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1. 发明授权

US09660171B2 Electronic component and acoustic wave device 有权
公开(公告)号：US09660171B2
公开(公告)日：2017-05-23
申请号：US14112208
申请日：2012-04-09
申请人： Yasutaka Ohashi , Masaki Nambu , Yusuke Morimoto , Daisuke Makibuchi , Takanori Ikuta
发明人： Yasutaka Ohashi , Masaki Nambu , Yusuke Morimoto , Daisuke Makibuchi , Takanori Ikuta
IPC分类号： H01L41/053 , H01L41/047 , H03H3/08 , H03H9/05 , H03H9/10
CPC分类号： H01L41/047 , H01L41/053 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81 , H03H3/08 , H03H9/059 , H03H9/1085 , H03H9/1092 , H01L2924/00
摘要： An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

2. 发明申请

US20140191617A1 ACOUSTIC WAVE DEVICE AND ELECTRONIC COMPONENT 有权
标题翻译：声波设备和电子元件
公开(公告)号：US20140191617A1
公开(公告)日：2014-07-10
申请号：US14239768
申请日：2012-08-22
申请人： Yasutaka Ohashi , Satoshi Asai , Masaru Nagata
发明人： Yasutaka Ohashi , Satoshi Asai , Masaru Nagata
IPC分类号： H01L41/047
CPC分类号： H03H9/1092 , H01L41/047 , H01L41/0475 , H01L41/0533 , H03H9/02992 , H03H9/105 , H03H9/171
摘要： An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.
摘要翻译：公开了一种声波装置和电子部件。声波装置包括基板，基板上的激励电极和盖。盖子包括在基板上的框架构件和盖构件。框架构件围绕激励电极并且包括内壁，顶表面和外壁。盖构件设置在顶表面上，并且包括彼此相对的第一和第二表面以及第二表面上的下降部分。第二表面面向衬底。下降部分从第二表面向下延伸，并且覆盖内壁的至少一部分或外壁的至少一部分。电子部件通过导电性接合部件包括安装基板上的声波器件，覆盖该器件的成型树脂。

3. 发明申请

US20140042870A1 ELECTRONIC COMPONENT AND ACOUSTIC WAVE DEVICE 有权
标题翻译：电子元件和声波设备
公开(公告)号：US20140042870A1
公开(公告)日：2014-02-13
申请号：US14112208
申请日：2012-04-09
申请人： Yasutaka Ohashi , Masaki Nambu , Yusuke Morimoto , Daisuke Makibuchi , Takanori Ikuta
发明人： Yasutaka Ohashi , Masaki Nambu , Yusuke Morimoto , Daisuke Makibuchi , Takanori Ikuta
IPC分类号： H01L41/047
CPC分类号： H01L41/047 , H01L41/053 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81 , H03H3/08 , H03H9/059 , H03H9/1085 , H03H9/1092 , H01L2924/00
摘要： An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.
摘要翻译：电子部件具有安装基板，位于安装基板的安装面上的凸块，位于凸块上并连接于凸块的SAW元件。 SAW器件具有元件基板，位于元件基板的第一主表面上的激励电极，位于第一主表面上并连接到激励电极的焊盘，以及位于激励电极上方并形成有焊盘的盖曝光部分在垫上。此外，SAW器件使得盖的顶表面面向安装表面，使得凸块位于焊盘曝光部分中，并使焊盘抵靠凸起。

4. 发明授权

US09548437B2 Acoustic wave device and electronic component 有权
标题翻译：声波装置和电子元件
公开(公告)号：US09548437B2
公开(公告)日：2017-01-17
申请号：US14239768
申请日：2012-08-22
申请人： Yasutaka Ohashi , Satoshi Asai , Masaru Nagata
发明人： Yasutaka Ohashi , Satoshi Asai , Masaru Nagata
IPC分类号： H01L41/047 , H03H9/10 , H01L41/053
CPC分类号： H03H9/1092 , H01L41/047 , H01L41/0475 , H01L41/0533 , H03H9/02992 , H03H9/105 , H03H9/171
摘要： An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.
摘要翻译：公开了一种声波装置和电子部件。声波装置包括基板，基板上的激励电极和盖。盖子包括在基板上的框架构件和盖构件。框架构件围绕激励电极并且包括内壁，顶表面和外壁。盖构件设置在顶表面上，并且包括彼此相对的第一和第二表面以及第二表面上的下降部分。第二表面面向衬底。下降部分从第二表面向下延伸，并且覆盖内壁的至少一部分或外壁的至少一部分。电子部件通过导电性接合部件包括安装基板上的声波器件，覆盖该器件的成型树脂。

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