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1. 发明申请

US20130105822A1 INTEGRATED SENSING PACKAGE STRUCTURE 有权
标题翻译：集成传感包装结构
公开(公告)号：US20130105822A1
公开(公告)日：2013-05-02
申请号：US13282541
申请日：2011-10-27
申请人： YOU-FA WANG , SIN-HENG LIM , TECK-CHAI GOH , SOON-LEE TAN
发明人： YOU-FA WANG , SIN-HENG LIM , TECK-CHAI GOH , SOON-LEE TAN
IPC分类号： H01L31/12
CPC分类号： H01L31/125 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.
摘要翻译：集成感测封装结构包括由IR阻挡材料制成的衬底。衬底具有在其顶表面上凹入地形成的第一容纳室和第二容纳室。第一容纳室具有形成在其内壁的表面上的反射层。 LED单元设置在第一容纳室的底部。多个第一导线与LED单元电连接并延伸到基板的外表面。 IR感测芯片设置在第二接收室中。多个第二导线与IR感测芯片电连接并延伸到衬底的外表面。 IR块盖覆盖在基板的顶表面上，形成对应于IR感测芯片的至少一个开口。

2. 发明申请

US20130088436A1 LIGHT EMITTING UNIT, MANUFACTURING METHOD THEREOF AND TOUCH PANEL HAVING THE SAME 有权
标题翻译：发光单元及其制造方法及其面板
公开(公告)号：US20130088436A1
公开(公告)日：2013-04-11
申请号：US13269613
申请日：2011-10-09
申请人： YOU-FA WANG
发明人： YOU-FA WANG
IPC分类号： G06F3/041 , F21V5/04 , B32B38/10
CPC分类号： G06F3/0421 , H01L25/0753 , H01L33/58 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.
摘要翻译：发光单元的制造方法如下所示。第一步是提供具有多电路区域的基板。发光二极管分别安装在电路区域上。下一步是形成覆盖发光二极管的封装结构。下一步是切割封装结构以形成双锥形封装结构。包装结构分别在两个方向上切片两次。如上所述，发光单元具有不对称的光辐射图案。

3. 发明授权

US08587103B2 Integrated sensing package structure 有权
标题翻译：集成传感封装结构
公开(公告)号：US08587103B2
公开(公告)日：2013-11-19
申请号：US13282541
申请日：2011-10-27
申请人： You-Fa Wang , Sin-Heng Lim , Teck-Chai Goh , Soon-Lee Tan
发明人： You-Fa Wang , Sin-Heng Lim , Teck-Chai Goh , Soon-Lee Tan
IPC分类号： H01L31/09
CPC分类号： H01L31/125 , H01L25/167 , H01L2924/0002 , H01L2924/00
摘要： An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.
摘要翻译：集成感测封装结构包括由IR阻挡材料制成的衬底。衬底具有在其顶表面上凹入地形成的第一容纳室和第二容纳室。第一容纳室具有形成在其内壁的表面上的反射层。 LED单元设置在第一容纳室的底部。多个第一导线与LED单元电连接并延伸到基板的外表面。 IR感测芯片设置在第二接收室中。多个第二导线与IR感测芯片电连接并延伸到衬底的外表面。 IR块盖覆盖在基板的顶表面上，形成对应于IR感测芯片的至少一个开口。

4. 发明授权

US08303194B2 Transceiver and bi-directional signal transmission system thereof 有权
标题翻译：收发信机和双向信号传输系统
公开(公告)号：US08303194B2
公开(公告)日：2012-11-06
申请号：US12560597
申请日：2009-09-16
申请人： You-Fa Wang , Yun Xu
发明人： You-Fa Wang , Yun Xu
IPC分类号： G02B6/36
CPC分类号： H04B10/40 , G02B6/4201 , G02B6/4206 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/426 , G02B6/4274
摘要： A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.
摘要翻译：收发器包括引线框架，信号发射器，信号接收器和耦合透镜。信号发射器和信号接收器附接在引线框架的同一个焊盘上。耦合透镜覆盖信号发射器和信号接收器。由于信号发射器和信号接收器的位置彼此相邻，所以耦合透镜可用于耦合信号发射器和信号接收器以发送和接收信号。

