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    • 2. 发明授权
    • Heat resistant molding resin composition
    • 耐热成型树脂组合物
    • US4340697A
    • 1982-07-20
    • US189841
    • 1980-04-01
    • Toshihiko AyaYasushi Kubo
    • Toshihiko AyaYasushi Kubo
    • C08L77/10C08L79/08H01B3/30C08L81/04
    • H01B3/306C08L77/10C08L79/08Y10S525/905Y10S525/906Y10S525/928Y10S525/93
    • The present invention relates to a heat resistant molding resin composition comprising 60-99.9% by weight of an aromatic polyamideimide resin, and 40-0.1% by weight of a thermoplastic resin which comprises at least one member selected from the group consisting of a polyphenylene sulfide resin, a polyamide resin, a polysulfone resin, an aromatic polyester resin, a polyphenylene-ether resin and a phenoxy resin. The thermoplastic resin must have a melt viscosity at 350.degree. C. of not more than 1.times.10.sup.5 poise and a decomposition temperature of not lower than 350.degree. C. The aromatic polyamideimide resin is improved in melt viscosity characteristics by being blended with the thermoplastic resin. Therefore, a resin composition is obtained which is excellent in moldability characteristics. This composition may optionally comprise various kinds of fillers. Shaped articles, obtained by melt molding of the compositions in accordance with the present invention, are excellent in heat resistance, mechanical characteristics, electrical characteristics, sliding characteristics and solvent resistance characteristics and may be utilized in many different ways.
    • PCT No.PCT / JP79 / 00204 Sec。 371日期:1980年4月1日 102(e)日期1980年4月1日PCT申请日1979年8月2日PCT公布。 公开号WO80 / 00349 1980年3月6日。本发明涉及一种耐热成型树脂组合物,其包含60-99.9重量%的芳族聚酰胺酰亚胺树脂和40-0.1重量%的热塑性树脂,其包含至少一种选自 由聚苯硫醚树脂,聚酰胺树脂,聚砜树脂,芳香族聚酯树脂,聚苯醚树脂和苯氧基树脂组成的组。 热塑性树脂必须在350℃下的熔体粘度不超过1×10 5泊,分解温度不低于350℃。通过与热塑性树脂混合,芳族聚酰胺酰亚胺树脂的熔体粘度特性得到改善。 因此,得到成型性特性优异的树脂组合物。 该组合物可任选地包含各种填料。 通过本发明的组合物的熔融成型获得的成形品具有优异的耐热性,机械性能,电特性,滑动特性和耐溶剂性,并且可以以许多不同的方式使用。