin Hsu
IPC分类号： H01L21/00
CPC分类号： B81C1/00365 , B81C2201/0132 , B81C2201/018 , H01L23/3192 , H01L24/11 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/05572 , H01L2224/1147 , H01L2224/13006 , H01L2224/13099 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/00014 , H01L2224/05552 , H01L2924/013
摘要： A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.
摘要翻译：提供基板。衬底包括设置在衬底中的多个器件，设置在衬底的表面上并电连接到器件的多个接触焊盘以及位于衬底表面上的表面电介质层。此后，进行至少包括等离子体蚀刻工艺的表面处理工艺。随后，至少进行等离子体增强化学气相沉积（PECVD）工艺以在表面电介质层上形成电介质层。以高频/低频交替方式执行PECVD处理。接着，形成电介质层上的掩模图案，进行各向异性蚀刻处理，以形成对应于电介质层中的接触焊盘的多个开口。这些开口暴露接触垫，并且每个开口具有向外倾斜的侧壁。

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