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    • 3. 发明申请
    • BALL-TYPE SPEED REDUCER AND ROTARY TABLE DEVICE USING THE SAME
    • 球型减速器和旋转台装置
    • US20110000331A1
    • 2011-01-06
    • US12920646
    • 2009-02-17
    • Yoshio IwaseMasahiro MachidaYoshihiro Machida
    • Yoshio IwaseMasahiro MachidaYoshihiro Machida
    • F16H1/16
    • F16H1/163B23Q2220/004F16H55/10F16H55/24
    • Provided are a ball-type speed reducer and a rotary table device that are capable of performing high-speed rotation and high-rigidity rotation and suitable for reduction in size and weight. An index table 10 includes a ball-type speed reducer 20 and a table 50 that is fixed to an upper surface of a worm wheel 30 of the ball-type speed reducer 20. When the worm gear 22 rotates as the input shaft 24 of the ball-type speed reducer 20 rotates, balls 36 made of a magnetic material move along a ball groove 26 having a spiral shape. The worm wheel 30 rotates as the balls 36 move, and the table 50 rotates. The balls 36 are attracted and held by the permanent magnet 34 on the worm wheel 30 side, so that a case for preventing the balls 36 from coming off the worm wheel 30 can be omitted, whereby the total size and weight can be reduced. Backlash is not required, so that high-speed rotation and high-rigidity rotation are possible.
    • 提供能够进行高速旋转和高刚性旋转的球型减速器和旋转台装置,适合于减小尺寸和重量。 分度表10包括球形减速器20和固定到球型减速器20的蜗轮30的上表面的工作台50.当蜗轮22作为输入轴24旋转时, 球型减速器20旋转,由磁性材料制成的球36沿着具有螺旋形状的球槽26移动。 蜗轮30随着滚珠36移动而旋转,并且台子50旋转。 滚珠36被蜗轮30侧的永久磁铁34吸引并保持,从而可以省略防止滚珠36从蜗轮30脱落的壳体,能够减小总尺寸和重量。 不需要间隙,因此可以进行高速旋转和高刚性旋转。
    • 5. 发明授权
    • Method of manufacturing multilayer wiring board
    • 多层布线板的制造方法
    • US07624501B2
    • 2009-12-01
    • US12068270
    • 2008-02-05
    • Yoshihiro Machida
    • Yoshihiro Machida
    • H05K3/10
    • H05K3/462H05K3/4647H05K2201/10234H05K2203/063H05K2203/0733H05K2203/1327H05K2203/167Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49155Y10T29/49156
    • First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.
    • 首先,以分开的步骤制造多个布线板。 第一布线板包括形成在基板的一个表面上的布线层上的Cu柱和形成在Cu柱周围的期望位置的第一阻挡层。 第二布线板包括用于插入Cu柱的通孔,形成在基板的一个表面上的布线层上的连接端子和与第一阻挡层接合并用于抑制面内未对准的功能的第二阻挡层 。 第三布线板包括形成在基板的一个表面上的布线层上的连接端子。 然后,将布线基板彼此对准地堆叠起来,使得布线层经由铜柱和连接端子互连,从而电连接布线板。 此后,将树脂填充到布线板之间的间隙中。
    • 8. 发明申请
    • Method of manufacturing multilayer wiring board
    • 多层布线板的制造方法
    • US20080184555A1
    • 2008-08-07
    • US12068270
    • 2008-02-05
    • Yoshihiro Machida
    • Yoshihiro Machida
    • H05K3/36
    • H05K3/462H05K3/4647H05K2201/10234H05K2203/063H05K2203/0733H05K2203/1327H05K2203/167Y10T29/49126Y10T29/49128Y10T29/4913Y10T29/49155Y10T29/49156
    • First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.
    • 首先,以分开的步骤制造多个布线板。 第一布线板包括形成在基板的一个表面上的布线层上的Cu柱和形成在Cu柱周围的期望位置的第一阻挡层。 第二布线板包括用于插入Cu柱的通孔,形成在基板的一个表面上的布线层上的连接端子和与第一阻挡层接合并用于抑制面内未对准的功能的第二阻挡层 。 第三布线板包括形成在基板的一个表面上的布线层上的连接端子。 然后,将布线基板彼此对准地堆叠起来,使得布线层经由铜柱和连接端子互连,从而电连接布线板。 此后,将树脂填充到布线板之间的间隙中。