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    • 7. 发明授权
    • High speed probing apparatus for semiconductor devices and probe stage for the same
    • 用于半导体器件和探针台的高速探测装置相同
    • US07986157B1
    • 2011-07-26
    • US12874563
    • 2010-09-02
    • Yong Yu Liu
    • Yong Yu Liu
    • G01R31/20
    • G01R1/07392G01R31/2891
    • A probing apparatus for semiconductor devices includes a housing configured to define a testing chamber, a device holder positioned in the housing and configured to receive at least one device under test, and at least one probe stage positioned in the housing. In one embodiment of the present disclosure, the probe stage includes a base, a retaining arm pivotally coupled with the base and having a retaining portion configured to retain at least one probe, and a stepper positioned on the base. In one embodiment of the present disclosure, the stepper is configured in response to an electric signal to move the probe downward through the retaining arm to contact a device under test and to move the probe upward through the retaining arm to separate from the device under test such that the up-and-down movement of the probe can be performed at relatively high frequency of typically greater than six cycles per second. In one embodiment of the present disclosure, the stepper further equipped with a contact sensor configured to sense the contact of the probe to the device under test.
    • 用于半导体器件的探测装置包括被配置为限定测试室的壳体,位于壳体中并且被配置为容纳至少一个待测器件的器件保持器,以及定位在壳体中的至少一个探针台。 在本公开的一个实施例中,探针台包括基座,保持臂与基座枢转地联接并具有被配置为保持至少一个探针的保持部分和位于基座上的步进器。 在本公开的一个实施例中,步进器被配置为响应于电信号将探针向下移动通过保持臂以接触待测设备并且将探针向上移动通过保持臂以与被测器件分离 使得探针的上下移动可以以通常大于每秒六个周期的相对高的频率执行。 在本公开的一个实施例中,步进器还配备有接触传感器,该接触传感器被配置为感测探针与被测器件的接触。