5. 发明申请

US20110064418A1 TRANSCEIVER AND BI-DIRECTIONAL SIGNAL TRANSMISSION SYSTEM THEREOF 有权
标题翻译：收发器和双向信号传输系统
公开(公告)号：US20110064418A1
公开(公告)日：2011-03-17
申请号：US12560597
申请日：2009-09-16
申请人： You-Fa WANG , Yun XU
发明人： You-Fa WANG , Yun XU
IPC分类号： H04B10/00
CPC分类号： H04B10/40 , G02B6/4201 , G02B6/4206 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/426 , G02B6/4274
摘要： A transceiver includes a lead-frame, a signal emitter, a signal receiver, and a coupling lens. The signal emitter and the signal receiver are attached on a same pad of the lead-frame. The coupling lens covers the signal emitter and the signal receiver. Since the positions of the signal emitter and the signal receiver are adjacent to each other, the coupling lens can be used to couple the signal emitter and the signal receiver for transmitting and receiving signals.
摘要翻译：收发器包括引线框架，信号发射器，信号接收器和耦合透镜。信号发射器和信号接收器附接在引线框架的同一个焊盘上。耦合透镜覆盖信号发射器和信号接收器。由于信号发射器和信号接收器的位置彼此相邻，所以耦合透镜可用于耦合信号发射器和信号接收器以发送和接收信号。

6. 发明授权

US08866765B2 Light emitting unit, manufacturing method thereof and touch panel having the same 有权
标题翻译：发光单元，其制造方法和具有该发光单元的触摸面板
公开(公告)号：US08866765B2
公开(公告)日：2014-10-21
申请号：US13269613
申请日：2011-10-09
申请人： You-Fa Wang
发明人： You-Fa Wang
IPC分类号： G06F3/041 , H01L25/075 , G06F3/042 , H01L33/58
CPC分类号： G06F3/0421 , H01L25/0753 , H01L33/58 , H01L2924/0002 , Y10T156/1052 , H01L2924/00
摘要： A manufacturing method of light emitting units is shown below. First step is providing a substrate with multi circuit areas. A light emitting diode is mounted on the circuit area respectively. Next step is forming a package structure to cover the light emitting diode. Next step is dicing the package structure to form a biconic package structure. The package structure is diced twice in two directions, respectively. As above-mentioned, the light emitting unit has asymmetric light radiation pattern.
摘要翻译：发光单元的制造方法如下所示。第一步是提供具有多电路区域的基板。发光二极管分别安装在电路区域上。下一步是形成封装结构以覆盖发光二极管。下一步是切割封装结构以形成双锥形封装结构。包装结构分别在两个方向上切片两次。如上所述，发光单元具有不对称的光辐射图案。

7. 发明申请

US20130009191A1 SURFACE MOUNTED LED PACKAGE AND MANUFACTURING METHOD THEREFOR 审中-公开
标题翻译：表面安装的LED封装及其制造方法
公开(公告)号：US20130009191A1
公开(公告)日：2013-01-10
申请号：US13175947
申请日：2011-07-04
申请人： You-Fa WANG
发明人： You-Fa WANG
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48227 , H01L2924/3025 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A surface mounted LED package includes an insulated body, a first conductive part, a second conductive part, a LED chip and a bonding wire. The insulated body has a receiving portion and a bond-pad island. The receiving portion is formed with an inner side wall and a flat bottom. The bond-pad island is formed with a bonding plane. The first conductive part has a LED chip and a first solder pin extended to an outer surface of the insulated body. The second conductive part has a second contacting portion and a second solder pin extended to an outer surface of the insulated body. The LED chip is disposed on the second contacting portion. The bonding wire connects the LED chip to the first contacting portion. The present application further provides a manufacturing method for surface mounted LED package.
摘要翻译：表面安装的LED封装包括绝缘体，第一导电部分，第二导电部分，LED芯片和接合线。绝缘体具有接收部分和接合垫岛。接收部形成有内侧壁和平坦的底部。接合焊盘岛形成有接合平面。第一导电部件具有LED芯片和延伸到绝缘体的外表面的第一焊接销。第二导电部件具有延伸到绝缘体的外表面的第二接触部分和第二焊接销。 LED芯片设置在第二接触部分上。接合线将LED芯片连接到第一接触部分。本申请还提供了一种用于表面贴装LED封装的制造方法。

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