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    • 9. 发明授权
    • Light emitting display and method of manufacturing the same
    • 发光显示器及其制造方法
    • US08269417B2
    • 2012-09-18
    • US12214350
    • 2008-06-16
    • Young-seo ChoiSeung-yong SongYoung-cheol JooJi-hun RyuOh-june KwonSun-young Jung
    • Young-seo ChoiSeung-yong SongYoung-cheol JooJi-hun RyuOh-june KwonSun-young Jung
    • H01L51/50
    • H01L51/524H01L27/3276H01L2251/566
    • Disclosed are light emitting display and method of manufacturing the same. The light emitting display according to the present embodiments includes a first substrate including a plurality of light emitting devices and a pad portion, all of which are formed therein; a second substrate disposed to face the light emitting devices; and a bonding layer bonded to the light emitting devices and the second substrate, wherein a stepped portion is formed at a predetermined depth in an edge of the second substrate that is adjacent to the pad portion, and the bonding layer is extended to the stepped portion. Since the bonding layer is not bonded to the pad portion due to the depth of the stepped portion when the second substrate is bonded to the first substrate, poor electrical contact may be prevented, and it easy to remove the encapsulation substrate to expose the pad portion. Also, the manufacturing process is simple, the process uniformity is high and the process time is short since the bonding layer is formed in the front of the second substrate.
    • 公开了发光显示器及其制造方法。 根据本实施例的发光显示器包括:第一基板,包括多个发光器件和焊盘部分,所有这些都形成在其中; 设置成面向所述发光器件的第二衬底; 以及粘合到所述发光器件和所述第二基板的接合层,其中在所述第二基板的与所述焊盘部分相邻的边缘中的预定深度处形成阶梯部分,并且所述接合层延伸到所述台阶部分 。 由于当第二基板接合到第一基板时由于阶梯部分的深度而不与焊盘部分接合接合层,所以可以防止差的电接触,并且容易移除封装基板以露出焊盘部分 。 此外,制造工艺简单,由于在第二衬底的前面形成接合层,工艺均匀性高,处理时间短。