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1. 发明授权

US07948059B2 Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate 有权
标题翻译：具有陶瓷基板和表面安装部件的可分割半导体器件集中地密封在陶瓷基板的主表面上
公开(公告)号：US07948059B2
公开(公告)日：2011-05-24
申请号：US11647128
申请日：2006-12-29
申请人： Yoshio Ozeki , Toshiaki Takai , Makoto Ohta , Takahiro Umeyama
发明人： Yoshio Ozeki , Toshiaki Takai , Makoto Ohta , Takahiro Umeyama
IPC分类号： H01L23/544
CPC分类号： H01L21/481 , H01L24/97 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00
摘要： In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” μm, a thickness of the ceramic substrate is set to “b” μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” μm, a relationship of a≧269×c/b+151 is established.
摘要翻译：在包括陶瓷基板，表面安装部件和密封树脂并且通过分割成片而获得的半导体器件中，陶瓷基板由多片基板构成，该多片基板设置有分隔槽，用于在前表面和后表面上分割成片提前，将多个表面安装部件安装在多片基板上并由密封树脂共同密封，并且基板沿着分隔槽分开。此外，当从陶瓷基板的前表面的端部到表面安装部件的端部的最短距离设定为“a”μm时，将陶瓷基板的厚度设定为“b”μm，将陶瓷基板的表面和背面上的分隔槽的深度设定为“c”，建立a≥269×c / b + 151的关系。

2. 发明申请

US20070273022A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070273022A1
公开(公告)日：2007-11-29
申请号：US11647128
申请日：2006-12-29
申请人： Yoshio Ozeki , Toshiaki Takai , Makoto Ohta , Takahiro Umeyama
发明人： Yoshio Ozeki , Toshiaki Takai , Makoto Ohta , Takahiro Umeyama
IPC分类号： H01L23/12
CPC分类号： H01L21/481 , H01L24/97 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00
摘要： In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” μm, a thickness of the ceramic substrate is set to “b” μm, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” μm, a relationship of a≧269×c/b+151 is established.
摘要翻译：在包括陶瓷基板，表面安装部件和密封树脂并且通过分割成片而获得的半导体器件中，陶瓷基板由多片基板构成，该多片基板设置有分隔槽，用于在前表面和后表面上分割成片提前，将多个表面安装部件安装在多片基板上并由密封树脂共同密封，并且基板沿着分隔槽分开。此外，当从陶瓷基板的前表面的端部到表面安装部件的端部的最短距离设定为“a”mum时，陶瓷基板的厚度设定为“b”mum，陶瓷基板的表面和背面上的分隔槽的深度设定为“c”，建立a> = 269×c / b + 151的关系。

3. 发明申请

US20080087802A1 OPTICAL PICKUP DEVICE 审中-公开
标题翻译：光学拾取器件
公开(公告)号：US20080087802A1
公开(公告)日：2008-04-17
申请号：US11843681
申请日：2007-08-23
申请人： YOSHIO OZEKI , Hiroaki Furuichi , Rika Nomura , Kazuyuki Fukuda , Taketoshi Moriyama
发明人： YOSHIO OZEKI , Hiroaki Furuichi , Rika Nomura , Kazuyuki Fukuda , Taketoshi Moriyama
IPC分类号： G02B27/00
CPC分类号： G02B7/025 , G11B7/135 , G11B7/22
摘要： In an optical pickup device, a side surface parallel in the optical axis direction of an optical component is respectively fixed with an adhesive at wall surfaces (internal walls) provided opposing with each other of an accommodation case. In a part of the wall surfaces of the accommodation case, a recessed channel to be filled with the adhesive is formed. The recessed channel is provided with a stepped portion along the optical axis of the optical component at the wall surfaces of the accommodation case. A gap between the relevant side surfaces and the side surface of the optical component is formed to be reduced symmetrically toward both end portions from the center in the optical axis direction of the optical component. Accordingly, bonding strength is never lowered and position of the optical pickup device is stably maintained in an optical system.
摘要翻译：在光学拾取装置中，在光学部件的光轴方向上平行的侧面分别由粘合剂固定在彼此相对设置的容纳壳体的壁面（内壁）上。在容纳壳体的壁面的一部分中，形成要填充有粘合剂的凹陷通道。凹陷通道在容纳壳体的壁表面处沿着光学部件的光轴设置有台阶部分。光学部件的相关侧面和侧面之间的间隙形成为从光学部件的光轴方向的中心向两端部对称地减小。因此，粘合强度不会降低，并且光学拾取装置的位置在光学系统中稳定地保持。

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